Copyright Reports & Markets. All rights reserved.

Global HBM Underfill Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032

Request for Sample of this report
Buy now

1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global HBM Underfill Consumption Value by Type: 2021 Versus 2025 Versus 2032
    • 1.3.2 Molded Underfill（MUF）
    • 1.3.3 Capillary Underfill（CUF）
  • 1.4 Market Analysis by HBM Stacking Layers
    • 1.4.1 Overview: Global HBM Underfill Consumption Value by HBM Stacking Layers: 2021 Versus 2025 Versus 2032
    • 1.4.2 For 8-High and Below HBM
    • 1.4.3 For 12-High HBM
    • 1.4.4 For 16-High and Above HBM
  • 1.5 Market Analysis by Application
    • 1.5.1 Overview: Global HBM Underfill Consumption Value by Application: 2021 Versus 2025 Versus 2032
    • 1.5.2 AI Servers and Data Centers
    • 1.5.3 Networking and Telecommunications
    • 1.5.4 Automotive Electronics
    • 1.5.5 Aerospace and Defense
    • 1.5.6 Others
  • 1.6 Global HBM Underfill Market Size & Forecast
    • 1.6.1 Global HBM Underfill Consumption Value (2021 & 2025 & 2032)
    • 1.6.2 Global HBM Underfill Sales Quantity (2021-2032)
    • 1.6.3 Global HBM Underfill Average Price (2021-2032)

2 Manufacturers Profiles

  • 2.1 NAMICS Corporation
    • 2.1.1 NAMICS Corporation Details
    • 2.1.2 NAMICS Corporation Major Business
    • 2.1.3 NAMICS Corporation HBM Underfill Product and Services
    • 2.1.4 NAMICS Corporation HBM Underfill Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2021-2026)
    • 2.1.5 NAMICS Corporation Recent Developments/Updates
  • 2.2 Henkel
    • 2.2.1 Henkel Details
    • 2.2.2 Henkel Major Business
    • 2.2.3 Henkel HBM Underfill Product and Services
    • 2.2.4 Henkel HBM Underfill Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2021-2026)
    • 2.2.5 Henkel Recent Developments/Updates
  • 2.3 Resonac Corporation
    • 2.3.1 Resonac Corporation Details
    • 2.3.2 Resonac Corporation Major Business
    • 2.3.3 Resonac Corporation HBM Underfill Product and Services
    • 2.3.4 Resonac Corporation HBM Underfill Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2021-2026)
    • 2.3.5 Resonac Corporation Recent Developments/Updates
  • 2.4 Sumitomo Bakelite
    • 2.4.1 Sumitomo Bakelite Details
    • 2.4.2 Sumitomo Bakelite Major Business
    • 2.4.3 Sumitomo Bakelite HBM Underfill Product and Services
    • 2.4.4 Sumitomo Bakelite HBM Underfill Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2021-2026)
    • 2.4.5 Sumitomo Bakelite Recent Developments/Updates
  • 2.5 Hubei Huitian New Materials
    • 2.5.1 Hubei Huitian New Materials Details
    • 2.5.2 Hubei Huitian New Materials Major Business
    • 2.5.3 Hubei Huitian New Materials HBM Underfill Product and Services
    • 2.5.4 Hubei Huitian New Materials HBM Underfill Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2021-2026)
    • 2.5.5 Hubei Huitian New Materials Recent Developments/Updates

3 Competitive Environment: HBM Underfill by Manufacturer

  • 3.1 Global HBM Underfill Sales Quantity by Manufacturer (2021-2026)
  • 3.2 Global HBM Underfill Revenue by Manufacturer (2021-2026)
  • 3.3 Global HBM Underfill Average Price by Manufacturer (2021-2026)
  • 3.4 Market Share Analysis (2025)
    • 3.4.1 Producer Shipments of HBM Underfill by Manufacturer Revenue ($MM) and Market Share (%): 2025
    • 3.4.2 Top 3 HBM Underfill Manufacturer Market Share in 2025
    • 3.4.3 Top 6 HBM Underfill Manufacturer Market Share in 2025
  • 3.5 HBM Underfill Market: Overall Company Footprint Analysis
    • 3.5.1 HBM Underfill Market: Region Footprint
    • 3.5.2 HBM Underfill Market: Company Product Type Footprint
    • 3.5.3 HBM Underfill Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global HBM Underfill Market Size by Region
    • 4.1.1 Global HBM Underfill Sales Quantity by Region (2021-2032)
    • 4.1.2 Global HBM Underfill Consumption Value by Region (2021-2032)
    • 4.1.3 Global HBM Underfill Average Price by Region (2021-2032)
  • 4.2 North America HBM Underfill Consumption Value (2021-2032)
  • 4.3 Europe HBM Underfill Consumption Value (2021-2032)
  • 4.4 Asia-Pacific HBM Underfill Consumption Value (2021-2032)
  • 4.5 South America HBM Underfill Consumption Value (2021-2032)
  • 4.6 Middle East & Africa HBM Underfill Consumption Value (2021-2032)

