Epoxy Molding Compound (EMC) for Advanced Packaging Market Report – Research, Industry Analysis Reports and Market Demands

Global Epoxy Molding Compound (EMC) for Advanced Packaging Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032

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Table of Content

1 Market Overview

1.1 Product Overview and Scope
1.2 Market Estimation Caveats and Base Year
1.3 Market Analysis by Type
- 1.3.1 Overview: Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value by Type: 2021 Versus 2025 Versus 2032
- 1.3.2 Liquid Molding Compounds (LMC)
- 1.3.3 Granular/Powder EMC
- 1.3.4 Sheet and Film-type EMC
1.4 Market Analysis by Process
- 1.4.1 Overview: Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value by Process: 2021 Versus 2025 Versus 2032
- 1.4.2 Transfer Molding Grade
- 1.4.3 Compression Molding Grade
- 1.4.4 Sheet and Film Molding Grade
1.5 Market Analysis by Application
- 1.5.1 Overview: Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value by Application: 2021 Versus 2025 Versus 2032
- 1.5.2 Fan-Out Wafer-Level Packaging
- 1.5.3 Fan-Out Panel-Level Packaging
- 1.5.4 Flip-Chip BGA and CSP Packaging
- 1.5.5 System-in-Package
- 1.5.6 2.5D and 3D Integration Packaging
- 1.5.7 Chiplet Packaging
- 1.5.8 High Bandwidth Memory and Stacked Memory Packaging
- 1.5.9 Others
1.6 Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Size & Forecast
- 1.6.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value (2021 & 2025 & 2032)
- 1.6.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity (2021-2032)
- 1.6.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Average Price (2021-2032)

2 Manufacturers Profiles

3 Competitive Environment: Epoxy Molding Compound (EMC) for Advanced Packaging by Manufacturer

3.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Manufacturer (2021-2026)
3.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Revenue by Manufacturer (2021-2026)
3.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Average Price by Manufacturer (2021-2026)
3.4 Market Share Analysis (2025)
- 3.4.1 Producer Shipments of Epoxy Molding Compound (EMC) for Advanced Packaging by Manufacturer Revenue ($MM) and Market Share (%): 2025
- 3.4.2 Top 3 Epoxy Molding Compound (EMC) for Advanced Packaging Manufacturer Market Share in 2025
- 3.4.3 Top 6 Epoxy Molding Compound (EMC) for Advanced Packaging Manufacturer Market Share in 2025
3.5 Epoxy Molding Compound (EMC) for Advanced Packaging Market: Overall Company Footprint Analysis
- 3.5.1 Epoxy Molding Compound (EMC) for Advanced Packaging Market: Region Footprint
- 3.5.2 Epoxy Molding Compound (EMC) for Advanced Packaging Market: Company Product Type Footprint
- 3.5.3 Epoxy Molding Compound (EMC) for Advanced Packaging Market: Company Product Application Footprint
3.6 New Market Entrants and Barriers to Market Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

4.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Size by Region
- 4.1.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Region (2021-2032)
- 4.1.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value by Region (2021-2032)
- 4.1.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Average Price by Region (2021-2032)
4.2 North America Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value (2021-2032)
4.3 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value (2021-2032)
4.4 Asia-Pacific Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value (2021-2032)
4.5 South America Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value (2021-2032)
4.6 Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value (2021-2032)

5 Market Segment by Type

5.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Type (2021-2032)
5.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value by Type (2021-2032)
5.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Average Price by Type (2021-2032)

6 Market Segment by Application

6.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Application (2021-2032)
6.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value by Application (2021-2032)
6.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Average Price by Application (2021-2032)

7 North America

7.1 North America Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Type (2021-2032)
7.2 North America Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Application (2021-2032)
7.3 North America Epoxy Molding Compound (EMC) for Advanced Packaging Market Size by Country
- 7.3.1 North America Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Country (2021-2032)
- 7.3.2 North America Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value by Country (2021-2032)
- 7.3.3 United States Market Size and Forecast (2021-2032)
- 7.3.4 Canada Market Size and Forecast (2021-2032)
- 7.3.5 Mexico Market Size and Forecast (2021-2032)

8 Europe

8.1 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Type (2021-2032)
8.2 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Application (2021-2032)
8.3 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Market Size by Country
- 8.3.1 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Country (2021-2032)
- 8.3.2 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value by Country (2021-2032)
- 8.3.3 Germany Market Size and Forecast (2021-2032)
- 8.3.4 France Market Size and Forecast (2021-2032)
- 8.3.5 United Kingdom Market Size and Forecast (2021-2032)
- 8.3.6 Russia Market Size and Forecast (2021-2032)
- 8.3.7 Italy Market Size and Forecast (2021-2032)

