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Global IC Packaging Market Insights, Forecast to 2025

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Table of Contents

    1 Study Coverage

    • 1.1 IC Packaging Product
    • 1.2 Key Market Segments in This Study
    • 1.3 Key Manufacturers Covered
    • 1.4 Market by Type
      • 1.4.1 Global IC Packaging Market Size Growth Rate by Type
      • 1.4.2 DIP
      • 1.4.3 SOP
      • 1.4.4 QFP
      • 1.4.5 QFN
      • 1.4.6 BGA
      • 1.4.7 CSP
      • 1.4.8 LGA
      • 1.4.9 WLP
      • 1.4.10 FC
      • 1.4.11 Others
    • 1.5 Market by Application
      • 1.5.1 Global IC Packaging Market Size Growth Rate by Application
      • 1.5.2 CIS
      • 1.5.3 MEMS
      • 1.5.4 Others
    • 1.6 Study Objectives
    • 1.7 Years Considered

    2 Executive Summary

    • 2.1 Global IC Packaging Market Size
      • 2.1.1 Global IC Packaging Revenue 2014-2025
      • 2.1.2 Global IC Packaging Production 2014-2025
    • 2.2 IC Packaging Growth Rate (CAGR) 2019-2025
    • 2.3 Analysis of Competitive Landscape
      • 2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
      • 2.3.2 Key IC Packaging Manufacturers
        • 2.3.2.1 IC Packaging Manufacturing Base Distribution, Headquarters
        • 2.3.2.2 Manufacturers IC Packaging Product Offered
        • 2.3.2.3 Date of Manufacturers Enter into IC Packaging Market
    • 2.4 Key Trends for IC Packaging Markets & Products

    3 Market Size by Manufacturers

    • 3.1 IC Packaging Production by Manufacturers
      • 3.1.1 IC Packaging Production by Manufacturers
      • 3.1.2 IC Packaging Production Market Share by Manufacturers
    • 3.2 IC Packaging Revenue by Manufacturers
      • 3.2.1 IC Packaging Revenue by Manufacturers (2014-2019)
      • 3.2.2 IC Packaging Revenue Share by Manufacturers (2014-2019)
    • 3.3 IC Packaging Price by Manufacturers
    • 3.4 Mergers & Acquisitions, Expansion Plans

    4 IC Packaging Production by Regions

    • 4.1 Global IC Packaging Production by Regions
      • 4.1.1 Global IC Packaging Production Market Share by Regions
      • 4.1.2 Global IC Packaging Revenue Market Share by Regions
    • 4.2 United States
      • 4.2.1 United States IC Packaging Production
      • 4.2.2 United States IC Packaging Revenue
      • 4.2.3 Key Players in United States
      • 4.2.4 United States IC Packaging Import & Export
    • 4.3 Europe
      • 4.3.1 Europe IC Packaging Production
      • 4.3.2 Europe IC Packaging Revenue
      • 4.3.3 Key Players in Europe
      • 4.3.4 Europe IC Packaging Import & Export
    • 4.4 China
      • 4.4.1 China IC Packaging Production
      • 4.4.2 China IC Packaging Revenue
      • 4.4.3 Key Players in China
      • 4.4.4 China IC Packaging Import & Export
    • 4.5 Japan
      • 4.5.1 Japan IC Packaging Production
      • 4.5.2 Japan IC Packaging Revenue
      • 4.5.3 Key Players in Japan
      • 4.5.4 Japan IC Packaging Import & Export
    • 4.6 South Korea
      • 4.6.1 South Korea IC Packaging Production
      • 4.6.2 South Korea IC Packaging Revenue
      • 4.6.3 Key Players in South Korea
      • 4.6.4 South Korea IC Packaging Import & Export
    • 4.7 Other Regions
      • 4.7.1 Taiwan
      • 4.7.2 India
      • 4.7.3 Southeast Asia

    5 IC Packaging Consumption by Regions

    • 5.1 Global IC Packaging Consumption by Regions
      • 5.1.1 Global IC Packaging Consumption by Regions
      • 5.1.2 Global IC Packaging Consumption Market Share by Regions
    • 5.2 North America
      • 5.2.1 North America IC Packaging Consumption by Application
      • 5.2.2 North America IC Packaging Consumption by Countries
      • 5.2.3 United States
      • 5.2.4 Canada
      • 5.2.5 Mexico
    • 5.3 Europe
      • 5.3.1 Europe IC Packaging Consumption by Application
      • 5.3.2 Europe IC Packaging Consumption by Countries
      • 5.3.3 Germany
      • 5.3.4 France
      • 5.3.5 UK
      • 5.3.6 Italy
      • 5.3.7 Russia
    • 5.4 Asia Pacific
      • 5.4.1 Asia Pacific IC Packaging Consumption by Application
      • 5.4.2 Asia Pacific IC Packaging Consumption by Countries
      • 5.4.3 China
      • 5.4.4 Japan
      • 5.4.5 South Korea
      • 5.4.6 India
      • 5.4.7 Australia
      • 5.4.8 Indonesia
      • 5.4.9 Thailand
      • 5.4.10 Malaysia
      • 5.4.11 Philippines
      • 5.4.12 Vietnam
    • 5.5 Central & South America
      • 5.5.1 Central & South America IC Packaging Consumption by Application
      • 5.5.2 Central & South America IC Packaging Consumption by Country
      • 5.5.3 Brazil
    • 5.6 Middle East and Africa
      • 5.6.1 Middle East and Africa IC Packaging Consumption by Application
      • 5.6.2 Middle East and Africa IC Packaging Consumption by Countries
      • 5.6.3 GCC Countries
      • 5.6.4 Egypt
      • 5.6.5 South Africa

