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Global IC Packaging and Testing Equipment Market Research Report 2021

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1 IC Packaging and Testing Equipment Market Overview

  • 1.1 Product Overview and Scope of IC Packaging and Testing Equipment
  • 1.2 IC Packaging and Testing Equipment Segment by Type
    • 1.2.1 Global IC Packaging and Testing Equipment Market Size Growth Rate Analysis by Type 2021 VS 2027
    • 1.2.2 IC Packaging Equipment
    • 1.2.3 IC Packaging Testing Equipment
  • 1.3 IC Packaging and Testing Equipment Segment by Application
    • 1.3.1 Global IC Packaging and Testing Equipment Consumption Comparison by Application: 2016 VS 2021 VS 2027
    • 1.3.2 IC
    • 1.3.3 Advanced Packaging
    • 1.3.4 MEMS
    • 1.3.5 LED
  • 1.4 Global Market Growth Prospects
    • 1.4.1 Global IC Packaging and Testing Equipment Revenue Estimates and Forecasts (2016-2027)
    • 1.4.2 Global IC Packaging and Testing Equipment Production Estimates and Forecasts (2016-2027)
  • 1.5 Global IC Packaging and Testing Equipment Market by Region
    • 1.5.1 Global IC Packaging and Testing Equipment Market Size Estimates and Forecasts by Region: 2016 VS 2021 VS 2027
    • 1.5.2 North America IC Packaging and Testing Equipment Estimates and Forecasts (2016-2027)
    • 1.5.3 Europe IC Packaging and Testing Equipment Estimates and Forecasts (2016-2027)
    • 1.5.5 China IC Packaging and Testing Equipment Estimates and Forecasts (2016-2027)
    • 1.5.5 Japan IC Packaging and Testing Equipment Estimates and Forecasts (2016-2027)

2 Market Competition by Manufacturers

  • 2.1 Global IC Packaging and Testing Equipment Production Market Share by Manufacturers (2016-2021)
  • 2.2 Global IC Packaging and Testing Equipment Revenue Market Share by Manufacturers (2016-2021)
  • 2.3 IC Packaging and Testing Equipment Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
  • 2.4 Global IC Packaging and Testing Equipment Average Price by Manufacturers (2016-2021)
  • 2.5 Manufacturers IC Packaging and Testing Equipment Production Sites, Area Served, Product Types
  • 2.6 IC Packaging and Testing Equipment Market Competitive Situation and Trends
    • 2.6.1 IC Packaging and Testing Equipment Market Concentration Rate
    • 2.6.2 Global 5 and 10 Largest IC Packaging and Testing Equipment Players Market Share by Revenue
    • 2.6.3 Mergers & Acquisitions, Expansion

3 Production and Capacity by Region

  • 3.1 Global Production of IC Packaging and Testing Equipment Market Share by Region (2016-2021)
  • 3.2 Global IC Packaging and Testing Equipment Revenue Market Share by Region (2016-2021)
  • 3.3 Global IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.4 North America IC Packaging and Testing Equipment Production
    • 3.4.1 North America IC Packaging and Testing Equipment Production Growth Rate (2016-2021)
    • 3.4.2 North America IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.5 Europe IC Packaging and Testing Equipment Production
    • 3.5.1 Europe IC Packaging and Testing Equipment Production Growth Rate (2016-2021)
    • 3.5.2 Europe IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.6 China IC Packaging and Testing Equipment Production
    • 3.6.1 China IC Packaging and Testing Equipment Production Growth Rate (2016-2021)
    • 3.6.2 China IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.7 Japan IC Packaging and Testing Equipment Production
    • 3.7.1 Japan IC Packaging and Testing Equipment Production Growth Rate (2016-2021)
    • 3.7.2 Japan IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)

4 Global IC Packaging and Testing Equipment Consumption by Region

  • 4.1 Global IC Packaging and Testing Equipment Consumption by Region
    • 4.1.1 Global IC Packaging and Testing Equipment Consumption by Region
    • 4.1.2 Global IC Packaging and Testing Equipment Consumption Market Share by Region
  • 4.2 North America
    • 4.2.1 North America IC Packaging and Testing Equipment Consumption by Country
    • 4.2.2 U.S.
    • 4.2.3 Canada
  • 4.3 Europe
    • 4.3.1 Europe IC Packaging and Testing Equipment Consumption by Country
    • 4.3.2 Germany
    • 4.3.3 France
    • 4.3.4 U.K.
    • 4.3.5 Italy
    • 4.3.6 Russia
  • 4.4 Asia Pacific
    • 4.4.1 Asia Pacific IC Packaging and Testing Equipment Consumption by Region
    • 4.4.2 China
    • 4.4.3 Japan
    • 4.4.4 South Korea
    • 4.4.5 Taiwan
    • 4.4.6 Southeast Asia
    • 4.4.7 India
    • 4.4.8 Australia
  • 4.5 Latin America
    • 4.5.1 Latin America IC Packaging and Testing Equipment Consumption by Country
    • 4.5.2 Mexico
    • 4.5.3 Brazil

