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Global Flip Chip Bonder Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

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1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Flip Chip Bonder Consumption Value by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 Fully Automatic
    • 1.3.3 Semi-Automatic
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Flip Chip Bonder Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 IDMs
    • 1.4.3 OSAT
  • 1.5 Global Flip Chip Bonder Market Size & Forecast
    • 1.5.1 Global Flip Chip Bonder Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global Flip Chip Bonder Sales Quantity (2020-2031)
    • 1.5.3 Global Flip Chip Bonder Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 BESI
    • 2.1.1 BESI Details
    • 2.1.2 BESI Major Business
    • 2.1.3 BESI Flip Chip Bonder Product and Services
    • 2.1.4 BESI Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 BESI Recent Developments/Updates
  • 2.2 ASMPT
    • 2.2.1 ASMPT Details
    • 2.2.2 ASMPT Major Business
    • 2.2.3 ASMPT Flip Chip Bonder Product and Services
    • 2.2.4 ASMPT Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 ASMPT Recent Developments/Updates
  • 2.3 Shibaura
    • 2.3.1 Shibaura Details
    • 2.3.2 Shibaura Major Business
    • 2.3.3 Shibaura Flip Chip Bonder Product and Services
    • 2.3.4 Shibaura Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 Shibaura Recent Developments/Updates
  • 2.4 Muehlbauer
    • 2.4.1 Muehlbauer Details
    • 2.4.2 Muehlbauer Major Business
    • 2.4.3 Muehlbauer Flip Chip Bonder Product and Services
    • 2.4.4 Muehlbauer Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 Muehlbauer Recent Developments/Updates
  • 2.5 K&S
    • 2.5.1 K&S Details
    • 2.5.2 K&S Major Business
    • 2.5.3 K&S Flip Chip Bonder Product and Services
    • 2.5.4 K&S Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 K&S Recent Developments/Updates
  • 2.6 Hamni
    • 2.6.1 Hamni Details
    • 2.6.2 Hamni Major Business
    • 2.6.3 Hamni Flip Chip Bonder Product and Services
    • 2.6.4 Hamni Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 Hamni Recent Developments/Updates
  • 2.7 AMICRA Microtechnologies
    • 2.7.1 AMICRA Microtechnologies Details
    • 2.7.2 AMICRA Microtechnologies Major Business
    • 2.7.3 AMICRA Microtechnologies Flip Chip Bonder Product and Services
    • 2.7.4 AMICRA Microtechnologies Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 AMICRA Microtechnologies Recent Developments/Updates
  • 2.8 SET
    • 2.8.1 SET Details
    • 2.8.2 SET Major Business
    • 2.8.3 SET Flip Chip Bonder Product and Services
    • 2.8.4 SET Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 SET Recent Developments/Updates
  • 2.9 Athlete FA
    • 2.9.1 Athlete FA Details
    • 2.9.2 Athlete FA Major Business
    • 2.9.3 Athlete FA Flip Chip Bonder Product and Services
    • 2.9.4 Athlete FA Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 Athlete FA Recent Developments/Updates

3 Competitive Environment: Flip Chip Bonder by Manufacturer

  • 3.1 Global Flip Chip Bonder Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global Flip Chip Bonder Revenue by Manufacturer (2020-2025)
  • 3.3 Global Flip Chip Bonder Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of Flip Chip Bonder by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 Flip Chip Bonder Manufacturer Market Share in 2024
    • 3.4.3 Top 6 Flip Chip Bonder Manufacturer Market Share in 2024
  • 3.5 Flip Chip Bonder Market: Overall Company Footprint Analysis
    • 3.5.1 Flip Chip Bonder Market: Region Footprint
    • 3.5.2 Flip Chip Bonder Market: Company Product Type Footprint
    • 3.5.3 Flip Chip Bonder Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Flip Chip Bonder Market Size by Region
    • 4.1.1 Global Flip Chip Bonder Sales Quantity by Region (2020-2031)
    • 4.1.2 Global Flip Chip Bonder Consumption Value by Region (2020-2031)
    • 4.1.3 Global Flip Chip Bonder Average Price by Region (2020-2031)
  • 4.2 North America Flip Chip Bonder Consumption Value (2020-2031)
  • 4.3 Europe Flip Chip Bonder Consumption Value (2020-2031)
  • 4.4 Asia-Pacific Flip Chip Bonder Consumption Value (2020-2031)
  • 4.5 South America Flip Chip Bonder Consumption Value (2020-2031)
  • 4.6 Middle East & Africa Flip Chip Bonder Consumption Value (2020-2031)

5 Market Segment by Type

  • 5.1 Global Flip Chip Bonder Sales Quantity by Type (2020-2031)
  • 5.2 Global Flip Chip Bonder Consumption Value by Type (2020-2031)
  • 5.3 Global Flip Chip Bonder Average Price by Type (2020-2031)