5 Market Segment by Type

  • 5.1 Global HBM Underfill Sales Quantity by Type (2021-2032)
  • 5.2 Global HBM Underfill Consumption Value by Type (2021-2032)
  • 5.3 Global HBM Underfill Average Price by Type (2021-2032)

6 Market Segment by Application

  • 6.1 Global HBM Underfill Sales Quantity by Application (2021-2032)
  • 6.2 Global HBM Underfill Consumption Value by Application (2021-2032)
  • 6.3 Global HBM Underfill Average Price by Application (2021-2032)

7 North America

  • 7.1 North America HBM Underfill Sales Quantity by Type (2021-2032)
  • 7.2 North America HBM Underfill Sales Quantity by Application (2021-2032)
  • 7.3 North America HBM Underfill Market Size by Country
    • 7.3.1 North America HBM Underfill Sales Quantity by Country (2021-2032)
    • 7.3.2 North America HBM Underfill Consumption Value by Country (2021-2032)
    • 7.3.3 United States Market Size and Forecast (2021-2032)
    • 7.3.4 Canada Market Size and Forecast (2021-2032)
    • 7.3.5 Mexico Market Size and Forecast (2021-2032)

8 Europe

  • 8.1 Europe HBM Underfill Sales Quantity by Type (2021-2032)
  • 8.2 Europe HBM Underfill Sales Quantity by Application (2021-2032)
  • 8.3 Europe HBM Underfill Market Size by Country
    • 8.3.1 Europe HBM Underfill Sales Quantity by Country (2021-2032)
    • 8.3.2 Europe HBM Underfill Consumption Value by Country (2021-2032)
    • 8.3.3 Germany Market Size and Forecast (2021-2032)
    • 8.3.4 France Market Size and Forecast (2021-2032)
    • 8.3.5 United Kingdom Market Size and Forecast (2021-2032)
    • 8.3.6 Russia Market Size and Forecast (2021-2032)
    • 8.3.7 Italy Market Size and Forecast (2021-2032)

9 Asia-Pacific

  • 9.1 Asia-Pacific HBM Underfill Sales Quantity by Type (2021-2032)
  • 9.2 Asia-Pacific HBM Underfill Sales Quantity by Application (2021-2032)
  • 9.3 Asia-Pacific HBM Underfill Market Size by Region
    • 9.3.1 Asia-Pacific HBM Underfill Sales Quantity by Region (2021-2032)
    • 9.3.2 Asia-Pacific HBM Underfill Consumption Value by Region (2021-2032)
    • 9.3.3 China Market Size and Forecast (2021-2032)
    • 9.3.4 Japan Market Size and Forecast (2021-2032)
    • 9.3.5 South Korea Market Size and Forecast (2021-2032)
    • 9.3.6 India Market Size and Forecast (2021-2032)
    • 9.3.7 Southeast Asia Market Size and Forecast (2021-2032)
    • 9.3.8 Australia Market Size and Forecast (2021-2032)

10 South America

  • 10.1 South America HBM Underfill Sales Quantity by Type (2021-2032)
  • 10.2 South America HBM Underfill Sales Quantity by Application (2021-2032)
  • 10.3 South America HBM Underfill Market Size by Country
    • 10.3.1 South America HBM Underfill Sales Quantity by Country (2021-2032)
    • 10.3.2 South America HBM Underfill Consumption Value by Country (2021-2032)
    • 10.3.3 Brazil Market Size and Forecast (2021-2032)
    • 10.3.4 Argentina Market Size and Forecast (2021-2032)

11 Middle East & Africa

  • 11.1 Middle East & Africa HBM Underfill Sales Quantity by Type (2021-2032)
  • 11.2 Middle East & Africa HBM Underfill Sales Quantity by Application (2021-2032)
  • 11.3 Middle East & Africa HBM Underfill Market Size by Country
    • 11.3.1 Middle East & Africa HBM Underfill Sales Quantity by Country (2021-2032)
    • 11.3.2 Middle East & Africa HBM Underfill Consumption Value by Country (2021-2032)
    • 11.3.3 Turkey Market Size and Forecast (2021-2032)
    • 11.3.4 Egypt Market Size and Forecast (2021-2032)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2021-2032)
    • 11.3.6 South Africa Market Size and Forecast (2021-2032)

