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Global Die Attach Compound Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

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1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Die Attach Compound Consumption Value by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 Electrically Conductive
    • 1.3.3 Dielectric
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Die Attach Compound Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 Consumer Electronics
    • 1.4.3 Automotive
    • 1.4.4 Aerospace
    • 1.4.5 Others
  • 1.5 Global Die Attach Compound Market Size & Forecast
    • 1.5.1 Global Die Attach Compound Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global Die Attach Compound Sales Quantity (2020-2031)
    • 1.5.3 Global Die Attach Compound Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 Ajinomoto
    • 2.1.1 Ajinomoto Details
    • 2.1.2 Ajinomoto Major Business
    • 2.1.3 Ajinomoto Die Attach Compound Product and Services
    • 2.1.4 Ajinomoto Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 Ajinomoto Recent Developments/Updates
  • 2.2 Protavic
    • 2.2.1 Protavic Details
    • 2.2.2 Protavic Major Business
    • 2.2.3 Protavic Die Attach Compound Product and Services
    • 2.2.4 Protavic Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 Protavic Recent Developments/Updates
  • 2.3 Sanyu Rec
    • 2.3.1 Sanyu Rec Details
    • 2.3.2 Sanyu Rec Major Business
    • 2.3.3 Sanyu Rec Die Attach Compound Product and Services
    • 2.3.4 Sanyu Rec Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 Sanyu Rec Recent Developments/Updates
  • 2.4 YINCAE Advanced Materials
    • 2.4.1 YINCAE Advanced Materials Details
    • 2.4.2 YINCAE Advanced Materials Major Business
    • 2.4.3 YINCAE Advanced Materials Die Attach Compound Product and Services
    • 2.4.4 YINCAE Advanced Materials Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 YINCAE Advanced Materials Recent Developments/Updates
  • 2.5 Nagase Group
    • 2.5.1 Nagase Group Details
    • 2.5.2 Nagase Group Major Business
    • 2.5.3 Nagase Group Die Attach Compound Product and Services
    • 2.5.4 Nagase Group Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 Nagase Group Recent Developments/Updates
  • 2.6 KCC Corporation
    • 2.6.1 KCC Corporation Details
    • 2.6.2 KCC Corporation Major Business
    • 2.6.3 KCC Corporation Die Attach Compound Product and Services
    • 2.6.4 KCC Corporation Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 KCC Corporation Recent Developments/Updates
  • 2.7 Parker
    • 2.7.1 Parker Details
    • 2.7.2 Parker Major Business
    • 2.7.3 Parker Die Attach Compound Product and Services
    • 2.7.4 Parker Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 Parker Recent Developments/Updates
  • 2.8 NAMICS Corporation
    • 2.8.1 NAMICS Corporation Details
    • 2.8.2 NAMICS Corporation Major Business
    • 2.8.3 NAMICS Corporation Die Attach Compound Product and Services
    • 2.8.4 NAMICS Corporation Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 NAMICS Corporation Recent Developments/Updates
  • 2.9 Panacol-Elosol GmbH
    • 2.9.1 Panacol-Elosol GmbH Details
    • 2.9.2 Panacol-Elosol GmbH Major Business
    • 2.9.3 Panacol-Elosol GmbH Die Attach Compound Product and Services
    • 2.9.4 Panacol-Elosol GmbH Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 Panacol-Elosol GmbH Recent Developments/Updates
  • 2.10 DELO Adhesives
    • 2.10.1 DELO Adhesives Details
    • 2.10.2 DELO Adhesives Major Business
    • 2.10.3 DELO Adhesives Die Attach Compound Product and Services
    • 2.10.4 DELO Adhesives Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 DELO Adhesives Recent Developments/Updates
  • 2.11 Henkel
    • 2.11.1 Henkel Details
    • 2.11.2 Henkel Major Business
    • 2.11.3 Henkel Die Attach Compound Product and Services
    • 2.11.4 Henkel Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.11.5 Henkel Recent Developments/Updates
  • 2.12 Alpha Advanced Materials
    • 2.12.1 Alpha Advanced Materials Details
    • 2.12.2 Alpha Advanced Materials Major Business
    • 2.12.3 Alpha Advanced Materials Die Attach Compound Product and Services
    • 2.12.4 Alpha Advanced Materials Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.12.5 Alpha Advanced Materials Recent Developments/Updates
  • 2.13 Bonotec Electronic Materials
    • 2.13.1 Bonotec Electronic Materials Details
    • 2.13.2 Bonotec Electronic Materials Major Business
    • 2.13.3 Bonotec Electronic Materials Die Attach Compound Product and Services
    • 2.13.4 Bonotec Electronic Materials Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.13.5 Bonotec Electronic Materials Recent Developments/Updates
  • 2.14 YizTech
    • 2.14.1 YizTech Details
    • 2.14.2 YizTech Major Business
    • 2.14.3 YizTech Die Attach Compound Product and Services
    • 2.14.4 YizTech Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.14.5 YizTech Recent Developments/Updates
  • 2.15 Yongoo Technology
    • 2.15.1 Yongoo Technology Details
    • 2.15.2 Yongoo Technology Major Business
    • 2.15.3 Yongoo Technology Die Attach Compound Product and Services
    • 2.15.4 Yongoo Technology Die Attach Compound Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.15.5 Yongoo Technology Recent Developments/Updates

