Table of Contents

1 Global Market Overview

• 1.1 Scope of Statistics
  • 1.1.1 Scope of Products
  • 1.1.2 Scope of Manufacturers
  • 1.1.3 Scope of Application
  • 1.1.4 Scope of Type
  • 1.1.5 Scope of Regions/Countries
• 1.2 Global Market Size

2 Regional Market

• 2.1 Regional Production
• 2.2 Regional Demand
• 2.3 Regional Trade

3 Key Manufacturers

• 3.1 Ibiden(JP)
  • 3.1.1 Company Information
  • 3.1.2 Product & Services
  • 3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.1.4 Recent Development
• 3.2 Shinko Electric Industries(JP)
  • 3.2.1 Company Information
  • 3.2.2 Product & Services
  • 3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.2.4 Recent Development
• 3.3 Kyocera(JP)
  • 3.3.1 Company Information
  • 3.3.2 Product & Services
  • 3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.3.4 Recent Development
• 3.4 Eastern(JP)
  • 3.4.1 Company Information
  • 3.4.2 Product & Services
  • 3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.4.4 Recent Development
• 3.5 TTM Technologies(US)
  • 3.5.1 Company Information
  • 3.5.2 Product & Services
  • 3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.5.4 Recent Development
• 3.6 Unimicron(TW)
  • 3.6.1 Company Information
  • 3.6.2 Product & Services
  • 3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.6.4 Recent Development
• 3.7 Kinsus(TW)
  • 3.7.1 Company Information
  • 3.7.2 Product & Services
  • 3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.7.4 Recent Development
• 3.8 Nanya(TW)
  • 3.8.1 Company Information
  • 3.8.2 Product & Services
  • 3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.8.4 Recent Development
• 3.9 ASE(TW)
  • 3.9.1 Company Information
  • 3.9.2 Product & Services
  • 3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.9.4 Recent Development
• 3.10 Semco(KR)
  • 3.10.1 Company Information
  • 3.10.2 Product & Services
  • 3.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.10.4 Recent Development
• 3.11 LG Innotek(KR)
  • 3.11.1 Company Information
  • 3.11.2 Product & Services
  • 3.11.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.11.4 Recent Development
• 3.12 Simmtech(KR)
  • 3.12.1 Company Information
  • 3.12.2 Product & Services
  • 3.12.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.12.4 Recent Development
• 3.13 Daeduck(KR)
  • 3.13.1 Company Information
  • 3.13.2 Product & Services
  • 3.13.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.13.4 Recent Development
• 3.14 KCC(KR)
  • 3.14.1 Company Information
  • 3.14.2 Product & Services
  • 3.14.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.14.4 Recent Development
• 3.15 Zhen Ding Technology(TW)
  • 3.15.1 Company Information
  • 3.15.2 Product & Services
  • 3.15.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.15.4 Recent Development
• 3.16 AT&S (a Austrian company, has IC substrate factories in Chongqing, China)
  • 3.16.1 Company Information
  • 3.16.2 Product & Services
  • 3.16.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.16.4 Recent Development
• 3.17 Shennan Circuit(CN)
  • 3.17.1 Company Information
  • 3.17.2 Product & Services
  • 3.17.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.17.4 Recent Development
• 3.18 ACCESS(CN)
  • 3.18.1 Company Information
  • 3.18.2 Product & Services
  • 3.18.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
• 3.19 Shenzhen Fastprint Circuit Tech(CN)
  • 3.19.1 Company Information
  • 3.19.2 Product & Services
  • 3.19.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)

4 Major Application

• 4.1 PC (Tablet, Laptop)
  • 4.1.1 Overview
  • 4.1.2 PC (Tablet, Laptop) Market Size and Forecast
• 4.2 Smart Phone
  • 4.2.1 Overview
  • 4.2.2 Smart Phone Market Size and Forecast
• 4.3 Wearable Devices
  • 4.3.1 Overview
  • 4.3.2 Wearable Devices Market Size and Forecast
• 4.4 Others
  • 4.4.1 Overview
  • 4.4.2 Others Market Size and Forecast

5 Market by Type

5.By FC-CSP

• 5.1 FC-CSP
  • 5.1.1 Overview
  • 5.1.2 FC-CSP Market Size and Forecast
• 5.2 FC-BGA
  • 5.2.1 Overview
  • 5.2.2 FC-BGA Market Size and Forecast
• 5.3 CSP
  • 5.3.1 Overview
  • 5.3.2 CSP Market Size and Forecast
• 5.4 BGA
  • 5.4.1 Overview
  • 5.4.2 BGA Market Size and Forecast

6 Price Overview

• 6.1 Price by Manufacturers
• 6.2 Price by Application
• 6.3 Price by Type

7 Conclusion

Summary
IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.
The global IC-Substrate market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including:
Global market size and forecast
Regional market size, production data and export & import
Key manufacturers profile, products & services, sales data of business
Global market size by Major Application
Global market size by Major Type
Key manufacturers are included based on company profile, sales data and product specifications etc.:
Ibiden(JP)
Shinko Electric Industries(JP)
Kyocera(JP)
Eastern(JP)
TTM Technologies(US)
Unimicron(TW)
Kinsus(TW)
Nanya(TW)
ASE(TW)
Semco(KR)
LG Innotek(KR)
Simmtech(KR)
Daeduck(KR)
KCC(KR)
Zhen Ding Technology(TW)
AT&S (a Austrian company, has IC substrate factories in Chongqing, China)
Shennan Circuit(CN)
ACCESS(CN)
Shenzhen Fastprint Circuit Tech(CN)
Major applications as follows:
PC (Tablet, Laptop)
Smart Phone
Wearable Devices
Others
Major Type as follows:
FC-CSP
FC-BGA
CSP
BGA
Regional market size, production data and export & import:
Asia-Pacific
North America
Europe
South America
Middle East & Africa