9 Asia-Pacific

9.1 Asia-Pacific Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Type (2021-2032)
9.2 Asia-Pacific Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Application (2021-2032)
9.3 Asia-Pacific Epoxy Molding Compound (EMC) for Advanced Packaging Market Size by Region
- 9.3.1 Asia-Pacific Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Region (2021-2032)
- 9.3.2 Asia-Pacific Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value by Region (2021-2032)
- 9.3.3 China Market Size and Forecast (2021-2032)
- 9.3.4 Japan Market Size and Forecast (2021-2032)
- 9.3.5 South Korea Market Size and Forecast (2021-2032)
- 9.3.6 India Market Size and Forecast (2021-2032)
- 9.3.7 Southeast Asia Market Size and Forecast (2021-2032)
- 9.3.8 Australia Market Size and Forecast (2021-2032)

10 South America

10.1 South America Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Type (2021-2032)
10.2 South America Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Application (2021-2032)
10.3 South America Epoxy Molding Compound (EMC) for Advanced Packaging Market Size by Country
- 10.3.1 South America Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Country (2021-2032)
- 10.3.2 South America Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value by Country (2021-2032)
- 10.3.3 Brazil Market Size and Forecast (2021-2032)
- 10.3.4 Argentina Market Size and Forecast (2021-2032)

11 Middle East & Africa

11.1 Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Type (2021-2032)
11.2 Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Application (2021-2032)
11.3 Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Market Size by Country
- 11.3.1 Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Sales Quantity by Country (2021-2032)
- 11.3.2 Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Value by Country (2021-2032)
- 11.3.3 Turkey Market Size and Forecast (2021-2032)
- 11.3.4 Egypt Market Size and Forecast (2021-2032)
- 11.3.5 Saudi Arabia Market Size and Forecast (2021-2032)
- 11.3.6 South Africa Market Size and Forecast (2021-2032)

12 Market Dynamics

12.1 Epoxy Molding Compound (EMC) for Advanced Packaging Market Drivers
12.2 Epoxy Molding Compound (EMC) for Advanced Packaging Market Restraints
12.3 Epoxy Molding Compound (EMC) for Advanced Packaging Trends Analysis
12.4 Porters Five Forces Analysis
- 12.4.1 Threat of New Entrants
- 12.4.2 Bargaining Power of Suppliers
- 12.4.3 Bargaining Power of Buyers
- 12.4.4 Threat of Substitutes
- 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

13.1 Raw Material of Epoxy Molding Compound (EMC) for Advanced Packaging and Key Manufacturers
13.2 Manufacturing Costs Percentage of Epoxy Molding Compound (EMC) for Advanced Packaging
13.3 Epoxy Molding Compound (EMC) for Advanced Packaging Production Process
13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

14.1 Sales Channel
- 14.1.1 Direct to End-User
- 14.1.2 Distributors
14.2 Epoxy Molding Compound (EMC) for Advanced Packaging Typical Distributors
14.3 Epoxy Molding Compound (EMC) for Advanced Packaging Typical Customers

