Global Flip Chip Bonder Market Data Survey Report 2013-2025
Table of Contents
1 Global Market Overview
- 1.1 Scope of Statistics
- 1.1.1 Scope of Products
- 1.1.2 Scope of Manufacturers
- 1.1.3 Scope of Application
- 1.1.4 Scope of Type
- 1.1.5 Scope of Regions/Countries
- 1.2 Global Market Size
2 Regional Market
- 2.1 Regional Production
- 2.2 Regional Demand
- 2.3 Regional Trade
3 Key Manufacturers
- 3.1 Besi
- 3.1.1 Company Information
- 3.1.2 Product & Services
- 3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
- 3.1.4 Recent Development
- 3.2 ASM Pacific Technology
- 3.2.1 Company Information
- 3.2.2 Product & Services
- 3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
- 3.2.4 Recent Development
- 3.3 Shibaura
- 3.3.1 Company Information
- 3.3.2 Product & Services
- 3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
- 3.3.4 Recent Development
- 3.4 Muehlbauer
- 3.4.1 Company Information
- 3.4.2 Product & Services
- 3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
- 3.4.4 Recent Development
- 3.5 Kulicke & Soffa
- 3.5.1 Company Information
- 3.5.2 Product & Services
- 3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
- 3.5.4 Recent Development
- 3.6 Hamni
- 3.6.1 Company Information
- 3.6.2 Product & Services
- 3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
- 3.6.4 Recent Development
- 3.7 AMICRA Microtechnologies
- 3.7.1 Company Information
- 3.7.2 Product & Services
- 3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
- 3.8 SET
- 3.8.1 Company Information
- 3.8.2 Product & Services
- 3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
4 Major Application
- 4.1 IDMs
- 4.1.1 Overview
- 4.1.2 IDMs Market Size and Forecast
- 4.2 OSAT
- 4.2.1 Overview
- 4.2.2 OSAT Market Size and Forecast
5 Market by Type
5.By Fully Automatic
- 5.1 Fully Automatic
- 5.1.1 Overview
- 5.1.2 Fully Automatic Market Size and Forecast
- 5.2 Semi-Automatic
- 5.2.1 Overview
- 5.2.2 Semi-Automatic Market Size and Forecast
6 Price Overview
- 6.1 Price by Manufacturers
- 6.2 Price by Application
- 6.3 Price by Type
7 Conclusion
Summary
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
The global Flip Chip Bonder market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including:
Global market size and forecast
Regional market size, production data and export & import
Key manufacturers profile, products & services, sales data of business
Global market size by Major Application
Global market size by Major Type
Key manufacturers are included based on company profile, sales data and product specifications etc.:
Besi
ASM Pacific Technology
Shibaura
Muehlbauer
Kulicke & Soffa
Hamni
AMICRA Microtechnologies
SET
Major applications as follows:
IDMs
OSAT
Major Type as follows:
Fully Automatic
Semi-Automatic
Regional market size, production data and export & import:
Asia-Pacific
North America
Europe
South America
Middle East & Africa