    6 Market Size by Type

    • 6.1 Global IC Packaging Production by Type
    • 6.2 Global IC Packaging Revenue by Type
    • 6.3 IC Packaging Price by Type

    7 Market Size by Application

    • 7.1 Overview
    • 7.2 Global IC Packaging Breakdown Dada by Application
      • 7.2.1 Global IC Packaging Consumption by Application
      • 7.2.2 Global IC Packaging Consumption Market Share by Application (2014-2019)

    8 Manufacturers Profiles

    • 8.1 ASE
      • 8.1.1 ASE Company Details
      • 8.1.2 Company Overview
      • 8.1.3 ASE IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.1.4 ASE IC Packaging Product Description
      • 8.1.5 ASE Recent Development
    • 8.2 Amkor
      • 8.2.1 Amkor Company Details
      • 8.2.2 Company Overview
      • 8.2.3 Amkor IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.2.4 Amkor IC Packaging Product Description
      • 8.2.5 Amkor Recent Development
    • 8.3 SPIL
      • 8.3.1 SPIL Company Details
      • 8.3.2 Company Overview
      • 8.3.3 SPIL IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.3.4 SPIL IC Packaging Product Description
      • 8.3.5 SPIL Recent Development
    • 8.4 STATS ChipPac
      • 8.4.1 STATS ChipPac Company Details
      • 8.4.2 Company Overview
      • 8.4.3 STATS ChipPac IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.4.4 STATS ChipPac IC Packaging Product Description
      • 8.4.5 STATS ChipPac Recent Development
    • 8.5 Powertech Technology
      • 8.5.1 Powertech Technology Company Details
      • 8.5.2 Company Overview
      • 8.5.3 Powertech Technology IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.5.4 Powertech Technology IC Packaging Product Description
      • 8.5.5 Powertech Technology Recent Development
    • 8.6 J-devices
      • 8.6.1 J-devices Company Details
      • 8.6.2 Company Overview
      • 8.6.3 J-devices IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.6.4 J-devices IC Packaging Product Description
      • 8.6.5 J-devices Recent Development
    • 8.7 UTAC
      • 8.7.1 UTAC Company Details
      • 8.7.2 Company Overview
      • 8.7.3 UTAC IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.7.4 UTAC IC Packaging Product Description
      • 8.7.5 UTAC Recent Development
    • 8.8 JECT
      • 8.8.1 JECT Company Details
      • 8.8.2 Company Overview
      • 8.8.3 JECT IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.8.4 JECT IC Packaging Product Description
      • 8.8.5 JECT Recent Development
    • 8.9 ChipMOS
      • 8.9.1 ChipMOS Company Details
      • 8.9.2 Company Overview
      • 8.9.3 ChipMOS IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.9.4 ChipMOS IC Packaging Product Description
      • 8.9.5 ChipMOS Recent Development
    • 8.10 Chipbond
      • 8.10.1 Chipbond Company Details
      • 8.10.2 Company Overview
      • 8.10.3 Chipbond IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.10.4 Chipbond IC Packaging Product Description
      • 8.10.5 Chipbond Recent Development

    9 Production Forecasts

    • 9.1 IC Packaging Production and Revenue Forecast
      • 9.1.1 Global IC Packaging Production Forecast 2019-2025
      • 9.1.2 Global IC Packaging Revenue Forecast 2019-2025
    • 9.2 IC Packaging Production and Revenue Forecast by Regions
      • 9.2.1 Global IC Packaging Revenue Forecast by Regions
      • 9.2.2 Global IC Packaging Production Forecast by Regions
    • 9.3 IC Packaging Key Producers Forecast
      • 9.3.1 United States
      • 9.3.2 Europe
      • 9.3.3 China
      • 9.3.4 Japan
      • 9.3.5 South Korea
    • 9.4 Forecast by Type
      • 9.4.1 Global IC Packaging Production Forecast by Type
      • 9.4.2 Global IC Packaging Revenue Forecast by Type

