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Global Low Temperature Curing Epoxy Powder Encapsulation Material Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

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1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 Flame Retardant
    • 1.3.3 Thermal Conductivity
    • 1.3.4 Others
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 Resistance
    • 1.4.3 Capacitance
    • 1.4.4 Fuse
    • 1.4.5 Others
  • 1.5 Global Low Temperature Curing Epoxy Powder Encapsulation Material Market Size & Forecast
    • 1.5.1 Global Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity (2020-2031)
    • 1.5.3 Global Low Temperature Curing Epoxy Powder Encapsulation Material Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 Pelnox
    • 2.1.1 Pelnox Details
    • 2.1.2 Pelnox Major Business
    • 2.1.3 Pelnox Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
    • 2.1.4 Pelnox Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 Pelnox Recent Developments/Updates
  • 2.2 Sumitomo Bakelite
    • 2.2.1 Sumitomo Bakelite Details
    • 2.2.2 Sumitomo Bakelite Major Business
    • 2.2.3 Sumitomo Bakelite Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
    • 2.2.4 Sumitomo Bakelite Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 Sumitomo Bakelite Recent Developments/Updates
  • 2.3 Chang Chun Group
    • 2.3.1 Chang Chun Group Details
    • 2.3.2 Chang Chun Group Major Business
    • 2.3.3 Chang Chun Group Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
    • 2.3.4 Chang Chun Group Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 Chang Chun Group Recent Developments/Updates
  • 2.4 NanYa Plastic
    • 2.4.1 NanYa Plastic Details
    • 2.4.2 NanYa Plastic Major Business
    • 2.4.3 NanYa Plastic Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
    • 2.4.4 NanYa Plastic Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 NanYa Plastic Recent Developments/Updates
  • 2.5 Akzonobel
    • 2.5.1 Akzonobel Details
    • 2.5.2 Akzonobel Major Business
    • 2.5.3 Akzonobel Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
    • 2.5.4 Akzonobel Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 Akzonobel Recent Developments/Updates
  • 2.6 Sherwin-Williams
    • 2.6.1 Sherwin-Williams Details
    • 2.6.2 Sherwin-Williams Major Business
    • 2.6.3 Sherwin-Williams Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
    • 2.6.4 Sherwin-Williams Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 Sherwin-Williams Recent Developments/Updates
  • 2.7 Kaihua Insulation Materials
    • 2.7.1 Kaihua Insulation Materials Details
    • 2.7.2 Kaihua Insulation Materials Major Business
    • 2.7.3 Kaihua Insulation Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
    • 2.7.4 Kaihua Insulation Materials Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 Kaihua Insulation Materials Recent Developments/Updates
  • 2.8 Daejoo Electronic Materials
    • 2.8.1 Daejoo Electronic Materials Details
    • 2.8.2 Daejoo Electronic Materials Major Business
    • 2.8.3 Daejoo Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
    • 2.8.4 Daejoo Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 Daejoo Electronic Materials Recent Developments/Updates
  • 2.9 Huaxin Electronic Materials
    • 2.9.1 Huaxin Electronic Materials Details
    • 2.9.2 Huaxin Electronic Materials Major Business
    • 2.9.3 Huaxin Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
    • 2.9.4 Huaxin Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 Huaxin Electronic Materials Recent Developments/Updates
  • 2.10 Kanglong Industrial
    • 2.10.1 Kanglong Industrial Details
    • 2.10.2 Kanglong Industrial Major Business
    • 2.10.3 Kanglong Industrial Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
    • 2.10.4 Kanglong Industrial Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 Kanglong Industrial Recent Developments/Updates
  • 2.11 Better Electronics Materials
    • 2.11.1 Better Electronics Materials Details
    • 2.11.2 Better Electronics Materials Major Business
    • 2.11.3 Better Electronics Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
    • 2.11.4 Better Electronics Materials Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.11.5 Better Electronics Materials Recent Developments/Updates
  • 2.12 Pengnuo Huili Electronic Materials
    • 2.12.1 Pengnuo Huili Electronic Materials Details
    • 2.12.2 Pengnuo Huili Electronic Materials Major Business
    • 2.12.3 Pengnuo Huili Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
    • 2.12.4 Pengnuo Huili Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.12.5 Pengnuo Huili Electronic Materials Recent Developments/Updates

