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Global IC Package Substrate Material Market 2025 by Company, Regions, Type and Application, Forecast to 2031

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1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Classification of IC Package Substrate Material by Type
    • 1.3.1 Overview: Global IC Package Substrate Material Market Size by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 Global IC Package Substrate Material Consumption Value Market Share by Type in 2024
    • 1.3.3 Substrate Resin
    • 1.3.4 Copper Foil
    • 1.3.5 Insulation Materials
    • 1.3.6 Drill
    • 1.3.7 Other
  • 1.4 Global IC Package Substrate Material Market by Application
    • 1.4.1 Overview: Global IC Package Substrate Material Market Size by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 FC-BGA
    • 1.4.3 FC-CSP
    • 1.4.4 WB BGA
    • 1.4.5 WB CSP
    • 1.4.6 RF Module
    • 1.4.7 Other
  • 1.5 Global IC Package Substrate Material Market Size & Forecast
  • 1.6 Global IC Package Substrate Material Market Size and Forecast by Region
    • 1.6.1 Global IC Package Substrate Material Market Size by Region: 2020 VS 2024 VS 2031
    • 1.6.2 Global IC Package Substrate Material Market Size by Region, (2020-2031)
    • 1.6.3 North America IC Package Substrate Material Market Size and Prospect (2020-2031)
    • 1.6.4 Europe IC Package Substrate Material Market Size and Prospect (2020-2031)
    • 1.6.5 Asia-Pacific IC Package Substrate Material Market Size and Prospect (2020-2031)
    • 1.6.6 South America IC Package Substrate Material Market Size and Prospect (2020-2031)
    • 1.6.7 Middle East & Africa IC Package Substrate Material Market Size and Prospect (2020-2031)

2 Company Profiles

  • 2.1 Mitsubishi Gas Chemical
    • 2.1.1 Mitsubishi Gas Chemical Details
    • 2.1.2 Mitsubishi Gas Chemical Major Business
    • 2.1.3 Mitsubishi Gas Chemical IC Package Substrate Material Product and Solutions
    • 2.1.4 Mitsubishi Gas Chemical IC Package Substrate Material Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 Mitsubishi Gas Chemical Recent Developments and Future Plans
  • 2.2 Ajinomoto
    • 2.2.1 Ajinomoto Details
    • 2.2.2 Ajinomoto Major Business
    • 2.2.3 Ajinomoto IC Package Substrate Material Product and Solutions
    • 2.2.4 Ajinomoto IC Package Substrate Material Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 Ajinomoto Recent Developments and Future Plans
  • 2.3 Resonac Corporation
    • 2.3.1 Resonac Corporation Details
    • 2.3.2 Resonac Corporation Major Business
    • 2.3.3 Resonac Corporation IC Package Substrate Material Product and Solutions
    • 2.3.4 Resonac Corporation IC Package Substrate Material Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 Resonac Corporation Recent Developments and Future Plans
  • 2.4 Panasonic
    • 2.4.1 Panasonic Details
    • 2.4.2 Panasonic Major Business
    • 2.4.3 Panasonic IC Package Substrate Material Product and Solutions
    • 2.4.4 Panasonic IC Package Substrate Material Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 Panasonic Recent Developments and Future Plans
  • 2.5 Mitsui Mining & Smelting
    • 2.5.1 Mitsui Mining & Smelting Details
    • 2.5.2 Mitsui Mining & Smelting Major Business
    • 2.5.3 Mitsui Mining & Smelting IC Package Substrate Material Product and Solutions
    • 2.5.4 Mitsui Mining & Smelting IC Package Substrate Material Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 Mitsui Mining & Smelting Recent Developments and Future Plans
  • 2.6 Nan Ya Plastics
    • 2.6.1 Nan Ya Plastics Details
    • 2.6.2 Nan Ya Plastics Major Business
    • 2.6.3 Nan Ya Plastics IC Package Substrate Material Product and Solutions
    • 2.6.4 Nan Ya Plastics IC Package Substrate Material Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 Nan Ya Plastics Recent Developments and Future Plans
  • 2.7 Sumitomo Bakelite
    • 2.7.1 Sumitomo Bakelite Details
    • 2.7.2 Sumitomo Bakelite Major Business
    • 2.7.3 Sumitomo Bakelite IC Package Substrate Material Product and Solutions
    • 2.7.4 Sumitomo Bakelite IC Package Substrate Material Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 Sumitomo Bakelite Recent Developments and Future Plans
  • 2.8 Chang Chun Group
    • 2.8.1 Chang Chun Group Details
    • 2.8.2 Chang Chun Group Major Business
    • 2.8.3 Chang Chun Group IC Package Substrate Material Product and Solutions
    • 2.8.4 Chang Chun Group IC Package Substrate Material Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 Chang Chun Group Recent Developments and Future Plans
  • 2.9 Sekisui Chemical
    • 2.9.1 Sekisui Chemical Details
    • 2.9.2 Sekisui Chemical Major Business
    • 2.9.3 Sekisui Chemical IC Package Substrate Material Product and Solutions
    • 2.9.4 Sekisui Chemical IC Package Substrate Material Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 Sekisui Chemical Recent Developments and Future Plans
  • 2.10 WaferChem Technology
    • 2.10.1 WaferChem Technology Details
    • 2.10.2 WaferChem Technology Major Business
    • 2.10.3 WaferChem Technology IC Package Substrate Material Product and Solutions
    • 2.10.4 WaferChem Technology IC Package Substrate Material Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 WaferChem Technology Recent Developments and Future Plans
  • 2.11 ITEQ
    • 2.11.1 ITEQ Details
    • 2.11.2 ITEQ Major Business
    • 2.11.3 ITEQ IC Package Substrate Material Product and Solutions
    • 2.11.4 ITEQ IC Package Substrate Material Revenue, Gross Margin and Market Share (2020-2025)
    • 2.11.5 ITEQ Recent Developments and Future Plans