12 Market Dynamics

  • 12.1 HBM Underfill Market Drivers
  • 12.2 HBM Underfill Market Restraints
  • 12.3 HBM Underfill Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of HBM Underfill and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of HBM Underfill
  • 13.3 HBM Underfill Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 HBM Underfill Typical Distributors
  • 14.3 HBM Underfill Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global HBM Underfill market size was valued at US$ 48.78 million in 2025 and is forecast to a readjusted size of US$ 123 million by 2032 with a CAGR of 11.3% during review period.
    HBM underfill material is a semiconductor packaging material used within stacked high-bandwidth memory devices and at the interfaces between the HBM stack, base die, and interposer. It fills the microscopic gaps surrounding micro-bumps, through-silicon vias, and inter-die connections, forming an electrically insulating and mechanically protective structure after curing. The material helps distribute thermomechanical stress caused by differences in coefficients of thermal expansion, thereby reducing solder-joint fatigue, interfacial delamination, die cracking, and package warpage while improving thermal, moisture, and long-term reliability. Depending on the packaging process, HBM underfill materials mainly include molded underfill or mass reflow molded underfill (MUF/MR-MUF), capillary underfill (CUF), non-conductive paste (NCP), and non-conductive film (NCF), with liquid MR-MUF and film-type NCF representing two important HBM stacking approaches.
    The global HBM underfill material market is being driven by expanding demand for generative AI, AI servers, high-performance computing, and data-center accelerators. As HBM3E, HBM4, and subsequent generations move toward 12-high, 16-high, and even higher-stack architectures, thinner dies, finer micro-bump pitches, and narrower inter-die gaps are creating more stringent requirements for low-viscosity flow, fine-gap filling, low warpage, low coefficient of thermal expansion, high thermal conductivity, and rapid curing. SK hynix has applied advanced MR-MUF technology to volume-produced 12-layer HBM3E and continues to use the process for HBM4 and HBM4E products, while demand for NCF is also expected to increase as the number of stacked HBM dies rises. Consequently, suppliers with advanced formulation capabilities, ultra-fine-gap processing performance, proven long-term reliability, and qualification experience with leading memory manufacturers are expected to gain a stronger competitive position. Nevertheless, lengthy customer qualification cycles and high technological barriers are likely to keep the market concentrated among a limited number of semiconductor-grade material suppliers. In 2025, global HBM Underfill production reached approximately 30.2 tons, with an average global market price of around 1570 USD/kg,.The production capacity for HBM Underfill in 2025 was approximately 35 tons. The typical gross profit margin for HBM Underfill between 20% and 40%.
    Report Scope
    This report is a detailed and comprehensive analysis for global HBM Underfill market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
    Key Features:
    Global HBM Underfill market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2021-2032
    Global HBM Underfill market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2021-2032
    Global HBM Underfill market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2021-2032
    Global HBM Underfill market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/kg), 2021-2026
    The Primary Objectives in This Report Are:
    To determine the size of the total market opportunity of global and key countries
    To assess the growth potential for HBM Underfill
    To forecast future growth in each product and end-use market
    To assess competitive factors affecting the marketplace
    This report profiles key players in the global HBM Underfill market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include NAMICS Corporation, Henkel, Resonac Corporation, Sumitomo Bakelite, Hubei Huitian New Materials, etc.
    This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
    Market Segmentation
    HBM Underfill market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
    Market segment by Type
    Molded Underfill（MUF）
    Capillary Underfill（CUF）
    Market segment by HBM Stacking Layers
    For 8-High and Below HBM
    For 12-High HBM
    For 16-High and Above HBM
    Market segment by Application
    AI Servers and Data Centers
    Networking and Telecommunications
    Automotive Electronics
    Aerospace and Defense
    Others
    Major players covered
    NAMICS Corporation
    Henkel
    Resonac Corporation
    Sumitomo Bakelite
    Hubei Huitian New Materials
    Market segment by region, regional analysis covers
    North America (United States, Canada, and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
    Chapter Outline
    Chapter 1, to describe HBM Underfill product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top manufacturers of HBM Underfill, with price, sales quantity, revenue, and global market share of HBM Underfill from 2021 to 2026.
    Chapter 3, the HBM Underfill competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
    Chapter 4, the HBM Underfill breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
    Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
    Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and HBM Underfill market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
    Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
    Chapter 13, the key raw materials and key suppliers, and industry chain of HBM Underfill.
    Chapter 14 and 15, to describe HBM Underfill sales channel, distributors, customers, research findings and conclusion.

    Buy now