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Global Multilayer Printed Circuit Board Market Research Report 2012-2024

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Table of Contents

    1 Market Overview

    • 1.1 Objectives of Research
      • 1.1.1 Definition
      • 1.1.2 Specifications
    • 1.2 Market Segment
      • 1.2.1 by Type
        • 1.2.1.1 Layer 4-6
        • 1.2.1.2 Layer 8-10
        • 1.2.1.3 Layer 10+
      • 1.2.2 by Application
        • 1.2.2.1 Smart Packaging
        • 1.2.2.2 Smart Cards
        • 1.2.2.3 Consumer Electronics
        • 1.2.2.4 Medical Devices
        • 1.2.2.5 Wearable Devices
        • 1.2.2.6 Entertainment
        • 1.2.2.7 Wireless Communication
        • 1.2.2.8 Others
      • 1.2.3 by Regions

    2 Industry Chain

    • 2.1 Industry Chain Structure
    • 2.2 Upstream
    • 2.3 Market
      • 2.3.1 SWOT
      • 2.3.2 Dynamics

    3 Environmental Analysis

    • 3.1 Policy
    • 3.2 Economic
    • 3.3 Technology
    • 3.4 Market Entry

    4 Market Segmentation by Type

    • 4.1 Market Size
      • 4.1.1 Layer 4-6 Market, 2013-2018
      • 4.1.2 Layer 8-10 Market, 2013-2018
      • 4.1.3 Layer 10+ Market, 2013-2018
    • 4.2 Market Forecast
      • 4.2.1 Layer 4-6 Market Forecast, 2019-2024
      • 4.2.2 Layer 8-10 Market Forecast, 2019-2024
      • 4.2.3 Layer 10+ Market Forecast, 2019-2024

    5 Market Segmentation by Application

    • 5.1 Market Size
      • 5.1.1 Smart Packaging Market, 2013-2018
      • 5.1.2 Smart Cards Market, 2013-2018
      • 5.1.3 Consumer Electronics Market, 2013-2018
      • 5.1.4 Medical Devices Market, 2013-2018
      • 5.1.5 Wearable Devices Market, 2013-2018
      • 5.1.6 Entertainment Market, 2013-2018
      • 5.1.7 Wireless Communication Market, 2013-2018
      • 5.1.8 Others Market, 2013-2018
    • 5.2 Market Forecast
      • 5.2.1 Smart Packaging Market Forecast, 2019-2024
      • 5.2.2 Smart Cards Market Forecast, 2019-2024
      • 5.2.3 Consumer Electronics Market Forecast, 2019-2024
      • 5.2.4 Medical Devices Market Forecast, 2019-2024
      • 5.2.5 Wearable Devices Market Forecast, 2019-2024
      • 5.2.6 Entertainment Market Forecast, 2019-2024
      • 5.2.7 Wireless Communication Market Forecast, 2019-2024
      • 5.2.8 Others Market Forecast, 2019-2024

    6 Market Segmentation by Region

    • 6.1 Market Size
      • 6.1.1 Asia-Pacific
        • 6.1.1.1 Asia-Pacific Market, 2012-2018
        • 6.1.1.2 Asia-Pacific Market by Type
        • 6.1.1.3 Asia-Pacific Market by Application
      • 6.1.2 North America
        • 6.1.2.1 North America Market, 2012-2018
        • 6.1.2.2 North America Market by Type
        • 6.1.2.3 North America Market by Application
      • 6.1.3 Europe
        • 6.1.3.1 Europe Market, 2012-2018
        • 6.1.3.2 Europe Market by Type
        • 6.1.3.3 Europe Market by Application
      • 6.1.4 South America
        • 6.1.4.1 South America Market, 2012-2018
        • 6.1.4.2 South America Market by Type
        • 6.1.4.3 South America Market by Application
      • 6.1.5 Middle East & Africa
        • 6.1.5.1 Middle East & Africa Market, 2012-2018
        • 6.1.5.2 Middle East & Africa Market by Type
        • 6.1.5.3 Middle East & Africa Market by Application
    • 6.2 Market Forecast
      • 6.2.1 Asia-Pacific Market Forecast, 2019-2024
      • 6.2.2 North America Market Forecast, 2019-2024
      • 6.2.3 Europe Market Forecast, 2019-2024
      • 6.2.4 South America Market Forecast, 2019-2024
      • 6.2.5 Middle East & Africa Market Forecast, 2019-2024

    7 Market Competitive

    • 7.1 Global Market by Vendors
    • 7.2 Market Concentration
    • 7.3 Price & Factors
    • 7.4 Marketing Channel

    8 Major Vendors

    • 8.1 Nippon Mektron
    • 8.2 ZD Tech
    • 8.3 TTM Technologies
    • 8.4 Unimicron
    • 8.5 Sumitomo Denko
    • 8.6 Compeq
    • 8.7 Tripod
    • 8.8 Samsung E-M
    • 8.9 Young Poong Group
    • 8.10 HannStar
    • 8.11 Ibiden
    • 8.12 Nanya PCB
    • 8.13 KBC PCB Group
    • 8.14 Daeduck Group
    • 8.15 AT&S
    • 8.16 Fujikura
    • 8.17 Meiko
    • 8.18 Multek
    • 8.19 Kinsus
    • 8.20 Chin Poon
    • 8.21 T.P.T.
    • 8.22 Shinko Denski
    • 8.23 Wus Group
    • 8.24 Simmtech
    • 8.25 Mflex
    • 8.26 LG Innotek
    • 8.27 Gold Circuit
    • 8.28 Shennan Circuit
    • 8.29 Kinwong
    • 8.30 Founder Tech

    9 Conclusion

    Summary
    The global Multilayer Printed Circuit Board market will reach xxx Million USD in 2019 with CAGR xx% 2019-2024. The objective of report is to define, segment, and project the market on the basis of product type, application, and region, and to describe the content about the factors influencing market dynamics, policy, economic, technology and market entry etc.
    Based on products type, the report describes major products type share of regional market. Products mentioned as follows:
    Layer 4-6
    Layer 8-10
    Layer 10+
    Leading vendors in the market are included based on profile, business performance etc. Vendors mentioned as follows:
    Nippon Mektron
    ZD Tech
    TTM Technologies
    Unimicron
    Sumitomo Denko
    Compeq
    Tripod
    Samsung E-M
    Young Poong Group
    HannStar
    Ibiden
    Nanya PCB
    KBC PCB Group
    Daeduck Group
    AT&S
    Fujikura
    Meiko
    Multek
    Kinsus
    Chin Poon
    T.P.T.
    Shinko Denski
    Wus Group
    Simmtech
    Mflex
    LG Innotek
    Gold Circuit
    Shennan Circuit
    Kinwong
    Founder Tech
    Based on Application, the report describes major application share of regional market. Application mentioned as follows:
    Smart Packaging
    Smart Cards
    Consumer Electronics
    Medical Devices
    Wearable Devices
    Entertainment
    Wireless Communication
    Others
    Based on region, the report describes major regions market by products and application. Regions mentioned as follows:
    Asia-Pacific
    North America
    Europe
    South America
    Middle East & Africa

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