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Global IC Package Substrates Market Research Report 2021

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1 IC Package Substrates Market Overview

  • 1.1 Product Overview and Scope of IC Package Substrates
  • 1.2 IC Package Substrates Segment by Type
    • 1.2.1 Global IC Package Substrates Market Size Growth Rate Analysis by Type 2021 VS 2027
    • 1.2.2 WB BGA Substrate
    • 1.2.3 WB CSP Substrate
    • 1.2.4 FC BGA Substrate
    • 1.2.5 FC CSP Substrate
    • 1.2.6 Other Types
  • 1.3 IC Package Substrates Segment by Application
    • 1.3.1 Global IC Package Substrates Consumption Comparison by Application: 2016 VS 2021 VS 2027
    • 1.3.2 PC (Tablet, Laptop)
    • 1.3.3 Smart Phone
    • 1.3.4 Wearable Devices (smart watch)
    • 1.3.5 Other Applications
  • 1.4 Global Market Growth Prospects
    • 1.4.1 Global IC Package Substrates Revenue Estimates and Forecasts (2016-2027)
    • 1.4.2 Global IC Package Substrates Production Estimates and Forecasts (2016-2027)
  • 1.5 Global IC Package Substrates Market by Region
    • 1.5.1 Global IC Package Substrates Market Size Estimates and Forecasts by Region: 2016 VS 2021 VS 2027
    • 1.5.2 North America IC Package Substrates Estimates and Forecasts (2016-2027)
    • 1.5.3 Europe IC Package Substrates Estimates and Forecasts (2016-2027)
    • 1.5.5 China IC Package Substrates Estimates and Forecasts (2016-2027)
    • 1.5.5 Japan IC Package Substrates Estimates and Forecasts (2016-2027)
    • 1.5.6 South Korea IC Package Substrates Estimates and Forecasts (2016-2027)
    • 1.5.7 Taiwan IC Package Substrates Estimates and Forecasts (2016-2027)

2 Market Competition by Manufacturers

  • 2.1 Global IC Package Substrates Production Market Share by Manufacturers (2016-2021)
  • 2.2 Global IC Package Substrates Revenue Market Share by Manufacturers (2016-2021)
  • 2.3 IC Package Substrates Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
  • 2.4 Global IC Package Substrates Average Price by Manufacturers (2016-2021)
  • 2.5 Manufacturers IC Package Substrates Production Sites, Area Served, Product Types
  • 2.6 IC Package Substrates Market Competitive Situation and Trends
    • 2.6.1 IC Package Substrates Market Concentration Rate
    • 2.6.2 Global 5 and 10 Largest IC Package Substrates Players Market Share by Revenue
    • 2.6.3 Mergers & Acquisitions, Expansion

3 Production and Capacity by Region

  • 3.1 Global Production of IC Package Substrates Market Share by Region (2016-2021)
  • 3.2 Global IC Package Substrates Revenue Market Share by Region (2016-2021)
  • 3.3 Global IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.4 North America IC Package Substrates Production
    • 3.4.1 North America IC Package Substrates Production Growth Rate (2016-2021)
    • 3.4.2 North America IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.5 Europe IC Package Substrates Production
    • 3.5.1 Europe IC Package Substrates Production Growth Rate (2016-2021)
    • 3.5.2 Europe IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.6 China IC Package Substrates Production
    • 3.6.1 China IC Package Substrates Production Growth Rate (2016-2021)
    • 3.6.2 China IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.7 Japan IC Package Substrates Production
    • 3.7.1 Japan IC Package Substrates Production Growth Rate (2016-2021)
    • 3.7.2 Japan IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.8 South Korea IC Package Substrates Production
    • 3.8.1 South Korea IC Package Substrates Production Growth Rate (2016-2021)
    • 3.8.2 South Korea IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.9 Taiwan IC Package Substrates Production
    • 3.9.1 Taiwan IC Package Substrates Production Growth Rate (2016-2021)
    • 3.9.2 Taiwan IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)

4 Global IC Package Substrates Consumption by Region

  • 4.1 Global IC Package Substrates Consumption by Region
    • 4.1.1 Global IC Package Substrates Consumption by Region
    • 4.1.2 Global IC Package Substrates Consumption Market Share by Region
  • 4.2 North America
    • 4.2.1 North America IC Package Substrates Consumption by Country
    • 4.2.2 U.S.
    • 4.2.3 Canada
  • 4.3 Europe
    • 4.3.1 Europe IC Package Substrates Consumption by Country
    • 4.3.2 Germany
    • 4.3.3 France
    • 4.3.4 U.K.
    • 4.3.5 Italy
    • 4.3.6 Russia
  • 4.4 Asia Pacific
    • 4.4.1 Asia Pacific IC Package Substrates Consumption by Region
    • 4.4.2 China
    • 4.4.3 Japan
    • 4.4.4 South Korea
    • 4.4.5 Taiwan
    • 4.4.6 Southeast Asia
    • 4.4.7 India
    • 4.4.8 Australia
  • 4.5 Latin America
    • 4.5.1 Latin America IC Package Substrates Consumption by Country
    • 4.5.2 Mexico
    • 4.5.3 Brazil

