This report studies the Electronic Packaging Materials market.
Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit.
Electronic packaging refers to the enclosure for integrated circuit (IC) chips, passive devices, the fabrication of circuit cards and the production of a final product or system. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Scope of the Report:
This report focuses on the Electronic Packaging Materials in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
In 2017, Global Electronic Packaging Materials total market size was 4885.6 Million USD, with a steady growth in recent years, according to QYR analysis, the market is expected to reach 6104.9 Million USD by the end of 2023. One of the salient features of Electronic Packaging Materials market is the cooperation with downstream Semiconductor & IC and PCB manufactures, especially for large companies in this industry.
Geographically, the consumption market is leading by Greater China and United States, Europe and Japan. In terms of year 2017, Greater China holds the largest market share, with about 1975.5 Million USD sales revenue, followed by United States, with about 14.76% market share in 2017. China will keep playing important role in Global market.
The worldwide market for Electronic Packaging Materials is expected to grow at a CAGR of roughly 3.6% over the next five years, will reach 6050 million US$ in 2023, from 4890 million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
Shinko Electric Industries
Leatec Fine Ceramics
Dai Nippon Printing
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Market Segment by Applications, can be divided into
Semiconductor & IC
There are 15 Chapters to deeply display the global Electronic Packaging Materials market.
Chapter 1, to describe Electronic Packaging Materials Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Electronic Packaging Materials, with sales, revenue, and price of Electronic Packaging Materials, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Electronic Packaging Materials, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Electronic Packaging Materials market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Electronic Packaging Materials sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source