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Global High Density Interconnect Market Professional Survey Report 2019

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Table of Contents

    Executive Summary

      1 Industry Overview of High Density Interconnect

      • 1.1 Definition of High Density Interconnect
      • 1.2 High Density Interconnect Segment by Type
        • 1.2.1 Global High Density Interconnect Production Growth Rate Comparison by Types (2014-2025)
        • 1.2.2 Single Panel
        • 1.2.3 Double Panel
        • 1.2.4 Others
      • 1.3 High Density Interconnect Segment by Applications
        • 1.3.1 Global High Density Interconnect Consumption Comparison by Applications (2014-2025)
        • 1.3.2 Automotive Electronics
        • 1.3.3 Consumer Electronics
        • 1.3.4 Other Electronic Products
      • 1.4 Global High Density Interconnect Overall Market
        • 1.4.1 Global High Density Interconnect Revenue (2014-2025)
        • 1.4.2 Global High Density Interconnect Production (2014-2025)
        • 1.4.3 North America High Density Interconnect Status and Prospect (2014-2025)
        • 1.4.4 Europe High Density Interconnect Status and Prospect (2014-2025)
        • 1.4.5 China High Density Interconnect Status and Prospect (2014-2025)
        • 1.4.6 Japan High Density Interconnect Status and Prospect (2014-2025)
        • 1.4.7 Southeast Asia High Density Interconnect Status and Prospect (2014-2025)
        • 1.4.8 India High Density Interconnect Status and Prospect (2014-2025)

      2 Manufacturing Cost Structure Analysis

      • 2.1 Raw Material and Suppliers
      • 2.2 Manufacturing Cost Structure Analysis of High Density Interconnect
      • 2.3 Manufacturing Process Analysis of High Density Interconnect
      • 2.4 Industry Chain Structure of High Density Interconnect

      3 Development and Manufacturing Plants Analysis of High Density Interconnect

      • 3.1 Capacity and Commercial Production Date
      • 3.2 Global High Density Interconnect Manufacturing Plants Distribution
      • 3.3 Major Manufacturers Technology Source and Market Position of High Density Interconnect
      • 3.4 Recent Development and Expansion Plans

      4 Key Figures of Major Manufacturers

      • 4.1 High Density Interconnect Production and Capacity Analysis
      • 4.2 High Density Interconnect Revenue Analysis
      • 4.3 High Density Interconnect Price Analysis
      • 4.4 Market Concentration Degree

      5 High Density Interconnect Regional Market Analysis

      • 5.1 High Density Interconnect Production by Regions
        • 5.1.1 Global High Density Interconnect Production by Regions
        • 5.1.2 Global High Density Interconnect Revenue by Regions
      • 5.2 High Density Interconnect Consumption by Regions
      • 5.3 North America High Density Interconnect Market Analysis
        • 5.3.1 North America High Density Interconnect Production
        • 5.3.2 North America High Density Interconnect Revenue
        • 5.3.3 Key Manufacturers in North America
        • 5.3.4 North America High Density Interconnect Import and Export
      • 5.4 Europe High Density Interconnect Market Analysis
        • 5.4.1 Europe High Density Interconnect Production
        • 5.4.2 Europe High Density Interconnect Revenue
        • 5.4.3 Key Manufacturers in Europe
        • 5.4.4 Europe High Density Interconnect Import and Export
      • 5.5 China High Density Interconnect Market Analysis
        • 5.5.1 China High Density Interconnect Production
        • 5.5.2 China High Density Interconnect Revenue
        • 5.5.3 Key Manufacturers in China
        • 5.5.4 China High Density Interconnect Import and Export
      • 5.6 Japan High Density Interconnect Market Analysis
        • 5.6.1 Japan High Density Interconnect Production
        • 5.6.2 Japan High Density Interconnect Revenue
        • 5.6.3 Key Manufacturers in Japan
        • 5.6.4 Japan High Density Interconnect Import and Export
      • 5.7 Southeast Asia High Density Interconnect Market Analysis
        • 5.7.1 Southeast Asia High Density Interconnect Production
        • 5.7.2 Southeast Asia High Density Interconnect Revenue
        • 5.7.3 Key Manufacturers in Southeast Asia
        • 5.7.4 Southeast Asia High Density Interconnect Import and Export
      • 5.8 India High Density Interconnect Market Analysis
        • 5.8.1 India High Density Interconnect Production
        • 5.8.2 India High Density Interconnect Revenue
        • 5.8.3 Key Manufacturers in India
        • 5.8.4 India High Density Interconnect Import and Export

