Heat Spreaders for Semiconductor Packaging Market Report – Research, Industry Analysis Reports and Market Demands

Global Heat Spreaders for Semiconductor Packaging Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032

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Table of Content

1 Market Overview

1.1 Product Overview and Scope
1.2 Market Estimation Caveats and Base Year
1.3 Market Analysis by Type
- 1.3.1 Overview: Global Heat Spreaders for Semiconductor Packaging Consumption Value by Type: 2021 Versus 2025 Versus 2032
- 1.3.2 Heat Spreader: Size (Above 35*35mm)
- 1.3.3 Heat Spreader: Size (Below 35*35mm)
1.4 Market Analysis by Application
- 1.4.1 Overview: Global Heat Spreaders for Semiconductor Packaging Consumption Value by Application: 2021 Versus 2025 Versus 2032
- 1.4.2 PC CPU/GPU Package
- 1.4.3 Server/Data Center/AI Chip Package
- 1.4.4 Automotive SoC/FPGA Package
- 1.4.5 Gaming Console
- 1.4.6 Others
1.5 Global Heat Spreaders for Semiconductor Packaging Market Size & Forecast
- 1.5.1 Global Heat Spreaders for Semiconductor Packaging Consumption Value (2021 & 2025 & 2032)
- 1.5.2 Global Heat Spreaders for Semiconductor Packaging Sales Quantity (2021-2032)
- 1.5.3 Global Heat Spreaders for Semiconductor Packaging Average Price (2021-2032)

2 Manufacturers Profiles

3 Competitive Environment: Heat Spreaders for Semiconductor Packaging by Manufacturer

3.1 Global Heat Spreaders for Semiconductor Packaging Sales Quantity by Manufacturer (2021-2026)
3.2 Global Heat Spreaders for Semiconductor Packaging Revenue by Manufacturer (2021-2026)
3.3 Global Heat Spreaders for Semiconductor Packaging Average Price by Manufacturer (2021-2026)
3.4 Market Share Analysis (2025)
- 3.4.1 Producer Shipments of Heat Spreaders for Semiconductor Packaging by Manufacturer Revenue ($MM) and Market Share (%): 2025
- 3.4.2 Top 3 Heat Spreaders for Semiconductor Packaging Manufacturer Market Share in 2025
- 3.4.3 Top 6 Heat Spreaders for Semiconductor Packaging Manufacturer Market Share in 2025
3.5 Heat Spreaders for Semiconductor Packaging Market: Overall Company Footprint Analysis
- 3.5.1 Heat Spreaders for Semiconductor Packaging Market: Region Footprint
- 3.5.2 Heat Spreaders for Semiconductor Packaging Market: Company Product Type Footprint
- 3.5.3 Heat Spreaders for Semiconductor Packaging Market: Company Product Application Footprint
3.6 New Market Entrants and Barriers to Market Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

4.1 Global Heat Spreaders for Semiconductor Packaging Market Size by Region
- 4.1.1 Global Heat Spreaders for Semiconductor Packaging Sales Quantity by Region (2021-2032)
- 4.1.2 Global Heat Spreaders for Semiconductor Packaging Consumption Value by Region (2021-2032)
- 4.1.3 Global Heat Spreaders for Semiconductor Packaging Average Price by Region (2021-2032)
4.2 North America Heat Spreaders for Semiconductor Packaging Consumption Value (2021-2032)
4.3 Europe Heat Spreaders for Semiconductor Packaging Consumption Value (2021-2032)
4.4 Asia-Pacific Heat Spreaders for Semiconductor Packaging Consumption Value (2021-2032)
4.5 South America Heat Spreaders for Semiconductor Packaging Consumption Value (2021-2032)
4.6 Middle East & Africa Heat Spreaders for Semiconductor Packaging Consumption Value (2021-2032)

5 Market Segment by Type

5.1 Global Heat Spreaders for Semiconductor Packaging Sales Quantity by Type (2021-2032)
5.2 Global Heat Spreaders for Semiconductor Packaging Consumption Value by Type (2021-2032)
5.3 Global Heat Spreaders for Semiconductor Packaging Average Price by Type (2021-2032)