3 Competitive Environment: Low Temperature Curing Epoxy Powder Encapsulation Material by Manufacturer

  • 3.1 Global Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global Low Temperature Curing Epoxy Powder Encapsulation Material Revenue by Manufacturer (2020-2025)
  • 3.3 Global Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of Low Temperature Curing Epoxy Powder Encapsulation Material by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 Low Temperature Curing Epoxy Powder Encapsulation Material Manufacturer Market Share in 2024
    • 3.4.3 Top 6 Low Temperature Curing Epoxy Powder Encapsulation Material Manufacturer Market Share in 2024
  • 3.5 Low Temperature Curing Epoxy Powder Encapsulation Material Market: Overall Company Footprint Analysis
    • 3.5.1 Low Temperature Curing Epoxy Powder Encapsulation Material Market: Region Footprint
    • 3.5.2 Low Temperature Curing Epoxy Powder Encapsulation Material Market: Company Product Type Footprint
    • 3.5.3 Low Temperature Curing Epoxy Powder Encapsulation Material Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Low Temperature Curing Epoxy Powder Encapsulation Material Market Size by Region
    • 4.1.1 Global Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Region (2020-2031)
    • 4.1.2 Global Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value by Region (2020-2031)
    • 4.1.3 Global Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Region (2020-2031)
  • 4.2 North America Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value (2020-2031)
  • 4.3 Europe Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value (2020-2031)
  • 4.4 Asia-Pacific Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value (2020-2031)
  • 4.5 South America Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value (2020-2031)
  • 4.6 Middle East & Africa Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value (2020-2031)

5 Market Segment by Type

  • 5.1 Global Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Type (2020-2031)
  • 5.2 Global Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value by Type (2020-2031)
  • 5.3 Global Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Type (2020-2031)

6 Market Segment by Application

  • 6.1 Global Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Application (2020-2031)
  • 6.2 Global Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value by Application (2020-2031)
  • 6.3 Global Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Application (2020-2031)

