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Global FOPLP Market Size, Status and Forecast 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Study Scope
    • 1.2 Key Market Segments
    • 1.3 Players Covered
    • 1.4 Market Analysis by Type
      • 1.4.1 Global FOPLP Market Size Growth Rate by Type (2014-2025)
      • 1.4.2 100mm Wafers
      • 1.4.3 150mm Wafers
      • 1.4.4 200mm Wafers
      • 1.4.5 300mm Wafers
    • 1.5 Market by Application
      • 1.5.1 Global FOPLP Market Share by Application (2014-2025)
      • 1.5.2 CMOS Image Sensor
      • 1.5.3 Wireless Connectivity
      • 1.5.4 Logic and Memory IC
      • 1.5.5 MEMS and Sensor
      • 1.5.6 Analog and Mixed IC
      • 1.5.7 Others
    • 1.6 Study Objectives
    • 1.7 Years Considered

    2 Global Growth Trends

    • 2.1 FOPLP Market Size
    • 2.2 FOPLP Growth Trends by Regions
      • 2.2.1 FOPLP Market Size by Regions (2014-2025)
      • 2.2.2 FOPLP Market Share by Regions (2014-2019)
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers
      • 2.3.3 Market Opportunities

    3 Market Share by Key Players

    • 3.1 FOPLP Market Size by Manufacturers
      • 3.1.1 Global FOPLP Revenue by Manufacturers (2014-2019)
      • 3.1.2 Global FOPLP Revenue Market Share by Manufacturers (2014-2019)
      • 3.1.3 Global FOPLP Market Concentration Ratio (CR5 and HHI)
    • 3.2 FOPLP Key Players Head office and Area Served
    • 3.3 Key Players FOPLP Product/Solution/Service
    • 3.4 Date of Enter into FOPLP Market
    • 3.5 Mergers & Acquisitions, Expansion Plans

    4 Breakdown Data by Type and Application

    • 4.1 Global FOPLP Market Size by Type (2014-2019)
    • 4.2 Global FOPLP Market Size by Application (2014-2019)

    5 United States

    • 5.1 United States FOPLP Market Size (2014-2019)
    • 5.2 FOPLP Key Players in United States
    • 5.3 United States FOPLP Market Size by Type
    • 5.4 United States FOPLP Market Size by Application

    6 Europe

    • 6.1 Europe FOPLP Market Size (2014-2019)
    • 6.2 FOPLP Key Players in Europe
    • 6.3 Europe FOPLP Market Size by Type
    • 6.4 Europe FOPLP Market Size by Application

    7 China

    • 7.1 China FOPLP Market Size (2014-2019)
    • 7.2 FOPLP Key Players in China
    • 7.3 China FOPLP Market Size by Type
    • 7.4 China FOPLP Market Size by Application

    8 Japan

    • 8.1 Japan FOPLP Market Size (2014-2019)
    • 8.2 FOPLP Key Players in Japan
    • 8.3 Japan FOPLP Market Size by Type
    • 8.4 Japan FOPLP Market Size by Application

    9 Southeast Asia

    • 9.1 Southeast Asia FOPLP Market Size (2014-2019)
    • 9.2 FOPLP Key Players in Southeast Asia
    • 9.3 Southeast Asia FOPLP Market Size by Type
    • 9.4 Southeast Asia FOPLP Market Size by Application

    10 India

    • 10.1 India FOPLP Market Size (2014-2019)
    • 10.2 FOPLP Key Players in India
    • 10.3 India FOPLP Market Size by Type
    • 10.4 India FOPLP Market Size by Application

    11 Central & South America

    • 11.1 Central & South America FOPLP Market Size (2014-2019)
    • 11.2 FOPLP Key Players in Central & South America
    • 11.3 Central & South America FOPLP Market Size by Type
    • 11.4 Central & South America FOPLP Market Size by Application

    12 International Players Profiles

    • 12.1 Samsung Electro-Mechanics
      • 12.1.1 Samsung Electro-Mechanics Company Details
      • 12.1.2 Company Description and Business Overview
      • 12.1.3 FOPLP Introduction
      • 12.1.4 Samsung Electro-Mechanics Revenue in FOPLP Business (2014-2019)
      • 12.1.5 Samsung Electro-Mechanics Recent Development
    • 12.2 Powertech Technology
      • 12.2.1 Powertech Technology Company Details
      • 12.2.2 Company Description and Business Overview
      • 12.2.3 FOPLP Introduction
      • 12.2.4 Powertech Technology Revenue in FOPLP Business (2014-2019)
      • 12.2.5 Powertech Technology Recent Development
    • 12.3 Advanced Semiconductor Engineering
      • 12.3.1 Advanced Semiconductor Engineering Company Details
      • 12.3.2 Company Description and Business Overview
      • 12.3.3 FOPLP Introduction
      • 12.3.4 Advanced Semiconductor Engineering Revenue in FOPLP Business (2014-2019)
      • 12.3.5 Advanced Semiconductor Engineering Recent Development
    • 12.4 Nepes
      • 12.4.1 Nepes Company Details
      • 12.4.2 Company Description and Business Overview
      • 12.4.3 FOPLP Introduction
      • 12.4.4 Nepes Revenue in FOPLP Business (2014-2019)
      • 12.4.5 Nepes Recent Development

    13 Market Forecast 2019-2025

    • 13.1 Market Size Forecast by Regions
    • 13.2 United States
    • 13.3 Europe
    • 13.4 China
    • 13.5 Japan
    • 13.6 Southeast Asia
    • 13.7 India
    • 13.8 Central & South America
    • 13.9 Market Size Forecast by Product (2019-2025)
    • 13.10 Market Size Forecast by Application (2019-2025)

    14 Analyst's Viewpoints/Conclusions

      15 Appendix

      • 15.1 Research Methodology
        • 15.1.1 Methodology/Research Approach
          • 15.1.1.1 Research Programs/Design
          • 15.1.1.2 Market Size Estimation
          • 12.1.1.3 Market Breakdown and Data Triangulation
        • 15.1.2 Data Source
          • 15.1.2.1 Secondary Sources
          • 15.1.2.2 Primary Sources
      • 15.2 Disclaimer

      Fan-out panel level package (FOPLP) is well-known process to extend for Fan-Out Wafer Level Package (FOWLP) efficiently in terms of area-fill factor and large.
      In 2018, the global FOPLP market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2019-2025.

      This report focuses on the global FOPLP status, future forecast, growth opportunity, key market and key players. The study objectives are to present the FOPLP development in United States, Europe and China.

      The key players covered in this study
      Samsung Electro-Mechanics
      Powertech Technology
      Advanced Semiconductor Engineering
      Nepes
      ...

      Market segment by Type, the product can be split into
      100mm Wafers
      150mm Wafers
      200mm Wafers
      300mm Wafers

      Market segment by Application, split into
      CMOS Image Sensor
      Wireless Connectivity
      Logic and Memory IC
      MEMS and Sensor
      Analog and Mixed IC
      Others

      Market segment by Regions/Countries, this report covers
      United States
      Europe
      China
      Japan
      Southeast Asia
      India
      Central & South America

      The study objectives of this report are:
      To analyze global FOPLP status, future forecast, growth opportunity, key market and key players.
      To present the FOPLP development in United States, Europe and China.
      To strategically profile the key players and comprehensively analyze their development plan and strategies.
      To define, describe and forecast the market by product type, market and key regions.

      In this study, the years considered to estimate the market size of FOPLP are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025
      For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

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