6 Market Segment by Application

6.1 Global Heat Spreaders for Semiconductor Packaging Sales Quantity by Application (2021-2032)
6.2 Global Heat Spreaders for Semiconductor Packaging Consumption Value by Application (2021-2032)
6.3 Global Heat Spreaders for Semiconductor Packaging Average Price by Application (2021-2032)

7 North America

7.1 North America Heat Spreaders for Semiconductor Packaging Sales Quantity by Type (2021-2032)
7.2 North America Heat Spreaders for Semiconductor Packaging Sales Quantity by Application (2021-2032)
7.3 North America Heat Spreaders for Semiconductor Packaging Market Size by Country
- 7.3.1 North America Heat Spreaders for Semiconductor Packaging Sales Quantity by Country (2021-2032)
- 7.3.2 North America Heat Spreaders for Semiconductor Packaging Consumption Value by Country (2021-2032)
- 7.3.3 United States Market Size and Forecast (2021-2032)
- 7.3.4 Canada Market Size and Forecast (2021-2032)
- 7.3.5 Mexico Market Size and Forecast (2021-2032)

8 Europe

8.1 Europe Heat Spreaders for Semiconductor Packaging Sales Quantity by Type (2021-2032)
8.2 Europe Heat Spreaders for Semiconductor Packaging Sales Quantity by Application (2021-2032)
8.3 Europe Heat Spreaders for Semiconductor Packaging Market Size by Country
- 8.3.1 Europe Heat Spreaders for Semiconductor Packaging Sales Quantity by Country (2021-2032)
- 8.3.2 Europe Heat Spreaders for Semiconductor Packaging Consumption Value by Country (2021-2032)
- 8.3.3 Germany Market Size and Forecast (2021-2032)
- 8.3.4 France Market Size and Forecast (2021-2032)
- 8.3.5 United Kingdom Market Size and Forecast (2021-2032)
- 8.3.6 Russia Market Size and Forecast (2021-2032)
- 8.3.7 Italy Market Size and Forecast (2021-2032)

9 Asia-Pacific

9.1 Asia-Pacific Heat Spreaders for Semiconductor Packaging Sales Quantity by Type (2021-2032)
9.2 Asia-Pacific Heat Spreaders for Semiconductor Packaging Sales Quantity by Application (2021-2032)
9.3 Asia-Pacific Heat Spreaders for Semiconductor Packaging Market Size by Region
- 9.3.1 Asia-Pacific Heat Spreaders for Semiconductor Packaging Sales Quantity by Region (2021-2032)
- 9.3.2 Asia-Pacific Heat Spreaders for Semiconductor Packaging Consumption Value by Region (2021-2032)
- 9.3.3 China Market Size and Forecast (2021-2032)
- 9.3.4 Japan Market Size and Forecast (2021-2032)
- 9.3.5 South Korea Market Size and Forecast (2021-2032)
- 9.3.6 India Market Size and Forecast (2021-2032)
- 9.3.7 Southeast Asia Market Size and Forecast (2021-2032)
- 9.3.8 Australia Market Size and Forecast (2021-2032)

10 South America

10.1 South America Heat Spreaders for Semiconductor Packaging Sales Quantity by Type (2021-2032)
10.2 South America Heat Spreaders for Semiconductor Packaging Sales Quantity by Application (2021-2032)
10.3 South America Heat Spreaders for Semiconductor Packaging Market Size by Country
- 10.3.1 South America Heat Spreaders for Semiconductor Packaging Sales Quantity by Country (2021-2032)
- 10.3.2 South America Heat Spreaders for Semiconductor Packaging Consumption Value by Country (2021-2032)
- 10.3.3 Brazil Market Size and Forecast (2021-2032)
- 10.3.4 Argentina Market Size and Forecast (2021-2032)