3 Market Competition, by Players

  • 3.1 Global IC Package Substrate Material Revenue and Share by Players (2020-2025)
  • 3.2 Market Share Analysis (2024)
    • 3.2.1 Market Share of IC Package Substrate Material by Company Revenue
    • 3.2.2 Top 3 IC Package Substrate Material Players Market Share in 2024
    • 3.2.3 Top 6 IC Package Substrate Material Players Market Share in 2024
  • 3.3 IC Package Substrate Material Market: Overall Company Footprint Analysis
    • 3.3.1 IC Package Substrate Material Market: Region Footprint
    • 3.3.2 IC Package Substrate Material Market: Company Product Type Footprint
    • 3.3.3 IC Package Substrate Material Market: Company Product Application Footprint
  • 3.4 New Market Entrants and Barriers to Market Entry
  • 3.5 Mergers, Acquisition, Agreements, and Collaborations

4 Market Size Segment by Type

  • 4.1 Global IC Package Substrate Material Consumption Value and Market Share by Type (2020-2025)
  • 4.2 Global IC Package Substrate Material Market Forecast by Type (2026-2031)

5 Market Size Segment by Application

  • 5.1 Global IC Package Substrate Material Consumption Value Market Share by Application (2020-2025)
  • 5.2 Global IC Package Substrate Material Market Forecast by Application (2026-2031)

6 North America

  • 6.1 North America IC Package Substrate Material Consumption Value by Type (2020-2031)
  • 6.2 North America IC Package Substrate Material Market Size by Application (2020-2031)
  • 6.3 North America IC Package Substrate Material Market Size by Country
    • 6.3.1 North America IC Package Substrate Material Consumption Value by Country (2020-2031)
    • 6.3.2 United States IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 6.3.3 Canada IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 6.3.4 Mexico IC Package Substrate Material Market Size and Forecast (2020-2031)

7 Europe

  • 7.1 Europe IC Package Substrate Material Consumption Value by Type (2020-2031)
  • 7.2 Europe IC Package Substrate Material Consumption Value by Application (2020-2031)
  • 7.3 Europe IC Package Substrate Material Market Size by Country
    • 7.3.1 Europe IC Package Substrate Material Consumption Value by Country (2020-2031)
    • 7.3.2 Germany IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 7.3.3 France IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 7.3.4 United Kingdom IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 7.3.5 Russia IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 7.3.6 Italy IC Package Substrate Material Market Size and Forecast (2020-2031)