5 Production, Revenue, Price Trend by Type

  • 5.1 Global IC Package Substrates Production Market Share by Type (2016-2021)
  • 5.2 Global IC Package Substrates Revenue Market Share by Type (2016-2021)
  • 5.3 Global IC Package Substrates Price by Type (2016-2021)

6 Consumption Analysis by Application

  • 6.1 Global IC Package Substrates Consumption Market Share by Application (2016-2021)
  • 6.2 Global IC Package Substrates Consumption Growth Rate by Application (2016-2021)

7 Key Companies Profiled

  • 7.1 Ibiden
    • 7.1.1 Ibiden IC Package Substrates Corporation Information
    • 7.1.2 Ibiden IC Package Substrates Product Portfolio
    • 7.1.3 Ibiden IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.1.4 Ibiden Main Business and Markets Served
    • 7.1.5 Ibiden Recent Developments/Updates
  • 7.2 Kyocera
    • 7.2.1 Kyocera IC Package Substrates Corporation Information
    • 7.2.2 Kyocera IC Package Substrates Product Portfolio
    • 7.2.3 Kyocera IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.2.4 Kyocera Main Business and Markets Served
    • 7.2.5 Kyocera Recent Developments/Updates
  • 7.3 ASE Group
    • 7.3.1 ASE Group IC Package Substrates Corporation Information
    • 7.3.2 ASE Group IC Package Substrates Product Portfolio
    • 7.3.3 ASE Group IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.3.4 ASE Group Main Business and Markets Served
    • 7.3.5 ASE Group Recent Developments/Updates
  • 7.4 TTM Technologies
    • 7.4.1 TTM Technologies IC Package Substrates Corporation Information
    • 7.4.2 TTM Technologies IC Package Substrates Product Portfolio
    • 7.4.3 TTM Technologies IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.4.4 TTM Technologies Main Business and Markets Served
    • 7.4.5 TTM Technologies Recent Developments/Updates
  • 7.5 NTK
    • 7.5.1 NTK IC Package Substrates Corporation Information
    • 7.5.2 NTK IC Package Substrates Product Portfolio
    • 7.5.3 NTK IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.5.4 NTK Main Business and Markets Served
    • 7.5.5 NTK Recent Developments/Updates
  • 7.6 Shinko
    • 7.6.1 Shinko IC Package Substrates Corporation Information
    • 7.6.2 Shinko IC Package Substrates Product Portfolio
    • 7.6.3 Shinko IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.6.4 Shinko Main Business and Markets Served
    • 7.6.5 Shinko Recent Developments/Updates
  • 7.7 Fujitsu Global
    • 7.7.1 Fujitsu Global IC Package Substrates Corporation Information
    • 7.7.2 Fujitsu Global IC Package Substrates Product Portfolio
    • 7.7.3 Fujitsu Global IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.7.4 Fujitsu Global Main Business and Markets Served
    • 7.7.5 Fujitsu Global Recent Developments/Updates
  • 7.8 Doosan Electronic
    • 7.8.1 Doosan Electronic IC Package Substrates Corporation Information
    • 7.8.2 Doosan Electronic IC Package Substrates Product Portfolio
    • 7.8.3 Doosan Electronic IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.8.4 Doosan Electronic Main Business and Markets Served
    • 7.7.5 Doosan Electronic Recent Developments/Updates
  • 7.9 Toppan Printing
    • 7.9.1 Toppan Printing IC Package Substrates Corporation Information
    • 7.9.2 Toppan Printing IC Package Substrates Product Portfolio
    • 7.9.3 Toppan Printing IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.9.4 Toppan Printing Main Business and Markets Served
    • 7.9.5 Toppan Printing Recent Developments/Updates
  • 7.10 Unimicron
    • 7.10.1 Unimicron IC Package Substrates Corporation Information
    • 7.10.2 Unimicron IC Package Substrates Product Portfolio
    • 7.10.3 Unimicron IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.10.4 Unimicron Main Business and Markets Served
    • 7.10.5 Unimicron Recent Developments/Updates
  • 7.11 Kinsus
    • 7.11.1 Kinsus IC Package Substrates Corporation Information
    • 7.11.2 Kinsus IC Package Substrates Product Portfolio
    • 7.11.3 Kinsus IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.11.4 Kinsus Main Business and Markets Served
    • 7.11.5 Kinsus Recent Developments/Updates
  • 7.12 Nanya
    • 7.12.1 Nanya IC Package Substrates Corporation Information
    • 7.12.2 Nanya IC Package Substrates Product Portfolio
    • 7.12.3 Nanya IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.12.4 Nanya Main Business and Markets Served
    • 7.12.5 Nanya Recent Developments/Updates
  • 7.13 Semco
    • 7.13.1 Semco IC Package Substrates Corporation Information
    • 7.13.2 Semco IC Package Substrates Product Portfolio
    • 7.13.3 Semco IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.13.4 Semco Main Business and Markets Served
    • 7.13.5 Semco Recent Developments/Updates
  • 7.14 LG Innotek
    • 7.14.1 LG Innotek IC Package Substrates Corporation Information
    • 7.14.2 LG Innotek IC Package Substrates Product Portfolio
    • 7.14.3 LG Innotek IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.14.4 LG Innotek Main Business and Markets Served
    • 7.14.5 LG Innotek Recent Developments/Updates
  • 7.15 Simmtech
    • 7.15.1 Simmtech IC Package Substrates Corporation Information
    • 7.15.2 Simmtech IC Package Substrates Product Portfolio
    • 7.15.3 Simmtech IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.15.4 Simmtech Main Business and Markets Served
    • 7.15.5 Simmtech Recent Developments/Updates
  • 7.16 Daeduck
    • 7.16.1 Daeduck IC Package Substrates Corporation Information
    • 7.16.2 Daeduck IC Package Substrates Product Portfolio
    • 7.16.3 Daeduck IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.16.4 Daeduck Main Business and Markets Served
    • 7.16.5 Daeduck Recent Developments/Updates

