Flip Chip Bonder Market Report – Research, Industry Analysis Reports and Market Demands

Global Flip Chip Bonder Market Research Report 2020 by Manufacturers, Regions, Types and Applications

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Table of Content

1 Report Overview

1.1 Definition
1.2 Manufacturers and Regions Overview
- 1.2.1 Manufacturers Overview
- 1.2.2 Regions Overview
1.3 Type Overview
1.4 Application Overview
1.5 Industrial Chain
- 1.5.1 Flip Chip Bonder Overall Industrial Chain
- 1.5.2 Upstream
- 1.5.3 Downstream
- 1.5.4 Economic/Political Environment

2 Global Flip Chip Bonder Market Assesment by Types

2.1 Overall Market Performance
- 2.1.1 Product Type Market Performance (Volume)
- 2.1.2 Product Type Market Performance (Value)
2.2 China Flip Chip Bonder Market Performance
2.3 USA Flip Chip Bonder Market Performance
2.4 Europe Flip Chip Bonder Market Performance
2.5 Japan Flip Chip Bonder Market Performance
2.6 Korea Flip Chip Bonder Market Performance
2.7 India Flip Chip Bonder Market Performance
2.8 Southeast Asia Flip Chip Bonder Market Performance
2.9 South America Flip Chip Bonder Market Performance

3 Global Flip Chip Bonder Market Assesment by Application

3.1 Overall Market Performance (Volume)
3.2 China Flip Chip Bonder Market Performance (Volume)
3.3 USA Flip Chip Bonder Market Performance (Volume)
3.4 Europe Flip Chip Bonder Market Performance (Volume)
3.5 Japan Flip Chip Bonder Market Performance (Volume)
3.6 Korea Flip Chip Bonder Market Performance (Volume)
3.7 India Flip Chip Bonder Market Performance (Volume)
3.8 Southeast Asia Flip Chip Bonder Market Performance (Volume)
3.9 South America Flip Chip Bonder Market Performance (Volume)

4 Competitive Analysis

4.1 Besi
- 4.1.1 Besi Profiles
- 4.1.2 Besi Product Information
- 4.1.3 Besi Flip Chip Bonder Production, Revenue, Price and Gross Margin
- 4.1.4 Besi Flip Chip Bonder Business Performance
- 4.1.5 SWOT Analysis
4.2 Kulicke & Soffa
- 4.2.1 Kulicke & Soffa Profiles
- 4.2.2 Kulicke & Soffa Product Information
- 4.2.3 Kulicke & Soffa Flip Chip Bonder Production, Revenue, Price and Gross Margin
- 4.2.4 Kulicke & Soffa Flip Chip Bonder Business Performance
- 4.2.5 SWOT Analysis
4.3 ASMPT
- 4.3.1 ASMPT Profiles
- 4.3.2 ASMPT Product Information
- 4.3.3 ASMPT Flip Chip Bonder Production, Revenue, Price and Gross Margin
- 4.3.4 ASMPT Flip Chip Bonder Business Performance
- 4.3.5 SWOT Analysis
4.4 Shinkawa
- 4.4.1 Shinkawa Profiles
- 4.4.2 Shinkawa Product Information
- 4.4.3 Shinkawa Flip Chip Bonder Production, Revenue, Price and Gross Margin
- 4.4.4 Shinkawa Flip Chip Bonder Business Performance
- 4.4.5 SWOT Analysis
4.5 Palomar
- 4.5.1 Palomar Profiles
- 4.5.2 Palomar Product Information
- 4.5.3 Palomar Flip Chip Bonder Production, Revenue, Price and Gross Margin
- 4.5.4 Palomar Flip Chip Bonder Business Performance
- 4.5.5 SWOT Analysis
4.6 Toray Engineering
- 4.6.1 Toray Engineering Profiles
- 4.6.2 Toray Engineering Product Information
- 4.6.3 Toray Engineering Flip Chip Bonder Production, Revenue, Price and Gross Margin
- 4.6.4 Toray Engineering Flip Chip Bonder Business Performance
- 4.6.5 SWOT Analysis
4.7 Panasonic
- 4.7.1 Panasonic Profiles
- 4.7.2 Panasonic Product Information
- 4.7.3 Panasonic Flip Chip Bonder Production, Revenue, Price and Gross Margin
- 4.7.4 Panasonic Flip Chip Bonder Business Performance
- 4.7.5 SWOT Analysis
4.8 Others
- 4.8.1 Others Profiles
- 4.8.2 Others Product Information
- 4.8.3 Others Flip Chip Bonder Production, Revenue, Price and Gross Margin
- 4.8.4 Others Flip Chip Bonder Business Performance
- 4.8.5 SWOT Analysis

5 Competitive Landscape

5.1 Global Flip Chip Bonder Production (K Units) and Market Share by Manufacturers (2014-2020)
5.2 Global Flip Chip Bonder Revenue (M USD) and Market Share by Manufacturers (2014-2020)
5.3 Global Flip Chip Bonder Price (USD/Unit) of Manufacturers (2014-2020)
5.4 Global Flip Chip Bonder Gross Margin of Manufacturers (2014-2020)
5.5 Market Concentration

