Report Detail
Global Electronic Circuit Board Level Underfill Material Market Professional Survey Report 2019
- RnM3760787 |
- 18 September, 2019 |
- Global |
- 111 Pages |
- QYResearch |
- Chemical & Material
The development of underfill technology is driven by the advances of the flip-chip technology and are generally epoxies that are loaded with a filler such as silica. Underfill materials offer stress relieving to solder joints, extend thermal aging and lifetime of device. Underfill technology is used to distribute and redistribute the thermo-mechanical stress created by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate. These underfill are made from different materials such as epoxy, silica, alumina, urethane and many others.
The capillary fills sub segment is projected to grow at a relatively slow value CAGR of 4.4% during the said period.
The global Electronic Circuit Board Level Underfill Material market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Electronic Circuit Board Level Underfill Material volume and value at global level, regional level and company level. From a global perspective, this report represents overall Electronic Circuit Board Level Underfill Material market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Electronic Circuit Board Level Underfill Material in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Electronic Circuit Board Level Underfill Material manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Henkel
Namics
AI Technology
Protavic
H.B. Fuller
ASE
Hitachi
Indium
Zymet
YINCAE
LORD
Sanyu Rec
Dow
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
Quartz/Silicone
Alumina Based
Epoxy Based
Urethane Based
Acrylic Based
Others
Segment by Application
CSP (Chip Scale Package
BGA (Ball Grid array)
Flip Chips
Table of Contents
Executive Summary
1 Industry Overview of Electronic Circuit Board Level Underfill Material
- 1.1 Definition of Electronic Circuit Board Level Underfill Material
- 1.2 Electronic Circuit Board Level Underfill Material Segment by Type
- 1.2.1 Global Electronic Circuit Board Level Underfill Material Production Growth Rate Comparison by Types (2014-2025)
- 1.2.2 Quartz/Silicone
- 1.2.3 Alumina Based
- 1.2.4 Epoxy Based
- 1.2.5 Urethane Based
- 1.2.6 Acrylic Based
- 1.2.7 Others
- 1.3 Electronic Circuit Board Level Underfill Material Segment by Applications
- 1.3.1 Global Electronic Circuit Board Level Underfill Material Consumption Comparison by Applications (2014-2025)
- 1.3.2 CSP (Chip Scale Package
- 1.3.3 BGA (Ball Grid array)
- 1.3.4 Flip Chips
- 1.4 Global Electronic Circuit Board Level Underfill Material Overall Market
- 1.4.1 Global Electronic Circuit Board Level Underfill Material Revenue (2014-2025)
- 1.4.2 Global Electronic Circuit Board Level Underfill Material Production (2014-2025)
- 1.4.3 North America Electronic Circuit Board Level Underfill Material Status and Prospect (2014-2025)
- 1.4.4 Europe Electronic Circuit Board Level Underfill Material Status and Prospect (2014-2025)
- 1.4.5 China Electronic Circuit Board Level Underfill Material Status and Prospect (2014-2025)
- 1.4.6 Japan Electronic Circuit Board Level Underfill Material Status and Prospect (2014-2025)
- 1.4.7 Southeast Asia Electronic Circuit Board Level Underfill Material Status and Prospect (2014-2025)
- 1.4.8 India Electronic Circuit Board Level Underfill Material Status and Prospect (2014-2025)
2 Manufacturing Cost Structure Analysis
- 2.1 Raw Material and Suppliers
- 2.2 Manufacturing Cost Structure Analysis of Electronic Circuit Board Level Underfill Material
- 2.3 Manufacturing Process Analysis of Electronic Circuit Board Level Underfill Material
- 2.4 Industry Chain Structure of Electronic Circuit Board Level Underfill Material
3 Development and Manufacturing Plants Analysis of Electronic Circuit Board Level Underfill Material
- 3.1 Capacity and Commercial Production Date
- 3.2 Global Electronic Circuit Board Level Underfill Material Manufacturing Plants Distribution
- 3.3 Major Manufacturers Technology Source and Market Position of Electronic Circuit Board Level Underfill Material
- 3.4 Recent Development and Expansion Plans
4 Key Figures of Major Manufacturers
- 4.1 Electronic Circuit Board Level Underfill Material Production and Capacity Analysis
- 4.2 Electronic Circuit Board Level Underfill Material Revenue Analysis