8 Asia-Pacific

  • 8.1 Asia-Pacific IC Package Substrate Material Consumption Value by Type (2020-2031)
  • 8.2 Asia-Pacific IC Package Substrate Material Consumption Value by Application (2020-2031)
  • 8.3 Asia-Pacific IC Package Substrate Material Market Size by Region
    • 8.3.1 Asia-Pacific IC Package Substrate Material Consumption Value by Region (2020-2031)
    • 8.3.2 China IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 8.3.3 Japan IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 8.3.4 South Korea IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 8.3.5 India IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 8.3.6 Southeast Asia IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 8.3.7 Australia IC Package Substrate Material Market Size and Forecast (2020-2031)

9 South America

  • 9.1 South America IC Package Substrate Material Consumption Value by Type (2020-2031)
  • 9.2 South America IC Package Substrate Material Consumption Value by Application (2020-2031)
  • 9.3 South America IC Package Substrate Material Market Size by Country
    • 9.3.1 South America IC Package Substrate Material Consumption Value by Country (2020-2031)
    • 9.3.2 Brazil IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 9.3.3 Argentina IC Package Substrate Material Market Size and Forecast (2020-2031)

10 Middle East & Africa

  • 10.1 Middle East & Africa IC Package Substrate Material Consumption Value by Type (2020-2031)
  • 10.2 Middle East & Africa IC Package Substrate Material Consumption Value by Application (2020-2031)
  • 10.3 Middle East & Africa IC Package Substrate Material Market Size by Country
    • 10.3.1 Middle East & Africa IC Package Substrate Material Consumption Value by Country (2020-2031)
    • 10.3.2 Turkey IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 10.3.3 Saudi Arabia IC Package Substrate Material Market Size and Forecast (2020-2031)
    • 10.3.4 UAE IC Package Substrate Material Market Size and Forecast (2020-2031)

11 Market Dynamics

  • 11.1 IC Package Substrate Material Market Drivers
  • 11.2 IC Package Substrate Material Market Restraints
  • 11.3 IC Package Substrate Material Trends Analysis
  • 11.4 Porters Five Forces Analysis
    • 11.4.1 Threat of New Entrants
    • 11.4.2 Bargaining Power of Suppliers
    • 11.4.3 Bargaining Power of Buyers
    • 11.4.4 Threat of Substitutes
    • 11.4.5 Competitive Rivalry

12 Industry Chain Analysis

  • 12.1 IC Package Substrate Material Industry Chain
  • 12.2 IC Package Substrate Material Upstream Analysis
  • 12.3 IC Package Substrate Material Midstream Analysis
  • 12.4 IC Package Substrate Material Downstream Analysis