11 Middle East & Africa

11.1 Middle East & Africa Heat Spreaders for Semiconductor Packaging Sales Quantity by Type (2021-2032)
11.2 Middle East & Africa Heat Spreaders for Semiconductor Packaging Sales Quantity by Application (2021-2032)
11.3 Middle East & Africa Heat Spreaders for Semiconductor Packaging Market Size by Country
- 11.3.1 Middle East & Africa Heat Spreaders for Semiconductor Packaging Sales Quantity by Country (2021-2032)
- 11.3.2 Middle East & Africa Heat Spreaders for Semiconductor Packaging Consumption Value by Country (2021-2032)
- 11.3.3 Turkey Market Size and Forecast (2021-2032)
- 11.3.4 Egypt Market Size and Forecast (2021-2032)
- 11.3.5 Saudi Arabia Market Size and Forecast (2021-2032)
- 11.3.6 South Africa Market Size and Forecast (2021-2032)

12 Market Dynamics

12.1 Heat Spreaders for Semiconductor Packaging Market Drivers
12.2 Heat Spreaders for Semiconductor Packaging Market Restraints
12.3 Heat Spreaders for Semiconductor Packaging Trends Analysis
12.4 Porters Five Forces Analysis
- 12.4.1 Threat of New Entrants
- 12.4.2 Bargaining Power of Suppliers
- 12.4.3 Bargaining Power of Buyers
- 12.4.4 Threat of Substitutes
- 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

13.1 Raw Material of Heat Spreaders for Semiconductor Packaging and Key Manufacturers
13.2 Manufacturing Costs Percentage of Heat Spreaders for Semiconductor Packaging
13.3 Heat Spreaders for Semiconductor Packaging Production Process
13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

14.1 Sales Channel
- 14.1.1 Direct to End-User
- 14.1.2 Distributors
14.2 Heat Spreaders for Semiconductor Packaging Typical Distributors
14.3 Heat Spreaders for Semiconductor Packaging Typical Customers