8 IC Package Substrates Manufacturing Cost Analysis

  • 8.1 IC Package Substrates Key Raw Materials Analysis
    • 8.1.1 Key Raw Materials
    • 8.1.2 Key Raw Materials Price Trend
    • 8.1.3 Key Suppliers of Raw Materials
  • 8.2 Proportion of Manufacturing Cost Structure
  • 8.3 Manufacturing Process Analysis of IC Package Substrates
  • 8.4 IC Package Substrates Industrial Chain Analysis

9 Marketing Channel, Distributors and Customers

  • 9.1 Marketing Channel
  • 9.2 IC Package Substrates Distributors List
  • 9.3 IC Package Substrates Customers

10 Market Dynamics

  • 10.1 IC Package Substrates Industry Trends
  • 10.2 IC Package Substrates Growth Drivers
  • 10.3 IC Package Substrates Market Challenges
  • 10.4 IC Package Substrates Market Restraints

11 Production and Supply Forecast

  • 11.1 Global Forecasted Production of IC Package Substrates by Region (2022-2027)
  • 11.2 North America IC Package Substrates Production, Revenue Forecast (2022-2027)
  • 11.3 Europe IC Package Substrates Production, Revenue Forecast (2022-2027)
  • 11.4 China IC Package Substrates Production, Revenue Forecast (2022-2027)
  • 11.5 Japan IC Package Substrates Production, Revenue Forecast (2022-2027)
  • 11.6 South Korea IC Package Substrates Production, Revenue Forecast (2022-2027)
  • 11.7 Taiwan IC Package Substrates Production, Revenue Forecast (2022-2027)

12 Consumption and Demand Forecast

  • 12.1 Global Forecasted Demand Analysis of IC Package Substrates
  • 12.2 North America Forecasted Consumption of IC Package Substrates by Country
  • 12.3 Europe Market Forecasted Consumption of IC Package Substrates by Country
  • 12.4 Asia Pacific Market Forecasted Consumption of IC Package Substrates by Region
  • 12.5 Latin America Forecasted Consumption of IC Package Substrates by Country

13 Forecast by Type and by Application (2022-2027)

  • 13.1 Global Production, Revenue and Price Forecast by Type (2022-2027)
    • 13.1.1 Global Forecasted Production of IC Package Substrates by Type (2022-2027)
    • 13.1.2 Global Forecasted Revenue of IC Package Substrates by Type (2022-2027)
    • 13.1.3 Global Forecasted Price of IC Package Substrates by Type (2022-2027)
  • 13.2 Global Forecasted Consumption of IC Package Substrates by Application (2022-2027)

14 Research Finding and Conclusion

    15 Methodology and Data Source

    • 15.1 Methodology/Research Approach
      • 15.1.1 Research Programs/Design
      • 15.1.2 Market Size Estimation
      • 15.1.3 Market Breakdown and Data Triangulation
    • 15.2 Data Source
      • 15.2.1 Secondary Sources
      • 15.2.2 Primary Sources
    • 15.3 Author List

    The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.

    Segment by Type
    WB BGA Substrate
    WB CSP Substrate
    FC BGA Substrate
    FC CSP Substrate
    Other Types

    Segment by Application
    PC (Tablet, Laptop)
    Smart Phone
    Wearable Devices (smart watch)
    Other Applications

    By Company
    Ibiden
    Kyocera
    ASE Group
    TTM Technologies
    NTK
    Shinko
    Fujitsu Global
    Doosan Electronic
    Toppan Printing
    Unimicron
    Kinsus
    Nanya
    Semco
    LG Innotek
    Simmtech
    Daeduck

    Production by Region
    North America
    Europe
    China
    Japan
    South Korea
    Taiwan

    Consumption by Region
    North America
    U.S.
    Canada
    Europe
    Germany
    France
    U.K.
    Italy
    Russia
    Asia-Pacific
    China
    Japan
    South Korea
    India
    Australia
    Taiwan
    Indonesia
    Thailand
    Malaysia
    Philippines
    Vietnam
    Latin America
    Mexico
    Brazil
    Argentina
    Middle East & Africa
    Turkey
    Saudi Arabia
    UAE

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