      6 High Density Interconnect Segment Market Analysis (by Type)

      • 6.1 Global High Density Interconnect Production by Type
      • 6.2 Global High Density Interconnect Revenue by Type
      • 6.3 High Density Interconnect Price by Type

      7 High Density Interconnect Segment Market Analysis (by Application)

      • 7.1 Global High Density Interconnect Consumption by Application
      • 7.2 Global High Density Interconnect Consumption Market Share by Application (2014-2019)

      8 High Density Interconnect Major Manufacturers Analysis

      • 8.1 IBIDEN Group
        • 8.1.1 IBIDEN Group High Density Interconnect Production Sites and Area Served
        • 8.1.2 IBIDEN Group Product Introduction, Application and Specification
        • 8.1.3 IBIDEN Group High Density Interconnect Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.1.4 Main Business and Markets Served
      • 8.2 Unimicron
        • 8.2.1 Unimicron High Density Interconnect Production Sites and Area Served
        • 8.2.2 Unimicron Product Introduction, Application and Specification
        • 8.2.3 Unimicron High Density Interconnect Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.2.4 Main Business and Markets Served
      • 8.3 AT&S
        • 8.3.1 AT&S High Density Interconnect Production Sites and Area Served
        • 8.3.2 AT&S Product Introduction, Application and Specification
        • 8.3.3 AT&S High Density Interconnect Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.3.4 Main Business and Markets Served
      • 8.4 SEMCO
        • 8.4.1 SEMCO High Density Interconnect Production Sites and Area Served
        • 8.4.2 SEMCO Product Introduction, Application and Specification
        • 8.4.3 SEMCO High Density Interconnect Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.4.4 Main Business and Markets Served
      • 8.5 NCAB Group
        • 8.5.1 NCAB Group High Density Interconnect Production Sites and Area Served
        • 8.5.2 NCAB Group Product Introduction, Application and Specification
        • 8.5.3 NCAB Group High Density Interconnect Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.5.4 Main Business and Markets Served
      • 8.6 Young Poong Group
        • 8.6.1 Young Poong Group High Density Interconnect Production Sites and Area Served
        • 8.6.2 Young Poong Group Product Introduction, Application and Specification
        • 8.6.3 Young Poong Group High Density Interconnect Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.6.4 Main Business and Markets Served
      • 8.7 ZDT
        • 8.7.1 ZDT High Density Interconnect Production Sites and Area Served
        • 8.7.2 ZDT Product Introduction, Application and Specification
        • 8.7.3 ZDT High Density Interconnect Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.7.4 Main Business and Markets Served
      • 8.8 Compeq
        • 8.8.1 Compeq High Density Interconnect Production Sites and Area Served
        • 8.8.2 Compeq Product Introduction, Application and Specification
        • 8.8.3 Compeq High Density Interconnect Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.8.4 Main Business and Markets Served
      • 8.9 Unitech Printed Circuit Board Corp.
        • 8.9.1 Unitech Printed Circuit Board Corp. High Density Interconnect Production Sites and Area Served
        • 8.9.2 Unitech Printed Circuit Board Corp. Product Introduction, Application and Specification
        • 8.9.3 Unitech Printed Circuit Board Corp. High Density Interconnect Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.9.4 Main Business and Markets Served
      • 8.10 LG Innotek
        • 8.10.1 LG Innotek High Density Interconnect Production Sites and Area Served
        • 8.10.2 LG Innotek Product Introduction, Application and Specification
        • 8.10.3 LG Innotek High Density Interconnect Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.10.4 Main Business and Markets Served
      • 8.11 Tripod Technology
      • 8.12 TTM Technologies
      • 8.13 Daeduck
      • 8.14 HannStar Board
      • 8.15 Nan Ya PCB
      • 8.16 CMK Corporation
      • 8.17 Kingboard
      • 8.18 Ellington
      • 8.19 CCTC
      • 8.20 Wuzhu Technology
      • 8.21 Kinwong
      • 8.22 Aoshikang
      • 8.23 Sierra Circuits
      • 8.24 Bittele Electronics
      • 8.25 Epec
      • 8.26 Würth Elektronik
      • 8.27 NOD Electronics
      • 8.28 San Francisco Circuits
      • 8.29 PCBCart
      • 8.30 Advanced Circuits