- 4.3 Electronic Circuit Board Level Underfill Material Price Analysis
- 4.4 Market Concentration Degree
5 Electronic Circuit Board Level Underfill Material Regional Market Analysis
- 5.1 Electronic Circuit Board Level Underfill Material Production by Regions
- 5.1.1 Global Electronic Circuit Board Level Underfill Material Production by Regions
- 5.1.2 Global Electronic Circuit Board Level Underfill Material Revenue by Regions
- 5.2 Electronic Circuit Board Level Underfill Material Consumption by Regions
- 5.3 North America Electronic Circuit Board Level Underfill Material Market Analysis
- 5.3.1 North America Electronic Circuit Board Level Underfill Material Production
- 5.3.2 North America Electronic Circuit Board Level Underfill Material Revenue
- 5.3.3 Key Manufacturers in North America
- 5.3.4 North America Electronic Circuit Board Level Underfill Material Import and Export
- 5.4 Europe Electronic Circuit Board Level Underfill Material Market Analysis
- 5.4.1 Europe Electronic Circuit Board Level Underfill Material Production
- 5.4.2 Europe Electronic Circuit Board Level Underfill Material Revenue
- 5.4.3 Key Manufacturers in Europe
- 5.4.4 Europe Electronic Circuit Board Level Underfill Material Import and Export
- 5.5 China Electronic Circuit Board Level Underfill Material Market Analysis
- 5.5.1 China Electronic Circuit Board Level Underfill Material Production
- 5.5.2 China Electronic Circuit Board Level Underfill Material Revenue
- 5.5.3 Key Manufacturers in China
- 5.5.4 China Electronic Circuit Board Level Underfill Material Import and Export
- 5.6 Japan Electronic Circuit Board Level Underfill Material Market Analysis
- 5.6.1 Japan Electronic Circuit Board Level Underfill Material Production
- 5.6.2 Japan Electronic Circuit Board Level Underfill Material Revenue
- 5.6.3 Key Manufacturers in Japan
- 5.6.4 Japan Electronic Circuit Board Level Underfill Material Import and Export
- 5.7 Southeast Asia Electronic Circuit Board Level Underfill Material Market Analysis
- 5.7.1 Southeast Asia Electronic Circuit Board Level Underfill Material Production
- 5.7.2 Southeast Asia Electronic Circuit Board Level Underfill Material Revenue
- 5.7.3 Key Manufacturers in Southeast Asia
- 5.7.4 Southeast Asia Electronic Circuit Board Level Underfill Material Import and Export
- 5.8 India Electronic Circuit Board Level Underfill Material Market Analysis
- 5.8.1 India Electronic Circuit Board Level Underfill Material Production
- 5.8.2 India Electronic Circuit Board Level Underfill Material Revenue
- 5.8.3 Key Manufacturers in India
- 5.8.4 India Electronic Circuit Board Level Underfill Material Import and Export
6 Electronic Circuit Board Level Underfill Material Segment Market Analysis (by Type)
- 6.1 Global Electronic Circuit Board Level Underfill Material Production by Type
- 6.2 Global Electronic Circuit Board Level Underfill Material Revenue by Type
- 6.3 Electronic Circuit Board Level Underfill Material Price by Type
7 Electronic Circuit Board Level Underfill Material Segment Market Analysis (by Application)
- 7.1 Global Electronic Circuit Board Level Underfill Material Consumption by Application
- 7.2 Global Electronic Circuit Board Level Underfill Material Consumption Market Share by Application (2014-2019)
8 Electronic Circuit Board Level Underfill Material Major Manufacturers Analysis
- 8.1 Henkel
- 8.1.1 Henkel Electronic Circuit Board Level Underfill Material Production Sites and Area Served
- 8.1.2 Henkel Product Introduction, Application and Specification
- 8.1.3 Henkel Electronic Circuit Board Level Underfill Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.1.4 Main Business and Markets Served
- 8.2 Namics
- 8.2.1 Namics Electronic Circuit Board Level Underfill Material Production Sites and Area Served
- 8.2.2 Namics Product Introduction, Application and Specification
- 8.2.3 Namics Electronic Circuit Board Level Underfill Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.2.4 Main Business and Markets Served
- 8.3 AI Technology
- 8.3.1 AI Technology Electronic Circuit Board Level Underfill Material Production Sites and Area Served
- 8.3.2 AI Technology Product Introduction, Application and Specification
- 8.3.3 AI Technology Electronic Circuit Board Level Underfill Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.3.4 Main Business and Markets Served
- 8.4 Protavic
- 8.4.1 Protavic Electronic Circuit Board Level Underfill Material Production Sites and Area Served
