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Global Molded Interconnect Devices (MID) Market Professional Survey Report 2019

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Table of Contents

    Executive Summary

      1 Industry Overview of Molded Interconnect Devices (MID)

      • 1.1 Definition of Molded Interconnect Devices (MID)
      • 1.2 Molded Interconnect Devices (MID) Segment by Type
        • 1.2.1 Global Molded Interconnect Devices (MID) Production Growth Rate Comparison by Types (2014-2025)
        • 1.2.2 Laser Direct Structuring (LDS)
        • 1.2.3 Two-Shot Molding
        • 1.2.4 Others
      • 1.3 Molded Interconnect Devices (MID) Segment by Applications
        • 1.3.1 Global Molded Interconnect Devices (MID) Consumption Comparison by Applications (2014-2025)
        • 1.3.2 Automotive
        • 1.3.3 Consumer Products
        • 1.3.4 Healthcare
        • 1.3.5 Industrial
        • 1.3.6 Military & Aerospace
        • 1.3.7 Telecommunication & Computing
      • 1.4 Global Molded Interconnect Devices (MID) Overall Market
        • 1.4.1 Global Molded Interconnect Devices (MID) Revenue (2014-2025)
        • 1.4.2 Global Molded Interconnect Devices (MID) Production (2014-2025)
        • 1.4.3 North America Molded Interconnect Devices (MID) Status and Prospect (2014-2025)
        • 1.4.4 Europe Molded Interconnect Devices (MID) Status and Prospect (2014-2025)
        • 1.4.5 China Molded Interconnect Devices (MID) Status and Prospect (2014-2025)
        • 1.4.6 Japan Molded Interconnect Devices (MID) Status and Prospect (2014-2025)
        • 1.4.7 Southeast Asia Molded Interconnect Devices (MID) Status and Prospect (2014-2025)
        • 1.4.8 India Molded Interconnect Devices (MID) Status and Prospect (2014-2025)

      2 Manufacturing Cost Structure Analysis

      • 2.1 Raw Material and Suppliers
      • 2.2 Manufacturing Cost Structure Analysis of Molded Interconnect Devices (MID)
      • 2.3 Manufacturing Process Analysis of Molded Interconnect Devices (MID)
      • 2.4 Industry Chain Structure of Molded Interconnect Devices (MID)

      3 Development and Manufacturing Plants Analysis of Molded Interconnect Devices (MID)

      • 3.1 Capacity and Commercial Production Date
      • 3.2 Global Molded Interconnect Devices (MID) Manufacturing Plants Distribution
      • 3.3 Major Manufacturers Technology Source and Market Position of Molded Interconnect Devices (MID)
      • 3.4 Recent Development and Expansion Plans

      4 Key Figures of Major Manufacturers

      • 4.1 Molded Interconnect Devices (MID) Production and Capacity Analysis
      • 4.2 Molded Interconnect Devices (MID) Revenue Analysis
      • 4.3 Molded Interconnect Devices (MID) Price Analysis
      • 4.4 Market Concentration Degree