15 Research Findings and Conclusion

16 Appendix

16.1 Methodology
16.2 Research Process and Data Source

Description

According to our (Global Info Research) latest study, the global Epoxy Molding Compound (EMC) for Advanced Packaging market size was valued at US$ 712 million in 2025 and is forecast to a readjusted size of US$ 1080 million by 2032 with a CAGR of 6.2% during review period.
Epoxy molding compounds for advanced packaging are thermosetting composite materials based on epoxy resin, formulated with curing agents, inorganic fillers (such as silica), and additives—including accelerators, coupling agents, mold release agents, flame retardants, and performance modifiers. They are used to encapsulate, fill gaps, or perform molded underfill on wafers, reconstituted wafers, panels, chips, interconnect structures, and packaging substrates via processes such as transfer molding, compression molding, vacuum molding, or film-assisted molding. Their primary functions include providing electrical insulation, mechanical support, protection against moisture and contamination, interconnect protection, and thermomechanical stress management. Furthermore, through designs featuring low warpage, low thermal expansion, low stress, high thermal conductivity, fine fillers, high purity, and high reliability, they meet the packaging requirements of FOWLP, FOPLP, FC-BGA, FC-CSP, SiP, MUF, stacked memory, Chiplets, 2.5D/3D heterogeneous integration, and advanced power modules.
This report focuses on molding materials used directly in FOWLP, FOPLP, flip-chip BGA/CSP, molded underfill (MUF), system-in-package (SiP), high-bandwidth memory (HBM), chiplet packaging, 2.5D/3D integration, and advanced power modules. Compared with conventional EMC, this market has a smaller volume base, but liquid compression molding materials, molded underfill compounds, and film-type products generally command higher unit values. As semiconductor packaging evolves from single-die protection toward multi-die system integration, EMC is also transitioning from an external protective material into a critical structural material that directly affects package warpage, interconnect reliability, die shift, mold-flow defects, and overall packaging yield.
From the supply perspective, the global advanced-packaging EMC market remains strongly dominated by Japanese companies. Sumitomo Bakelite, Resonac, Panasonic Industry, NAMICS, Shin-Etsu Chemical, and Kyocera collectively cover multiple product routes, including conventional solid EMC, granular compression molding compounds, molded underfill materials, liquid molding compounds, and sheet-type materials. These suppliers maintain leading positions through long-established formulation expertise, extensive qualification experience with semiconductor packaging customers, and localized manufacturing capabilities across Asia.
From the demand perspective, AI accelerators, high-performance computing, HBM, chiplet architectures, and multi-die heterogeneous integration are expected to represent the primary sources of incremental growth over the next several years. Advanced packaging integrates more logic dies, memory devices, interposers, and interconnect structures within a single package. Larger package dimensions, increased die-stacking levels, and narrower interconnect pitches require molding materials to simultaneously provide low warpage, low stress, fine-gap filling capability, strong adhesion, and high reliability. Industry developments disclosed by SEMI indicate that semiconductor capital expenditure since 2025 has continued to shift toward advanced logic, HBM, and advanced packaging, with AI and high-performance computing becoming major investment drivers for 2.5D, 3D, fan-out, and chiplet technologies. At the same time, vehicle electrification and industrial power electronics are driving SiC, GaN, and highly integrated power modules toward higher junction temperatures and greater power density, creating a separate growth pathway for high-Tg, thermally conductive, and low-stress EMC products.
Report Scope
This report is a detailed and comprehensive analysis for global Epoxy Molding Compound (EMC) for Advanced Packaging market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Epoxy Molding Compound (EMC) for Advanced Packaging market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2021-2032
Global Epoxy Molding Compound (EMC) for Advanced Packaging market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2021-2032
Global Epoxy Molding Compound (EMC) for Advanced Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2021-2032
Global Epoxy Molding Compound (EMC) for Advanced Packaging market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Epoxy Molding Compound (EMC) for Advanced Packaging
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Epoxy Molding Compound (EMC) for Advanced Packaging market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Sumitomo Bakelite Co., Ltd., Resonac Corporation, Panasonic Industry Co., Ltd., Samsung SDI Co., Ltd., Henkel AG & Co. KGaA, NAMICS Corporation, KCC Corporation, Shin-Etsu Chemical Co., Ltd., Kyocera Corporation, Jiangsu Zhongke Kehua New Materials Co., Ltd., etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Epoxy Molding Compound (EMC) for Advanced Packaging market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Liquid Molding Compounds (LMC)
Granular/Powder EMC
Sheet and Film-type EMC
Market segment by Process
Transfer Molding Grade
Compression Molding Grade
Sheet and Film Molding Grade
Market segment by Application
Fan-Out Wafer-Level Packaging
Fan-Out Panel-Level Packaging
Flip-Chip BGA and CSP Packaging
System-in-Package
2.5D and 3D Integration Packaging
Chiplet Packaging
High Bandwidth Memory and Stacked Memory Packaging
Others
Major players covered
Sumitomo Bakelite Co., Ltd.
Resonac Corporation
Panasonic Industry Co., Ltd.
Samsung SDI Co., Ltd.
Henkel AG & Co. KGaA
NAMICS Corporation
KCC Corporation
Shin-Etsu Chemical Co., Ltd.
Kyocera Corporation
Jiangsu Zhongke Kehua New Materials Co., Ltd.
Jiangsu HHCK Advanced Materials Co., Ltd.
Eternal Materials Co., Ltd.
Sanyu Rec Co., Ltd.
PhiChem Corporation
WaferChem Technology Corporation
SP Samhwa Co., Ltd.
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
Chapter Outline
Chapter 1, to describe Epoxy Molding Compound (EMC) for Advanced Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Epoxy Molding Compound (EMC) for Advanced Packaging, with price, sales quantity, revenue, and global market share of Epoxy Molding Compound (EMC) for Advanced Packaging from 2021 to 2026.
Chapter 3, the Epoxy Molding Compound (EMC) for Advanced Packaging competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Epoxy Molding Compound (EMC) for Advanced Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and Epoxy Molding Compound (EMC) for Advanced Packaging market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Epoxy Molding Compound (EMC) for Advanced Packaging.
Chapter 14 and 15, to describe Epoxy Molding Compound (EMC) for Advanced Packaging sales channel, distributors, customers, research findings and conclusion.

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