7 North America

  • 7.1 North America Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Type (2020-2031)
  • 7.2 North America Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Application (2020-2031)
  • 7.3 North America Low Temperature Curing Epoxy Powder Encapsulation Material Market Size by Country
    • 7.3.1 North America Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Country (2020-2031)
    • 7.3.2 North America Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Type (2020-2031)
  • 8.2 Europe Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Application (2020-2031)
  • 8.3 Europe Low Temperature Curing Epoxy Powder Encapsulation Material Market Size by Country
    • 8.3.1 Europe Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Type (2020-2031)
  • 9.2 Asia-Pacific Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific Low Temperature Curing Epoxy Powder Encapsulation Material Market Size by Region
    • 9.3.1 Asia-Pacific Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Type (2020-2031)
  • 10.2 South America Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Application (2020-2031)
  • 10.3 South America Low Temperature Curing Epoxy Powder Encapsulation Material Market Size by Country
    • 10.3.1 South America Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Country (2020-2031)
    • 10.3.2 South America Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Type (2020-2031)
  • 11.2 Middle East & Africa Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa Low Temperature Curing Epoxy Powder Encapsulation Material Market Size by Country
    • 11.3.1 Middle East & Africa Low Temperature Curing Epoxy Powder Encapsulation Material Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 Low Temperature Curing Epoxy Powder Encapsulation Material Market Drivers
  • 12.2 Low Temperature Curing Epoxy Powder Encapsulation Material Market Restraints
  • 12.3 Low Temperature Curing Epoxy Powder Encapsulation Material Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Low Temperature Curing Epoxy Powder Encapsulation Material and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Low Temperature Curing Epoxy Powder Encapsulation Material
  • 13.3 Low Temperature Curing Epoxy Powder Encapsulation Material Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Low Temperature Curing Epoxy Powder Encapsulation Material Typical Distributors
  • 14.3 Low Temperature Curing Epoxy Powder Encapsulation Material Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global Low Temperature Curing Epoxy Powder Encapsulation Material market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR of %during review period.
    In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
    Low-temperature curing epoxy powder encapsulation material is a special epoxy resin material that can be cured at a lower temperature. It is mainly used for the packaging and protection of electronic components. Compared with traditional high temperature curing materials, low temperature curing epoxy powder can be cured between 60-80°C, avoiding the damage of high temperature to heat sensitive components. It has excellent electrical insulation, mechanical strength, chemical corrosion resistance and moisture resistance, and can also remain stable in harsh environments.
    This report is a detailed and comprehensive analysis for global Low Temperature Curing Epoxy Powder Encapsulation Material market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
    Key Features:
    Global Low Temperature Curing Epoxy Powder Encapsulation Material market size and forecasts, in consumption value ($ Million), sales quantity (Kilotons), and average selling prices (US$/Ton), 2020-2031
    Global Low Temperature Curing Epoxy Powder Encapsulation Material market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Kilotons), and average selling prices (US$/Ton), 2020-2031
    Global Low Temperature Curing Epoxy Powder Encapsulation Material market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Kilotons), and average selling prices (US$/Ton), 2020-2031
    Global Low Temperature Curing Epoxy Powder Encapsulation Material market shares of main players, shipments in revenue ($ Million), sales quantity (Kilotons), and ASP (US$/Ton), 2020-2025
    The Primary Objectives in This Report Are:
    To determine the size of the total market opportunity of global and key countries
    To assess the growth potential for Low Temperature Curing Epoxy Powder Encapsulation Material
    To forecast future growth in each product and end-use market
    To assess competitive factors affecting the marketplace
    This report profiles key players in the global Low Temperature Curing Epoxy Powder Encapsulation Material market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Pelnox, Sumitomo Bakelite, Chang Chun Group, NanYa Plastic, Akzonobel, Sherwin-Williams, Kaihua Insulation Materials, Daejoo Electronic Materials, Huaxin Electronic Materials, Kanglong Industrial, etc.
    This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
    Market Segmentation
    Low Temperature Curing Epoxy Powder Encapsulation Material market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
    Market segment by Type
    Flame Retardant
    Thermal Conductivity
    Others
    Market segment by Application
    Resistance
    Capacitance
    Fuse
    Others
    Major players covered
    Pelnox
    Sumitomo Bakelite
    Chang Chun Group
    NanYa Plastic
    Akzonobel
    Sherwin-Williams
    Kaihua Insulation Materials
    Daejoo Electronic Materials
    Huaxin Electronic Materials
    Kanglong Industrial
    Better Electronics Materials
    Pengnuo Huili Electronic Materials
    Market segment by region, regional analysis covers
    North America (United States, Canada, and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 15 chapters:
    Chapter 1, to describe Low Temperature Curing Epoxy Powder Encapsulation Material product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top manufacturers of Low Temperature Curing Epoxy Powder Encapsulation Material, with price, sales quantity, revenue, and global market share of Low Temperature Curing Epoxy Powder Encapsulation Material from 2020 to 2025.
    Chapter 3, the Low Temperature Curing Epoxy Powder Encapsulation Material competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
    Chapter 4, the Low Temperature Curing Epoxy Powder Encapsulation Material breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
    Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
    Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Low Temperature Curing Epoxy Powder Encapsulation Material market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
    Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
    Chapter 13, the key raw materials and key suppliers, and industry chain of Low Temperature Curing Epoxy Powder Encapsulation Material.
    Chapter 14 and 15, to describe Low Temperature Curing Epoxy Powder Encapsulation Material sales channel, distributors, customers, research findings and conclusion.

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