      5 Molded Interconnect Devices (MID) Regional Market Analysis

      • 5.1 Molded Interconnect Devices (MID) Production by Regions
        • 5.1.1 Global Molded Interconnect Devices (MID) Production by Regions
        • 5.1.2 Global Molded Interconnect Devices (MID) Revenue by Regions
      • 5.2 Molded Interconnect Devices (MID) Consumption by Regions
      • 5.3 North America Molded Interconnect Devices (MID) Market Analysis
        • 5.3.1 North America Molded Interconnect Devices (MID) Production
        • 5.3.2 North America Molded Interconnect Devices (MID) Revenue
        • 5.3.3 Key Manufacturers in North America
        • 5.3.4 North America Molded Interconnect Devices (MID) Import and Export
      • 5.4 Europe Molded Interconnect Devices (MID) Market Analysis
        • 5.4.1 Europe Molded Interconnect Devices (MID) Production
        • 5.4.2 Europe Molded Interconnect Devices (MID) Revenue
        • 5.4.3 Key Manufacturers in Europe
        • 5.4.4 Europe Molded Interconnect Devices (MID) Import and Export
      • 5.5 China Molded Interconnect Devices (MID) Market Analysis
        • 5.5.1 China Molded Interconnect Devices (MID) Production
        • 5.5.2 China Molded Interconnect Devices (MID) Revenue
        • 5.5.3 Key Manufacturers in China
        • 5.5.4 China Molded Interconnect Devices (MID) Import and Export
      • 5.6 Japan Molded Interconnect Devices (MID) Market Analysis
        • 5.6.1 Japan Molded Interconnect Devices (MID) Production
        • 5.6.2 Japan Molded Interconnect Devices (MID) Revenue
        • 5.6.3 Key Manufacturers in Japan
        • 5.6.4 Japan Molded Interconnect Devices (MID) Import and Export
      • 5.7 Southeast Asia Molded Interconnect Devices (MID) Market Analysis
        • 5.7.1 Southeast Asia Molded Interconnect Devices (MID) Production
        • 5.7.2 Southeast Asia Molded Interconnect Devices (MID) Revenue
        • 5.7.3 Key Manufacturers in Southeast Asia
        • 5.7.4 Southeast Asia Molded Interconnect Devices (MID) Import and Export
      • 5.8 India Molded Interconnect Devices (MID) Market Analysis
        • 5.8.1 India Molded Interconnect Devices (MID) Production
        • 5.8.2 India Molded Interconnect Devices (MID) Revenue
        • 5.8.3 Key Manufacturers in India
        • 5.8.4 India Molded Interconnect Devices (MID) Import and Export

      6 Molded Interconnect Devices (MID) Segment Market Analysis (by Type)

      • 6.1 Global Molded Interconnect Devices (MID) Production by Type
      • 6.2 Global Molded Interconnect Devices (MID) Revenue by Type
      • 6.3 Molded Interconnect Devices (MID) Price by Type

      7 Molded Interconnect Devices (MID) Segment Market Analysis (by Application)

      • 7.1 Global Molded Interconnect Devices (MID) Consumption by Application
      • 7.2 Global Molded Interconnect Devices (MID) Consumption Market Share by Application (2014-2019)

      8 Molded Interconnect Devices (MID) Major Manufacturers Analysis

      • 8.1 MacDermid Enthone
        • 8.1.1 MacDermid Enthone Molded Interconnect Devices (MID) Production Sites and Area Served
        • 8.1.2 MacDermid Enthone Product Introduction, Application and Specification
        • 8.1.3 MacDermid Enthone Molded Interconnect Devices (MID) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.1.4 Main Business and Markets Served
      • 8.2 Molex
        • 8.2.1 Molex Molded Interconnect Devices (MID) Production Sites and Area Served
        • 8.2.2 Molex Product Introduction, Application and Specification
        • 8.2.3 Molex Molded Interconnect Devices (MID) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.2.4 Main Business and Markets Served
      • 8.3 LPKF Laser & Electronics
        • 8.3.1 LPKF Laser & Electronics Molded Interconnect Devices (MID) Production Sites and Area Served
        • 8.3.2 LPKF Laser & Electronics Product Introduction, Application and Specification
        • 8.3.3 LPKF Laser & Electronics Molded Interconnect Devices (MID) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.3.4 Main Business and Markets Served
      • 8.4 TE Connectivity
        • 8.4.1 TE Connectivity Molded Interconnect Devices (MID) Production Sites and Area Served
        • 8.4.2 TE Connectivity Product Introduction, Application and Specification
        • 8.4.3 TE Connectivity Molded Interconnect Devices (MID) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.4.4 Main Business and Markets Served
      • 8.5 Harting Mitronics AG
        • 8.5.1 Harting Mitronics AG Molded Interconnect Devices (MID) Production Sites and Area Served
        • 8.5.2 Harting Mitronics AG Product Introduction, Application and Specification
        • 8.5.3 Harting Mitronics AG Molded Interconnect Devices (MID) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.5.4 Main Business and Markets Served
      • 8.6 SelectConnect Technologies
        • 8.6.1 SelectConnect Technologies Molded Interconnect Devices (MID) Production Sites and Area Served
        • 8.6.2 SelectConnect Technologies Product Introduction, Application and Specification
        • 8.6.3 SelectConnect Technologies Molded Interconnect Devices (MID) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.6.4 Main Business and Markets Served
      • 8.7 RTP company
        • 8.7.1 RTP company Molded Interconnect Devices (MID) Production Sites and Area Served
        • 8.7.2 RTP company Product Introduction, Application and Specification
        • 8.7.3 RTP company Molded Interconnect Devices (MID) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.7.4 Main Business and Markets Served