5 Production, Revenue, Price Trend by Type

  • 5.1 Global IC Packaging and Testing Equipment Production Market Share by Type (2016-2021)
  • 5.2 Global IC Packaging and Testing Equipment Revenue Market Share by Type (2016-2021)
  • 5.3 Global IC Packaging and Testing Equipment Price by Type (2016-2021)

6 Consumption Analysis by Application

  • 6.1 Global IC Packaging and Testing Equipment Consumption Market Share by Application (2016-2021)
  • 6.2 Global IC Packaging and Testing Equipment Consumption Growth Rate by Application (2016-2021)

7 Key Companies Profiled

  • 7.1 Amkor Technology
    • 7.1.1 Amkor Technology IC Packaging and Testing Equipment Corporation Information
    • 7.1.2 Amkor Technology IC Packaging and Testing Equipment Product Portfolio
    • 7.1.3 Amkor Technology IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.1.4 Amkor Technology Main Business and Markets Served
    • 7.1.5 Amkor Technology Recent Developments/Updates
  • 7.2 UTAC Holdings
    • 7.2.1 UTAC Holdings IC Packaging and Testing Equipment Corporation Information
    • 7.2.2 UTAC Holdings IC Packaging and Testing Equipment Product Portfolio
    • 7.2.3 UTAC Holdings IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.2.4 UTAC Holdings Main Business and Markets Served
    • 7.2.5 UTAC Holdings Recent Developments/Updates
  • 7.3 Nepes
    • 7.3.1 Nepes IC Packaging and Testing Equipment Corporation Information
    • 7.3.2 Nepes IC Packaging and Testing Equipment Product Portfolio
    • 7.3.3 Nepes IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.3.4 Nepes Main Business and Markets Served
    • 7.3.5 Nepes Recent Developments/Updates
  • 7.4 Unisem
    • 7.4.1 Unisem IC Packaging and Testing Equipment Corporation Information
    • 7.4.2 Unisem IC Packaging and Testing Equipment Product Portfolio
    • 7.4.3 Unisem IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.4.4 Unisem Main Business and Markets Served
    • 7.4.5 Unisem Recent Developments/Updates
  • 7.5 JCET Group
    • 7.5.1 JCET Group IC Packaging and Testing Equipment Corporation Information
    • 7.5.2 JCET Group IC Packaging and Testing Equipment Product Portfolio
    • 7.5.3 JCET Group IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.5.4 JCET Group Main Business and Markets Served
    • 7.5.5 JCET Group Recent Developments/Updates
  • 7.6 Siliconware Precision Industries
    • 7.6.1 Siliconware Precision Industries IC Packaging and Testing Equipment Corporation Information
    • 7.6.2 Siliconware Precision Industries IC Packaging and Testing Equipment Product Portfolio
    • 7.6.3 Siliconware Precision Industries IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.6.4 Siliconware Precision Industries Main Business and Markets Served
    • 7.6.5 Siliconware Precision Industries Recent Developments/Updates
  • 7.7 KYEC
    • 7.7.1 KYEC IC Packaging and Testing Equipment Corporation Information
    • 7.7.2 KYEC IC Packaging and Testing Equipment Product Portfolio
    • 7.7.3 KYEC IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.7.4 KYEC Main Business and Markets Served
    • 7.7.5 KYEC Recent Developments/Updates
  • 7.8 TongFu Microelectronics
    • 7.8.1 TongFu Microelectronics IC Packaging and Testing Equipment Corporation Information
    • 7.8.2 TongFu Microelectronics IC Packaging and Testing Equipment Product Portfolio
    • 7.8.3 TongFu Microelectronics IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.8.4 TongFu Microelectronics Main Business and Markets Served
    • 7.7.5 TongFu Microelectronics Recent Developments/Updates
  • 7.9 ITEQ Corporation
    • 7.9.1 ITEQ Corporation IC Packaging and Testing Equipment Corporation Information
    • 7.9.2 ITEQ Corporation IC Packaging and Testing Equipment Product Portfolio
    • 7.9.3 ITEQ Corporation IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.9.4 ITEQ Corporation Main Business and Markets Served
    • 7.9.5 ITEQ Corporation Recent Developments/Updates
  • 7.10 Powertech Technology Inc. (PTI)
    • 7.10.1 Powertech Technology Inc. (PTI) IC Packaging and Testing Equipment Corporation Information
    • 7.10.2 Powertech Technology Inc. (PTI) IC Packaging and Testing Equipment Product Portfolio
    • 7.10.3 Powertech Technology Inc. (PTI) IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.10.4 Powertech Technology Inc. (PTI) Main Business and Markets Served
    • 7.10.5 Powertech Technology Inc. (PTI) Recent Developments/Updates
  • 7.11 TSHT
    • 7.11.1 TSHT IC Packaging and Testing Equipment Corporation Information
    • 7.11.2 TSHT IC Packaging and Testing Equipment Product Portfolio
    • 7.11.3 TSHT IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.11.4 TSHT Main Business and Markets Served
    • 7.11.5 TSHT Recent Developments/Updates
  • 7.12 Chipbond Technology
    • 7.12.1 Chipbond Technology IC Packaging and Testing Equipment Corporation Information
    • 7.12.2 Chipbond Technology IC Packaging and Testing Equipment Product Portfolio
    • 7.12.3 Chipbond Technology IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.12.4 Chipbond Technology Main Business and Markets Served
    • 7.12.5 Chipbond Technology Recent Developments/Updates
  • 7.13 LCSP
    • 7.13.1 LCSP IC Packaging and Testing Equipment Corporation Information
    • 7.13.2 LCSP IC Packaging and Testing Equipment Product Portfolio
    • 7.13.3 LCSP IC Packaging and Testing Equipment Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.13.4 LCSP Main Business and Markets Served
    • 7.13.5 LCSP Recent Developments/Updates