3 Competitive Environment: Die Attach Compound by Manufacturer

  • 3.1 Global Die Attach Compound Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global Die Attach Compound Revenue by Manufacturer (2020-2025)
  • 3.3 Global Die Attach Compound Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of Die Attach Compound by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 Die Attach Compound Manufacturer Market Share in 2024
    • 3.4.3 Top 6 Die Attach Compound Manufacturer Market Share in 2024
  • 3.5 Die Attach Compound Market: Overall Company Footprint Analysis
    • 3.5.1 Die Attach Compound Market: Region Footprint
    • 3.5.2 Die Attach Compound Market: Company Product Type Footprint
    • 3.5.3 Die Attach Compound Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Die Attach Compound Market Size by Region
    • 4.1.1 Global Die Attach Compound Sales Quantity by Region (2020-2031)
    • 4.1.2 Global Die Attach Compound Consumption Value by Region (2020-2031)
    • 4.1.3 Global Die Attach Compound Average Price by Region (2020-2031)
  • 4.2 North America Die Attach Compound Consumption Value (2020-2031)
  • 4.3 Europe Die Attach Compound Consumption Value (2020-2031)
  • 4.4 Asia-Pacific Die Attach Compound Consumption Value (2020-2031)
  • 4.5 South America Die Attach Compound Consumption Value (2020-2031)
  • 4.6 Middle East & Africa Die Attach Compound Consumption Value (2020-2031)

5 Market Segment by Type

  • 5.1 Global Die Attach Compound Sales Quantity by Type (2020-2031)
  • 5.2 Global Die Attach Compound Consumption Value by Type (2020-2031)
  • 5.3 Global Die Attach Compound Average Price by Type (2020-2031)

6 Market Segment by Application

  • 6.1 Global Die Attach Compound Sales Quantity by Application (2020-2031)
  • 6.2 Global Die Attach Compound Consumption Value by Application (2020-2031)
  • 6.3 Global Die Attach Compound Average Price by Application (2020-2031)