      9 Development Trend of Analysis of High Density Interconnect Market

      • 9.1 Global High Density Interconnect Market Trend Analysis
        • 9.1.1 Global High Density Interconnect Market Size (Volume and Value) Forecast 2019-2025
      • 9.2 High Density Interconnect Regional Market Trend
        • 9.2.1 North America High Density Interconnect Forecast 2019-2025
        • 9.2.2 Europe High Density Interconnect Forecast 2019-2025
        • 9.2.3 China High Density Interconnect Forecast 2019-2025
        • 9.2.4 Japan High Density Interconnect Forecast 2019-2025
        • 9.2.5 Southeast Asia High Density Interconnect Forecast 2019-2025
        • 9.2.6 India High Density Interconnect Forecast 2019-2025
      • 9.3 High Density Interconnect Market Trend (Product Type)
      • 9.4 High Density Interconnect Market Trend (Application)
      • 10.1 Marketing Channel
        • 10.1.1 Direct Marketing
        • 10.1.2 Indirect Marketing
      • 10.3 High Density Interconnect Customers

      11 Market Dynamics

      • 11.1 Market Trends
      • 11.2 Opportunities
      • 11.3 Market Drivers
      • 11.4 Challenges
      • 11.5 Influence Factors

      12 Conclusion

        13 Appendix

        • 13.1 Methodology/Research Approach
          • 13.1.1 Research Programs/Design
          • 13.1.2 Market Size Estimation
          • 13.1.3 Market Breakdown and Data Triangulation
        • 13.2 Data Source
          • 13.2.1 Secondary Sources
          • 13.2.2 Primary Sources
        • 13.3 Author List

        High Density Interconnect. HDI boards, one of the fastest growing technologies in PCBs. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

        The global High Density Interconnect market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
        This report focuses on High Density Interconnect volume and value at global level, regional level and company level. From a global perspective, this report represents overall High Density Interconnect market size by analyzing historical data and future prospect.
        Regionally, this report categorizes the production, apparent consumption, export and import of High Density Interconnect in North America, Europe, China, Japan, Southeast Asia and India.
        For each manufacturer covered, this report analyzes their High Density Interconnect manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

        The following manufacturers are covered:
        IBIDEN Group
        Unimicron
        AT&S
        SEMCO
        NCAB Group
        Young Poong Group
        ZDT
        Compeq
        Unitech Printed Circuit Board Corp.
        LG Innotek
        Tripod Technology
        TTM Technologies
        Daeduck
        HannStar Board
        Nan Ya PCB
        CMK Corporation
        Kingboard
        Ellington
        CCTC
        Wuzhu Technology
        Kinwong
        Aoshikang
        Sierra Circuits
        Bittele Electronics
        Epec
        Würth Elektronik
        NOD Electronics
        San Francisco Circuits
        PCBCart
        Advanced Circuits

        Segment by Regions
        North America
        Europe
        China
        Japan
        Southeast Asia
        India

        Segment by Type
        Single Panel
        Double Panel
        Others

        Segment by Application
        Automotive Electronics
        Consumer Electronics
        Other Electronic Products

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