13 Research Findings and Conclusion

    14 Appendix

    • 14.1 Methodology
    • 14.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global IC Package Substrate Material market size was valued at US$ 7151 million in 2024 and is forecast to a readjusted size of USD 11900 million by 2031 with a CAGR of 7.5% during review period.
    IC package substrate materials play a crucial role in providing a reliable and efficient electrical connection between the integrated circuit (IC) chip and the rest of the electronic system. The choice of substrate material depends on various factors such as the application, performance requirements, and thermal considerations.
    At the regional level, the Chinese mainland market accounts for about 9% of the world. From the product perspective, substrate resin is currently the most important packaging material, accounting for 41%, and it is expected that it will continue to be the largest type in the future. From the application perspective, FC-BGA is currently the most important application, accounting for 38%.
    At present, global manufacturers are mainly concentrated in the Asia-Pacific region, and China has also developed very rapidly in recent years. Major companies include Ajinomoto, Changchun, Mitsubishi Gas, Nanya Plastics, Showa Denko, Mitsui Metals and Panasonic Electric, etc. The top five companies account for more than 30%. It is expected that industry competition will become more intense in the next few years, especially in the Chinese market.
    IC packaging substrate materials are affected by the following factors: First, the 2019 COVID-19 pandemic swept the world, causing serious impacts on all industries around the world. Although high-tech industries such as semiconductor chips have not been fatally hit, the fluctuations in the macro environment have also indirectly affected the normal development of the semiconductor packaging industry market. Second, with the expansion of Sino-US trade frictions, many Taiwanese and Chinese companies have been affected, and some Chinese semiconductor manufacturers have chosen to build factories in other countries and regions for production. Third, because chips belong to high-tech industries, they require a high level of manufacturing technology. Some countries or companies have mastered the latest technology, but due to some factors, they have not been made public. The existence of technical barriers has restricted the development of the IC packaging substrate material industry. Of course, challenges and opportunities coexist. In recent years, the United States, Europe, Japan and other countries have introduced bills to increase support for their IC packaging substrate materials and related industries, including various grants and subsidy policies. The rise of industries such as 5G/6G, the Internet of Things, and new energy vehicles has increased the demand for chips and greatly promoted the development of the chip industry. In addition, the rapid development of integrated circuits has driven the large-scale expansion of the entire semiconductor industry. Personal computers and smartphones are still important sources of demand for the chip industry, and strong demand is an important factor in the expansion of the chip industry. With the improvement of living standards, people's entertainment needs have been improved. The rise of wearable devices and entertainment devices has further increased the demand for chips. Chip packaging technology has involved various materials, electronics, thermal, mechanics, chemistry, reliability and other disciplines. It is a high-tech industry that is increasingly valued and developed in parallel with integrated circuit chips. With the simultaneous development of design, chip manufacturing and packaging and testing, the importance of packaging in the entire IC industry chain is unquestionable. The proportions are gradually tending towards reasonable and coordinated development, and its importance is increasing.
    This report is a detailed and comprehensive analysis for global IC Package Substrate Material market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
    Key Features:
    Global IC Package Substrate Material market size and forecasts, in consumption value ($ Million), 2020-2031
    Global IC Package Substrate Material market size and forecasts by region and country, in consumption value ($ Million), 2020-2031
    Global IC Package Substrate Material market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031
    Global IC Package Substrate Material market shares of main players, in revenue ($ Million), 2020-2025
    The Primary Objectives in This Report Are:
    To determine the size of the total market opportunity of global and key countries
    To assess the growth potential for IC Package Substrate Material
    To forecast future growth in each product and end-use market
    To assess competitive factors affecting the marketplace
    This report profiles key players in the global IC Package Substrate Material market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsubishi Gas Chemical, Ajinomoto, Resonac Corporation, Panasonic, Mitsui Mining & Smelting, Nan Ya Plastics, Sumitomo Bakelite, Chang Chun Group, Sekisui Chemical, WaferChem Technology, etc.
    This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
    Market segmentation
    IC Package Substrate Material market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
    Market segment by Type
    Substrate Resin
    Copper Foil
    Insulation Materials
    Drill
    Other
    Market segment by Application
    FC-BGA
    FC-CSP
    WB BGA
    WB CSP
    RF Module
    Other
    Market segment by players, this report covers
    Mitsubishi Gas Chemical
    Ajinomoto
    Resonac Corporation
    Panasonic
    Mitsui Mining & Smelting
    Nan Ya Plastics
    Sumitomo Bakelite
    Chang Chun Group
    Sekisui Chemical
    WaferChem Technology
    ITEQ
    Market segment by regions, regional analysis covers
    North America (United States, Canada and Mexico)
    Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
    Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
    South America (Brazil, Rest of South America)
    Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 13 chapters:
    Chapter 1, to describe IC Package Substrate Material product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top players of IC Package Substrate Material, with revenue, gross margin, and global market share of IC Package Substrate Material from 2020 to 2025.
    Chapter 3, the IC Package Substrate Material competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
    Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031
    Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and IC Package Substrate Material market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.
    Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
    Chapter 12, the key raw materials and key suppliers, and industry chain of IC Package Substrate Material.
    Chapter 13, to describe IC Package Substrate Material research findings and conclusion.

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