6 Global Flip Chip Bonder Market Assessment by Regions

6.1 Global Flip Chip Bonder Production (K Units) and Market Share by Regions (2014-2020)
6.2 Global Flip Chip Bonder Revenue (M USD) and Market Share by Regions (2014-2020)
6.3 Global Flip Chip Bonder Price (USD/Unit) by Regions (2014-2020)
6.4 Global Flip Chip Bonder Gross Margin by Regions (2014-2020)

7 Flip Chip Bonder Regional Analysis

7.1 China Flip Chip Bonder Production, Revenue and Growth Rate (2014-2020)
7.2 USA Flip Chip Bonder Production, Revenue and Growth Rate (2014-2020)
7.3 Europe Flip Chip Bonder Production, Revenue and Growth Rate (2014-2020)
7.4 Japan Flip Chip Bonder Production, Revenue and Growth Rate (2014-2020)
7.5 Korea Flip Chip Bonder Production, Revenue and Growth Rate (2014-2020)
7.6 India Flip Chip Bonder Production, Revenue and Growth Rate (2014-2020)
7.7 Southeast Asia Flip Chip Bonder Production, Revenue and Growth Rate (2014-2020)
7.8 South America Flip Chip Bonder Production, Revenue and Growth Rate (2014-2020)

8 Global Flip Chip Bonder Consumption Assessment

8.1 Global Flip Chip Bonder Consumption and Market Share by Regions (2014-2020)
8.2 Global Flip Chip Bonder Consumption Value and Market Share by Regions (2014-2020)
8.3 Global Flip Chip Bonder Average Price (USD/Unit) by Regions (2014-2020)

9 Global Flip Chip Bonder Sales Assessment by Regions

9.1 Global Flip Chip Bonder Sales and Sales Value (2014-2020)
9.2 China Flip Chip Bonder Sales and Sales Value (2014-2020)
9.3 USA Flip Chip Bonder Sales and Sales Value (2014-2020)
9.4 Europe Flip Chip Bonder Sales and Sales Value (2014-2020)
9.5 Japan Flip Chip Bonder Sales and Sales Value (2014-2020)
9.6 Korea Flip Chip Bonder Sales and Sales Value (2014-2020)
9.7 India Flip Chip Bonder Sales and Sales Value (2014-2020)
9.8 Southeast Asia Flip Chip Bonder Sales and Sales Value (2014-2020)
9.9 South America Flip Chip Bonder Sales and Sales Value (2014-2020)

10 Technology and Cost

10.1 Technology
10.2 Cost

11 Channel Analysis

11.1 Market Channel
11.2 Distributors

12 Market Forecast 2021-2026

13 Conclusion

Description

In this report,global Flip Chip Bonder Market will reach 361.37 Million USD by the end of 2022 with a CAGR of 0.82%

The global Flip Chip Bonder market is valued at 346.97 Million USD in 2017 and will reach 361.37 Million USD by the end of 2022, growing at a CAGR of 0.82% during 2017-2022.

Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:

Flip Chip Bonder can be divided into two categories--fully automatic flip chip bonder and semi-automatic flip chip bonder. Fully automatic flip chip bonder’s production market share accounted for the highest proportion, with a figure of 75.18% in 2017, semi-automatic flip chip bonder account for 24.82%.

The consumption market share of global Flip Chip Bonder in IDMs use and OSAT use have been stable year by year, at 89.26% and 10.74% respectively in 2017, and for several consecutive years, the amplitude was within 2 percent. This indicates that the segment of the Flip Chip Bonder in the global market tends to be fixed without great changes. Among them, the Flip Chip Bonder market has the most promising sales prospects in IDMs use.

XYZ research center data shows that Europe is the biggest contributor to the Flip Chip Bonder revenue market, accounted for 36.70% of the total global market with a revenue of 127.35 million USD in 2017, followed by North America, 20.30% with a revenue of 70.42million USD.

Besi is the largest company in the global Flip Chip Bonder market, accounted for 32.82% of the revenue market share in 2017, followed by Kulicke & Soffa and Shinkawa, accounted for 20.30% and 10.84% of the revenue market share in 2017. The top five producers account for above 80 % of the revenue market. Despite the presence of competition problems, investors are still optimistic about this area, in future still more new investment will enter into the field. Technology and cost are two major problems.

Geographically, global Flip Chip Bonder market competition by top manufacturers, with production, price, revenue (value) and market share for each manufacturer; the top players including
Besi
Kulicke & Soffa
ASMPT
Shinkawa
Palomar
Toray Engineering
Panasonic
Others

On the basis of product, we research the production, revenue, price, market share and growth rate, primarily split into
Fully Automatic
Semi-Automatic
For the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate of Flip Chip Bonder for each application, including
IDMs
OSAT
Production, consumption, revenue, market share and growth rate are the key targets for Flip Chip Bonder from 2014 to 2026 (forecast) in these regions
China
USA
Europe
Japan
Korea
India
Southeast Asia
South America

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