8 IC Packaging and Testing Equipment Manufacturing Cost Analysis

  • 8.1 IC Packaging and Testing Equipment Key Raw Materials Analysis
    • 8.1.1 Key Raw Materials
    • 8.1.2 Key Raw Materials Price Trend
    • 8.1.3 Key Suppliers of Raw Materials
  • 8.2 Proportion of Manufacturing Cost Structure
  • 8.3 Manufacturing Process Analysis of IC Packaging and Testing Equipment
  • 8.4 IC Packaging and Testing Equipment Industrial Chain Analysis

9 Marketing Channel, Distributors and Customers

  • 9.1 Marketing Channel
  • 9.2 IC Packaging and Testing Equipment Distributors List
  • 9.3 IC Packaging and Testing Equipment Customers

10 Market Dynamics

  • 10.1 IC Packaging and Testing Equipment Industry Trends
  • 10.2 IC Packaging and Testing Equipment Growth Drivers
  • 10.3 IC Packaging and Testing Equipment Market Challenges
  • 10.4 IC Packaging and Testing Equipment Market Restraints

11 Production and Supply Forecast

  • 11.1 Global Forecasted Production of IC Packaging and Testing Equipment by Region (2022-2027)
  • 11.2 North America IC Packaging and Testing Equipment Production, Revenue Forecast (2022-2027)
  • 11.3 Europe IC Packaging and Testing Equipment Production, Revenue Forecast (2022-2027)
  • 11.4 China IC Packaging and Testing Equipment Production, Revenue Forecast (2022-2027)
  • 11.5 Japan IC Packaging and Testing Equipment Production, Revenue Forecast (2022-2027)

12 Consumption and Demand Forecast

  • 12.1 Global Forecasted Demand Analysis of IC Packaging and Testing Equipment
  • 12.2 North America Forecasted Consumption of IC Packaging and Testing Equipment by Country
  • 12.3 Europe Market Forecasted Consumption of IC Packaging and Testing Equipment by Country
  • 12.4 Asia Pacific Market Forecasted Consumption of IC Packaging and Testing Equipment by Region
  • 12.5 Latin America Forecasted Consumption of IC Packaging and Testing Equipment by Country

13 Forecast by Type and by Application (2022-2027)

  • 13.1 Global Production, Revenue and Price Forecast by Type (2022-2027)
    • 13.1.1 Global Forecasted Production of IC Packaging and Testing Equipment by Type (2022-2027)
    • 13.1.2 Global Forecasted Revenue of IC Packaging and Testing Equipment by Type (2022-2027)
    • 13.1.3 Global Forecasted Price of IC Packaging and Testing Equipment by Type (2022-2027)
  • 13.2 Global Forecasted Consumption of IC Packaging and Testing Equipment by Application (2022-2027)

14 Research Finding and Conclusion

    15 Methodology and Data Source

    • 15.1 Methodology/Research Approach
      • 15.1.1 Research Programs/Design
      • 15.1.2 Market Size Estimation
      • 15.1.3 Market Breakdown and Data Triangulation
    • 15.2 Data Source
      • 15.2.1 Secondary Sources
      • 15.2.2 Primary Sources
    • 15.3 Author List

    The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.

    Segment by Type
    IC Packaging Equipment
    IC Packaging Testing Equipment

    Segment by Application
    IC
    Advanced Packaging
    MEMS
    LED

    By Company
    Amkor Technology
    UTAC Holdings
    Nepes
    Unisem
    JCET Group
    Siliconware Precision Industries
    KYEC
    TongFu Microelectronics
    ITEQ Corporation
    Powertech Technology Inc. (PTI)
    TSHT
    Chipbond Technology
    LCSP

    Production by Region
    North America
    Europe
    China
    Japan

    Consumption by Region
    North America
    U.S.
    Canada
    Europe
    Germany
    France
    U.K.
    Italy
    Russia
    Asia-Pacific
    China
    Japan
    South Korea
    India
    Australia
    Taiwan
    Indonesia
    Thailand
    Malaysia
    Philippines
    Vietnam
    Latin America
    Mexico
    Brazil
    Argentina
    Middle East & Africa
    Turkey
    Saudi Arabia
    U.A.E

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