15 Research Findings and Conclusion

16 Appendix

16.1 Methodology
16.2 Research Process and Data Source

Description

According to our (Global Info Research) latest study, the global Heat Spreaders for Semiconductor Packaging market size was valued at US$ 769 million in 2025 and is forecast to a readjusted size of US$ 1371 million by 2032 with a CAGR of 8.7% during review period.
A heat spreader is high thermal conductive metallic materials for efficient heat dissipation from an IC chip in a semiconductor package.
This report studies the Heat Spreaders for semiconductor IC package, include FC (Flip Chip) heat spreaders and BGA heat spreaders. The Flip Chip heat spreaders include Lid/Ring type, Hat type, Flat Top type and Cavity type heat spreaders, etc. These spreaders are used in CPU packages for personal computers, CPU packages for servers, SoC/FPGA packages for automotive devices, Processor packages for communication equipment, and AI processor packages, etc.
Heat spreaders are one of the fundamental heat dissipation components used in various industries. They are typically made of high thermal conductivity metals such as copper or aluminum. In the electronics industry, heat spreaders or heat sinks are installed on electronic components or chips to transfer or dissipate the heat generated by the components using the thermal conductivity of the heat dissipation material itself. Heat spreaders find wide applications in the electronic information industry, semiconductor industry, and optoelectronic component industry, with downstream applications extending to the 3C industry.
Furthermore, electric vehicles (EVs) and hybrid electric vehicles (HEVs) have become a major trend in automotive development. In the inverters and rectifiers of electric vehicles, high-power chip modules pose thermal dissipation challenges. Currently, the mainstream solution for such designs is to use water-cooled heat spreaders. By utilizing highly thermally conductive metal materials, along with metal processing techniques and surface treatments, the chip temperature can be controlled within an acceptable range using water cooling. The thermal design of water-cooled heat spreaders needs to effectively dissipate the heat generated by the chips, while considering the cost and manufacturability aspects of the design for mass production.
Currently, the global heat spreader market is primarily dominated by manufacturers from Japan, the United States, and China Taiwan, with China Taiwan being the largest production region, accounting for approximately 57% of the global market share in 2024. Japan and the United States are also significant production regions, with market shares of 16.7% and 17.1%, respectively, in 2024. Chinese manufacturers entered this field relatively late, with two main players currently holding a combined global market share of 4.98% in 2024, which is expected to grow to 10.25% by 2031.
In terms of materials, copper heat spreaders currently dominate the market, accounting for 89% of the market share in 2024. Due to the design changes in AI chips, heat spreaders have not only become larger and thicker but also shifted materials. Historically, copper was the primary material used for heat spreaders due to its high thermal conductivity of 401 W/m.K, which is higher than that of gold or aluminum, second only to silver. However, heat spreader materials are now moving toward stainless steel, which has higher hardness and is more difficult to process, thus raising the technological barriers for manufacturers. In the coming years, stainless steel-based heat spreader are expected to see faster growth.
Regarding chip sizes, the proportion of large-sized heat spreader products is gradually increasing. Heat spreaders are closely related to chip packaging. In the past, processors required heat spreaders with an area of around 30mm x 30mm. Now, with chip manufacturers enhancing computational speeds and incorporating more memory, the number of bare die (chips) has significantly increased, expanding the area to 60mm x 60mm or larger. In 2024, heat spreaders with sizes greater than 35mm x 35mm will account for approximately 53%, and it is expected to rise to 61% by 2031.
In terms of market application, PC CPU/GPU heat spreaders currently hold the largest market share, accounting for 52% in 2024. However, the server/data center sector is growing at a faster pace, accounting for 35% in 2024 and projected to reach 50% by 2031.
The main global heat spreader manufacturers include Jentech Precision Industrial, Honeywell, Shinko, Fujikura, I-Chiun, Favor Precision Technology, and Shandong Ruisi Precision Industry. The top five global manufacturers are expected to account for approximately 91% of the market share in 2024. In the coming years, competition in this industry is expected to intensify.
This report is a detailed and comprehensive analysis for global Heat Spreaders for Semiconductor Packaging market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Heat Spreaders for Semiconductor Packaging market size and forecasts, in consumption value ($ Million), sales quantity (Million Pcs), and average selling prices (US$/Pcs), 2021-2032
Global Heat Spreaders for Semiconductor Packaging market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Million Pcs), and average selling prices (US$/Pcs), 2021-2032
Global Heat Spreaders for Semiconductor Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Million Pcs), and average selling prices (US$/Pcs), 2021-2032
Global Heat Spreaders for Semiconductor Packaging market shares of main players, shipments in revenue ($ Million), sales quantity (Million Pcs), and ASP (US$/Pcs), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Heat Spreaders for Semiconductor Packaging
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Heat Spreaders for Semiconductor Packaging market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Shinko, Honeywell Advanced Materials, Jentech Precision Industrial, I-Chiun, Favor Precision Technology, Niching Industrial Corporation, Fastrong Technologies Corp., ECE (Excel Cell Electronic), Shandong Ruisi Precision Industry, HongRiDa Electronics (HRD), etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Heat Spreaders for Semiconductor Packaging market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Heat Spreader: Size (Above 35*35mm)
Heat Spreader: Size (Below 35*35mm)
Market segment by Application
PC CPU/GPU Package
Server/Data Center/AI Chip Package
Automotive SoC/FPGA Package
Gaming Console
Others
Major players covered
Shinko
Honeywell Advanced Materials
Jentech Precision Industrial
I-Chiun
Favor Precision Technology
Niching Industrial Corporation
Fastrong Technologies Corp.
ECE (Excel Cell Electronic)
Shandong Ruisi Precision Industry
HongRiDa Electronics (HRD)
TBT Co., Ltd
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Heat Spreaders for Semiconductor Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Heat Spreaders for Semiconductor Packaging, with price, sales quantity, revenue, and global market share of Heat Spreaders for Semiconductor Packaging from 2021 to 2026.
Chapter 3, the Heat Spreaders for Semiconductor Packaging competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Heat Spreaders for Semiconductor Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and Heat Spreaders for Semiconductor Packaging market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Heat Spreaders for Semiconductor Packaging.
Chapter 14 and 15, to describe Heat Spreaders for Semiconductor Packaging sales channel, distributors, customers, research findings and conclusion.

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