    10 Consumption Forecast

    • 10.1 IC Packaging Consumption Forecast by Application
    • 10.2 IC Packaging Consumption Forecast by Regions
    • 10.3 North America Market Consumption Forecast
      • 10.3.1 North America IC Packaging Consumption Forecast by Regions 2019-2025
      • 10.3.2 United States
      • 10.3.3 Canada
      • 10.3.4 Mexico
    • 10.4 Europe Market Consumption Forecast
      • 10.4.1 Europe IC Packaging Consumption Forecast by Regions 2019-2025
      • 10.4.2 Germany
      • 10.4.3 France
      • 10.4.4 UK
      • 10.4.5 Italy
      • 10.4.6 Russia
    • 10.5 Asia Pacific Market Consumption Forecast
      • 10.5.1 Asia Pacific IC Packaging Consumption Forecast by Regions 2019-2025
      • 10.5.2 China
      • 10.5.3 Japan
      • 10.5.4 South Korea
      • 10.5.5 India
      • 10.5.6 Australia
      • 10.5.7 Indonesia
      • 10.5.8 Thailand
      • 10.5.9 Malaysia
      • 10.5.10 Philippines
      • 10.5.11 Vietnam
    • 10.6 Central & South America Market Consumption Forecast
      • 10.6.1 Central & South America IC Packaging Consumption Forecast by Regions 2019-2025
      • 10.6.2 Brazil
    • 10.7 Middle East and Africa Market Consumption Forecast
      • 10.7.1 Middle East and Africa IC Packaging Consumption Forecast by Regions 2019-2025
      • 10.7.2 GCC Countries
      • 10.7.3 Egypt
      • 10.7.4 South Africa

    11 Value Chain and Sales Channels Analysis

    • 11.1 Value Chain Analysis
    • 11.2 Sales Channels Analysis
      • 11.2.1 IC Packaging Sales Channels
      • 11.2.2 IC Packaging Distributors
    • 11.3 IC Packaging Customers

    12 Market Opportunities & Challenges, Risks and Influences Factors Analysis

    • 12.1 Market Opportunities and Drivers
    • 12.2 Market Challenges
    • 12.3 Market Risks/Restraints

    13 Key Findings in the Global IC Packaging Study

      14 Appendix

      • 14.1 Research Methodology
        • 14.1.1 Methodology/Research Approach
          • 14.1.1.1 Research Programs/Design
          • 14.1.1.2 Market Size Estimation
          • 14.1.1.3 Market Breakdown and Data Triangulation
        • 14.1.2 Data Source
          • 14.1.2.1 Secondary Sources
          • 14.1.2.2 Primary Sources
      • 14.2 Author Details

      IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.
      This industry is affected by the economy and policy, so it’s important to put an eye to economic indexes and leaders’ prefer. With the global economic recovery, more and more people pay attention to rising environment standards, especially in underdevelopment regions that have a large population and fast economic growth, the need will increase.
      The industry is a high-technology and high-profit industry, the research team maintain a very optimistic attitude. It is suggested that the new enterprises to enter the field.
      We tend to believe this industry now is close to mature, and the consumption increasing degree will show a smooth curve. On product prices, the slow downward trend in recent years will maintain in the future, as competition intensifies, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
      The IC Packaging market was valued at xx Million US$ in 2018 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for IC Packaging.

      This report presents the worldwide IC Packaging market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
      This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

      The following manufacturers are covered in this report:
      ASE
      Amkor
      SPIL
      STATS ChipPac
      Powertech Technology
      J-devices
      UTAC
      JECT
      ChipMOS
      Chipbond

      IC Packaging Breakdown Data by Type
      DIP
      SOP
      QFP
      QFN
      BGA
      CSP
      LGA
      WLP
      FC
      Others
      IC Packaging Breakdown Data by Application
      CIS
      MEMS
      Others

      IC Packaging Production by Region
      United States
      Europe
      China
      Japan
      South Korea
      Other Regions

      IC Packaging Consumption by Region
      North America
      United States
      Canada
      Mexico
      Asia-Pacific
      China
      India
      Japan
      South Korea
      Australia
      Indonesia
      Malaysia
      Philippines
      Thailand
      Vietnam
      Europe
      Germany
      France
      UK
      Italy
      Russia
      Rest of Europe
      Central & South America
      Brazil
      Rest of South America
      Middle East & Africa
      GCC Countries
      Turkey
      Egypt
      South Africa
      Rest of Middle East & Africa

      The study objectives are:
      To analyze and research the global IC Packaging status and future forecast，involving, production, revenue, consumption, historical and forecast.
      To present the key IC Packaging manufacturers, production, revenue, market share, and recent development.
      To split the breakdown data by regions, type, manufacturers and applications.
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions.
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

      In this study, the years considered to estimate the market size of IC Packaging :
      History Year: 2014 - 2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year: 2019 - 2025

      This report includes the estimation of market size for value (million USD) and volume (K Pcs). Both top-down and bottom-up approaches have been used to estimate and validate the market size of IC Packaging market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

      For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

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