7 North America

  • 7.1 North America Die Attach Compound Sales Quantity by Type (2020-2031)
  • 7.2 North America Die Attach Compound Sales Quantity by Application (2020-2031)
  • 7.3 North America Die Attach Compound Market Size by Country
    • 7.3.1 North America Die Attach Compound Sales Quantity by Country (2020-2031)
    • 7.3.2 North America Die Attach Compound Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe Die Attach Compound Sales Quantity by Type (2020-2031)
  • 8.2 Europe Die Attach Compound Sales Quantity by Application (2020-2031)
  • 8.3 Europe Die Attach Compound Market Size by Country
    • 8.3.1 Europe Die Attach Compound Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe Die Attach Compound Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific Die Attach Compound Sales Quantity by Type (2020-2031)
  • 9.2 Asia-Pacific Die Attach Compound Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific Die Attach Compound Market Size by Region
    • 9.3.1 Asia-Pacific Die Attach Compound Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific Die Attach Compound Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America Die Attach Compound Sales Quantity by Type (2020-2031)
  • 10.2 South America Die Attach Compound Sales Quantity by Application (2020-2031)
  • 10.3 South America Die Attach Compound Market Size by Country
    • 10.3.1 South America Die Attach Compound Sales Quantity by Country (2020-2031)
    • 10.3.2 South America Die Attach Compound Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa Die Attach Compound Sales Quantity by Type (2020-2031)
  • 11.2 Middle East & Africa Die Attach Compound Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa Die Attach Compound Market Size by Country
    • 11.3.1 Middle East & Africa Die Attach Compound Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa Die Attach Compound Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 Die Attach Compound Market Drivers
  • 12.2 Die Attach Compound Market Restraints
  • 12.3 Die Attach Compound Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Die Attach Compound and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Die Attach Compound
  • 13.3 Die Attach Compound Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Die Attach Compound Typical Distributors
  • 14.3 Die Attach Compound Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global Die Attach Compound market size was valued at US$ 1718 million in 2024 and is forecast to a readjusted size of USD 2919 million by 2031 with a CAGR of 8.0% during review period.
    In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
    Die attach compounds are materials used in the assembly of semiconductor devices to attach a die to a substrate, such as a leadframe or a printed circuit board. These compounds are used to bond the die to the substrate, and typically contain a filler material such as silver, copper, or aluminum, mixed with a resin or adhesive. The compound must have a high thermal conductivity to help dissipate heat generated by the device, and must also provide good adhesion and electrical conductivity. Die attach compounds are often applied to the substrate by dispensing, stenciling, or screen printing, and are then cured by heat or ultraviolet light.
    This report is a detailed and comprehensive analysis for global Die Attach Compound market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
    Key Features:
    Global Die Attach Compound market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
    Global Die Attach Compound market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
    Global Die Attach Compound market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
    Global Die Attach Compound market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025
    The Primary Objectives in This Report Are:
    To determine the size of the total market opportunity of global and key countries
    To assess the growth potential for Die Attach Compound
    To forecast future growth in each product and end-use market
    To assess competitive factors affecting the marketplace
    This report profiles key players in the global Die Attach Compound market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Ajinomoto, Protavic, Sanyu Rec, YINCAE Advanced Materials, Nagase Group, KCC Corporation, Parker, NAMICS Corporation, Panacol-Elosol GmbH, DELO Adhesives, etc.
    This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
    Market Segmentation
    Die Attach Compound market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
    Market segment by Type
    Electrically Conductive
    Dielectric
    Market segment by Application
    Consumer Electronics
    Automotive
    Aerospace
    Others
    Major players covered
    Ajinomoto
    Protavic
    Sanyu Rec
    YINCAE Advanced Materials
    Nagase Group
    KCC Corporation
    Parker
    NAMICS Corporation
    Panacol-Elosol GmbH
    DELO Adhesives
    Henkel
    Alpha Advanced Materials
    Bonotec Electronic Materials
    YizTech
    Yongoo Technology
    Market segment by region, regional analysis covers
    North America (United States, Canada, and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 15 chapters:
    Chapter 1, to describe Die Attach Compound product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top manufacturers of Die Attach Compound, with price, sales quantity, revenue, and global market share of Die Attach Compound from 2020 to 2025.
    Chapter 3, the Die Attach Compound competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
    Chapter 4, the Die Attach Compound breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
    Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
    Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Die Attach Compound market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
    Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
    Chapter 13, the key raw materials and key suppliers, and industry chain of Die Attach Compound.
    Chapter 14 and 15, to describe Die Attach Compound sales channel, distributors, customers, research findings and conclusion.

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