6 Market Segment by Application

  • 6.1 Global Flip Chip Bonder Sales Quantity by Application (2020-2031)
  • 6.2 Global Flip Chip Bonder Consumption Value by Application (2020-2031)
  • 6.3 Global Flip Chip Bonder Average Price by Application (2020-2031)

7 North America

  • 7.1 North America Flip Chip Bonder Sales Quantity by Type (2020-2031)
  • 7.2 North America Flip Chip Bonder Sales Quantity by Application (2020-2031)
  • 7.3 North America Flip Chip Bonder Market Size by Country
    • 7.3.1 North America Flip Chip Bonder Sales Quantity by Country (2020-2031)
    • 7.3.2 North America Flip Chip Bonder Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe Flip Chip Bonder Sales Quantity by Type (2020-2031)
  • 8.2 Europe Flip Chip Bonder Sales Quantity by Application (2020-2031)
  • 8.3 Europe Flip Chip Bonder Market Size by Country
    • 8.3.1 Europe Flip Chip Bonder Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe Flip Chip Bonder Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific Flip Chip Bonder Sales Quantity by Type (2020-2031)
  • 9.2 Asia-Pacific Flip Chip Bonder Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific Flip Chip Bonder Market Size by Region
    • 9.3.1 Asia-Pacific Flip Chip Bonder Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific Flip Chip Bonder Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America Flip Chip Bonder Sales Quantity by Type (2020-2031)
  • 10.2 South America Flip Chip Bonder Sales Quantity by Application (2020-2031)
  • 10.3 South America Flip Chip Bonder Market Size by Country
    • 10.3.1 South America Flip Chip Bonder Sales Quantity by Country (2020-2031)
    • 10.3.2 South America Flip Chip Bonder Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa Flip Chip Bonder Sales Quantity by Type (2020-2031)
  • 11.2 Middle East & Africa Flip Chip Bonder Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa Flip Chip Bonder Market Size by Country
    • 11.3.1 Middle East & Africa Flip Chip Bonder Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa Flip Chip Bonder Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 Flip Chip Bonder Market Drivers
  • 12.2 Flip Chip Bonder Market Restraints
  • 12.3 Flip Chip Bonder Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Flip Chip Bonder and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Flip Chip Bonder
  • 13.3 Flip Chip Bonder Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Flip Chip Bonder Typical Distributors
  • 14.3 Flip Chip Bonder Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global Flip Chip Bonder market size was valued at US$ 306 million in 2024 and is forecast to a readjusted size of USD 331 million by 2031 with a CAGR of 1.2% during review period.
    Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following: 1. Die is picked up and place on a "flipping device" 2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions 3. The tool then places the die on the bump with a programmed amount of force Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support. Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
    Global Flip Chip Bonder key players include Besi, ASM Pacific Technology, Shibaura, Kulicke & Soffa, etc. Global top four manufacturers hold a share nearly 70%. China is the largest market, with a share about 25%, followed by United States, and Taiwan, both have a share about 30 percent. In terms of product, Fully Automatic is the largest segment, with a share over 75%. And in terms of application, the largest application is IDMs, followed by OSAT.
    This report is a detailed and comprehensive analysis for global Flip Chip Bonder market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
    Key Features:
    Global Flip Chip Bonder market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
    Global Flip Chip Bonder market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
    Global Flip Chip Bonder market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
    Global Flip Chip Bonder market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2020-2025
    The Primary Objectives in This Report Are:
    To determine the size of the total market opportunity of global and key countries
    To assess the growth potential for Flip Chip Bonder
    To forecast future growth in each product and end-use market
    To assess competitive factors affecting the marketplace
    This report profiles key players in the global Flip Chip Bonder market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include BESI, ASMPT, Shibaura, Muehlbauer, K&S, Hamni, AMICRA Microtechnologies, SET, Athlete FA, etc.
    This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
    Market Segmentation
    Flip Chip Bonder market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
    Market segment by Type
    Fully Automatic
    Semi-Automatic
    Market segment by Application
    IDMs
    OSAT
    Major players covered
    BESI
    ASMPT
    Shibaura
    Muehlbauer
    K&S
    Hamni
    AMICRA Microtechnologies
    SET
    Athlete FA
    Market segment by region, regional analysis covers
    North America (United States, Canada, and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 15 chapters:
    Chapter 1, to describe Flip Chip Bonder product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top manufacturers of Flip Chip Bonder, with price, sales quantity, revenue, and global market share of Flip Chip Bonder from 2020 to 2025.
    Chapter 3, the Flip Chip Bonder competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
    Chapter 4, the Flip Chip Bonder breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
    Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
    Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Flip Chip Bonder market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
    Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
    Chapter 13, the key raw materials and key suppliers, and industry chain of Flip Chip Bonder.
    Chapter 14 and 15, to describe Flip Chip Bonder sales channel, distributors, customers, research findings and conclusion.

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