- 8.4.2 Protavic Product Introduction, Application and Specification
- 8.4.3 Protavic Electronic Circuit Board Level Underfill Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.4.4 Main Business and Markets Served
- 8.5 H.B. Fuller
- 8.5.1 H.B. Fuller Electronic Circuit Board Level Underfill Material Production Sites and Area Served
- 8.5.2 H.B. Fuller Product Introduction, Application and Specification
- 8.5.3 H.B. Fuller Electronic Circuit Board Level Underfill Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.5.4 Main Business and Markets Served
- 8.6 ASE
- 8.6.1 ASE Electronic Circuit Board Level Underfill Material Production Sites and Area Served
- 8.6.2 ASE Product Introduction, Application and Specification
- 8.6.3 ASE Electronic Circuit Board Level Underfill Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.6.4 Main Business and Markets Served
- 8.7 Hitachi
- 8.7.1 Hitachi Electronic Circuit Board Level Underfill Material Production Sites and Area Served
- 8.7.2 Hitachi Product Introduction, Application and Specification
- 8.7.3 Hitachi Electronic Circuit Board Level Underfill Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.7.4 Main Business and Markets Served
- 8.8 Indium
- 8.8.1 Indium Electronic Circuit Board Level Underfill Material Production Sites and Area Served
- 8.8.2 Indium Product Introduction, Application and Specification
- 8.8.3 Indium Electronic Circuit Board Level Underfill Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.8.4 Main Business and Markets Served
- 8.9 Zymet
- 8.9.1 Zymet Electronic Circuit Board Level Underfill Material Production Sites and Area Served
- 8.9.2 Zymet Product Introduction, Application and Specification
- 8.9.3 Zymet Electronic Circuit Board Level Underfill Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.9.4 Main Business and Markets Served
- 8.10 YINCAE
- 8.10.1 YINCAE Electronic Circuit Board Level Underfill Material Production Sites and Area Served
- 8.10.2 YINCAE Product Introduction, Application and Specification
- 8.10.3 YINCAE Electronic Circuit Board Level Underfill Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.10.4 Main Business and Markets Served
- 8.11 LORD
- 8.12 Sanyu Rec
- 8.13 Dow
9 Development Trend of Analysis of Electronic Circuit Board Level Underfill Material Market
- 9.1 Global Electronic Circuit Board Level Underfill Material Market Trend Analysis
- 9.1.1 Global Electronic Circuit Board Level Underfill Material Market Size (Volume and Value) Forecast 2019-2025
- 9.2 Electronic Circuit Board Level Underfill Material Regional Market Trend
- 9.2.1 North America Electronic Circuit Board Level Underfill Material Forecast 2019-2025
- 9.2.2 Europe Electronic Circuit Board Level Underfill Material Forecast 2019-2025
- 9.2.3 China Electronic Circuit Board Level Underfill Material Forecast 2019-2025
- 9.2.4 Japan Electronic Circuit Board Level Underfill Material Forecast 2019-2025
- 9.2.5 Southeast Asia Electronic Circuit Board Level Underfill Material Forecast 2019-2025
- 9.2.6 India Electronic Circuit Board Level Underfill Material Forecast 2019-2025
- 9.3 Electronic Circuit Board Level Underfill Material Market Trend (Product Type)
- 9.4 Electronic Circuit Board Level Underfill Material Market Trend (Application)
- 10.1 Marketing Channel
- 10.1.1 Direct Marketing
- 10.1.2 Indirect Marketing
- 10.3 Electronic Circuit Board Level Underfill Material Customers
11 Market Dynamics
- 11.1 Market Trends
- 11.2 Opportunities
- 11.3 Market Drivers
- 11.4 Challenges
- 11.5 Influence Factors
12 Conclusion
13 Appendix
- 13.1 Methodology/Research Approach
- 13.1.1 Research Programs/Design
- 13.1.2 Market Size Estimation
- 13.1.3 Market Breakdown and Data Triangulation
- 13.2 Data Source
- 13.2.1 Secondary Sources
- 13.2.2 Primary Sources
- 13.3 Author List
Summary:
Get latest Market Research Reports on Electronic Circuit Board Level Underfill Material . Industry analysis & Market Report on Electronic Circuit Board Level Underfill Material is a syndicated market report, published as Global Electronic Circuit Board Level Underfill Material Market Professional Survey Report 2019. It is complete Research Study and Industry Analysis of Electronic Circuit Board Level Underfill Material market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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