      9 Development Trend of Analysis of Molded Interconnect Devices (MID) Market

      • 9.1 Global Molded Interconnect Devices (MID) Market Trend Analysis
        • 9.1.1 Global Molded Interconnect Devices (MID) Market Size (Volume and Value) Forecast 2019-2025
      • 9.2 Molded Interconnect Devices (MID) Regional Market Trend
        • 9.2.1 North America Molded Interconnect Devices (MID) Forecast 2019-2025
        • 9.2.2 Europe Molded Interconnect Devices (MID) Forecast 2019-2025
        • 9.2.3 China Molded Interconnect Devices (MID) Forecast 2019-2025
        • 9.2.4 Japan Molded Interconnect Devices (MID) Forecast 2019-2025
        • 9.2.5 Southeast Asia Molded Interconnect Devices (MID) Forecast 2019-2025
        • 9.2.6 India Molded Interconnect Devices (MID) Forecast 2019-2025
      • 9.3 Molded Interconnect Devices (MID) Market Trend (Product Type)
      • 9.4 Molded Interconnect Devices (MID) Market Trend (Application)
      • 10.1 Marketing Channel
        • 10.1.1 Direct Marketing
        • 10.1.2 Indirect Marketing
      • 10.3 Molded Interconnect Devices (MID) Customers

      11 Market Dynamics

      • 11.1 Market Trends
      • 11.2 Opportunities
      • 11.3 Market Drivers
      • 11.4 Challenges
      • 11.5 Influence Factors

      12 Conclusion

        13 Appendix

        • 13.1 Methodology/Research Approach
          • 13.1.1 Research Programs/Design
          • 13.1.2 Market Size Estimation
          • 13.1.3 Market Breakdown and Data Triangulation
        • 13.2 Data Source
          • 13.2.1 Secondary Sources
          • 13.2.2 Primary Sources
        • 13.3 Author List

        The molded interconnect devices market is likely to exhibit growth over the forecast period owing to frequent technological advancements in telecommunication and consumer product applications. Rising proliferation of smartphones and surge in adoption of smart wearable devices are expected to offer stimulus to the industry growth. MID combines with various other internal parts such as connectors, circuit boards, and cables, among others, improving the circuit density and eliminating various combinations of components as in the case of PCB circuits.

        The global Molded Interconnect Devices (MID) market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
        This report focuses on Molded Interconnect Devices (MID) volume and value at global level, regional level and company level. From a global perspective, this report represents overall Molded Interconnect Devices (MID) market size by analyzing historical data and future prospect.
        Regionally, this report categorizes the production, apparent consumption, export and import of Molded Interconnect Devices (MID) in North America, Europe, China, Japan, Southeast Asia and India.
        For each manufacturer covered, this report analyzes their Molded Interconnect Devices (MID) manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

        The following manufacturers are covered:
        MacDermid Enthone
        Molex
        LPKF Laser & Electronics
        TE Connectivity
        Harting Mitronics AG
        SelectConnect Technologies
        RTP company
        ...

        Segment by Regions
        North America
        Europe
        China
        Japan
        Southeast Asia
        India

        Segment by Type
        Laser Direct Structuring (LDS)
        Two-Shot Molding
        Others

        Segment by Application
        Automotive
        Consumer Products
        Healthcare
        Industrial
        Military & Aerospace
        Telecommunication & Computing

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