Global Electronic Printed Circuit Board (PCB) Market Research Report 2012-2024
Table of Contents
1 Market Overview
- 1.1 Objectives of Research
- 1.1.1 Definition
- 1.1.2 Specifications
- 1.2 Market Segment
- 1.2.1 by Type
- 1.2.1.1 Rigid 1-2Sided
- 1.2.1.2 Standard Multilayer
- 1.2.1.3 HDI/Microvia/Build-Up
- 1.2.1.4 IC Substrate
- 1.2.1.5 Flexible Circuits
- 1.2.1.6 Rigid Flex
- 1.2.2 by Application
- 1.2.2.1 Consumer electronics
- 1.2.2.2 Computer
- 1.2.2.3 Communications
- 1.2.2.4 Industrial/Medical
- 1.2.2.5 Automotive
- 1.2.2.6 Military/Aerospace
- 1.2.3 by Regions
- 1.2.1 by Type
2 Industry Chain
- 2.1 Industry Chain Structure
- 2.2 Upstream
- 2.3 Market
- 2.3.1 SWOT
- 2.3.2 Dynamics
3 Environmental Analysis
- 3.1 Policy
- 3.2 Economic
- 3.3 Technology
- 3.4 Market Entry
4 Market Segmentation by Type
- 4.1 Market Size
- 4.1.1 Rigid 1-2Sided Market, 2013-2018
- 4.1.2 Standard Multilayer Market, 2013-2018
- 4.1.3 HDI/Microvia/Build-Up Market, 2013-2018
- 4.1.4 IC Substrate Market, 2013-2018
- 4.1.5 Flexible Circuits Market, 2013-2018
- 4.1.6 Rigid Flex Market, 2013-2018
- 4.2 Market Forecast
- 4.2.1 Rigid 1-2Sided Market Forecast, 2019-2024
- 4.2.2 Standard Multilayer Market Forecast, 2019-2024
- 4.2.3 HDI/Microvia/Build-Up Market Forecast, 2019-2024
- 4.2.4 IC Substrate Market Forecast, 2019-2024
- 4.2.5 Flexible Circuits Market Forecast, 2019-2024
- 4.2.6 Rigid Flex Market Forecast, 2019-2024
5 Market Segmentation by Application
- 5.1 Market Size
- 5.1.1 Consumer electronics Market, 2013-2018
- 5.1.2 Computer Market, 2013-2018
- 5.1.3 Communications Market, 2013-2018
- 5.1.4 Industrial/Medical Market, 2013-2018
- 5.1.5 Automotive Market, 2013-2018
- 5.1.6 Military/Aerospace Market, 2013-2018
- 5.2 Market Forecast
- 5.2.1 Consumer electronics Market Forecast, 2019-2024
- 5.2.2 Computer Market Forecast, 2019-2024
- 5.2.3 Communications Market Forecast, 2019-2024
- 5.2.4 Industrial/Medical Market Forecast, 2019-2024
- 5.2.5 Automotive Market Forecast, 2019-2024
- 5.2.6 Military/Aerospace Market Forecast, 2019-2024
6 Market Segmentation by Region
- 6.1 Market Size
- 6.1.1 Asia-Pacific
- 6.1.1.1 Asia-Pacific Market, 2012-2018
- 6.1.1.2 Asia-Pacific Market by Type
- 6.1.1.3 Asia-Pacific Market by Application
- 6.1.2 North America
- 6.1.2.1 North America Market, 2012-2018
- 6.1.2.2 North America Market by Type
- 6.1.2.3 North America Market by Application
- 6.1.3 Europe
- 6.1.3.1 Europe Market, 2012-2018
- 6.1.3.2 Europe Market by Type
- 6.1.3.3 Europe Market by Application
- 6.1.4 South America
- 6.1.4.1 South America Market, 2012-2018
- 6.1.4.2 South America Market by Type
- 6.1.4.3 South America Market by Application
- 6.1.5 Middle East & Africa
- 6.1.5.1 Middle East & Africa Market, 2012-2018
- 6.1.5.2 Middle East & Africa Market by Type
- 6.1.5.3 Middle East & Africa Market by Application
- 6.1.1 Asia-Pacific
- 6.2 Market Forecast
- 6.2.1 Asia-Pacific Market Forecast, 2019-2024
- 6.2.2 North America Market Forecast, 2019-2024
- 6.2.3 Europe Market Forecast, 2019-2024
- 6.2.4 South America Market Forecast, 2019-2024
- 6.2.5 Middle East & Africa Market Forecast, 2019-2024
7 Market Competitive
- 7.1 Global Market by Vendors
- 7.2 Market Concentration
- 7.3 Price & Factors
- 7.4 Marketing Channel
8 Major Vendors
- 8.1 Nippon Mektron
- 8.2 Unimicron
- 8.3 SEMCO
- 8.4 Young Poong Group.
- 8.5 Ibiden
- 8.6 ZDT
- 8.7 Tripod
- 8.8 TTM
- 8.9 SEI
- 8.10 Daeduck Group
- 8.11 HannStar Board (GBM)
- 8.12 Viasystems
- 8.13 Nanya PCB
- 8.14 CMK Corporation
- 8.15 Shinko Electric Ind
- 8.16 Compeq
- 8.17 AT&S
- 8.18 Kingboard
- 8.19 Ellington
- 8.20 Junda Electronic
- 8.21 CCTC
- 8.22 Redboard
- 8.23 Wuzhou Group
- 8.24 Kinwong
- 8.25 Aoshikang
- 8.26 Shennan Circuits
9 Conclusion
Summary
The global Electronic Printed Circuit Board (PCB) market will reach xxx Million USD in 2019 with CAGR xx% 2019-2024. The objective of report is to define, segment, and project the market on the basis of product type, application, and region, and to describe the content about the factors influencing market dynamics, policy, economic, technology and market entry etc.
Based on products type, the report describes major products type share of regional market. Products mentioned as follows:
Rigid 1-2Sided
Standard Multilayer
HDI/Microvia/Build-Up
IC Substrate
Flexible Circuits
Rigid Flex
Leading vendors in the market are included based on profile, business performance etc. Vendors mentioned as follows:
Nippon Mektron
Unimicron
SEMCO
Young Poong Group.
Ibiden
ZDT
Tripod
TTM
SEI
Daeduck Group
HannStar Board (GBM)
Viasystems
Nanya PCB
CMK Corporation
Shinko Electric Ind
Compeq
AT&S
Kingboard
Ellington
Junda Electronic
CCTC
Redboard
Wuzhou Group
Kinwong
Aoshikang
Shennan Circuits
Based on Application, the report describes major application share of regional market. Application mentioned as follows:
Consumer electronics
Computer
Communications
Industrial/Medical
Automotive
Military/Aerospace
Based on region, the report describes major regions market by products and application. Regions mentioned as follows:
Asia-Pacific
North America
Europe
South America
Middle East & Africa