Copyright Reports & Markets. All rights reserved.

COVID-19 Impact on Global Wafer Level Package Market Size, Status and Forecast 2020-2026

Request for Sample of this report
Buy now

1 Report Overview

  • 1.1 Study Scope
  • 1.2 Key Market Segments
  • 1.3 Players Covered: Ranking by Wafer Level Package Revenue
  • 1.4 Market Analysis by Type
    • 1.4.1 Global Wafer Level Package Market Size Growth Rate by Type: 2020 VS 2026
    • 1.4.2 3D Wire Bonding
    • 1.4.3 3D TSV
    • 1.4.4 Others
  • 1.5 Market by Application
    • 1.5.1 Global Wafer Level Package Market Share by Application: 2020 VS 2026
    • 1.5.2 Consumer Electronics
    • 1.5.3 Industrial
    • 1.5.4 Automotive & Transport
    • 1.5.5 IT & Telecommunication
    • 1.5.6 Others
  • 1.6 Coronavirus Disease 2019 (Covid-19): Wafer Level Package Industry Impact
    • 1.6.1 How the Covid-19 is Affecting the Wafer Level Package Industry
      • 1.6.1.1 Wafer Level Package Business Impact Assessment - Covid-19
      • 1.6.1.2 Supply Chain Challenges
      • 1.6.1.3 COVID-19’s Impact On Crude Oil and Refined Products
    • 1.6.2 Market Trends and Wafer Level Package Potential Opportunities in the COVID-19 Landscape
    • 1.6.3 Measures / Proposal against Covid-19
      • 1.6.3.1 Government Measures to Combat Covid-19 Impact
      • 1.6.3.2 Proposal for Wafer Level Package Players to Combat Covid-19 Impact
  • 1.7 Study Objectives
  • 1.8 Years Considered

2 Executive Summary

  • 2.1 Wafer Level Package Market Perspective (2015-2026)
  • 2.2 Wafer Level Package Growth Trends by Regions
    • 2.2.1 Wafer Level Package Market Size by Regions: 2015 VS 2020 VS 2026
    • 2.2.2 Wafer Level Package Historic Market Share by Regions (2018-2019)
  • 2.3 Industry Trends and Growth Strategy
    • 2.3.1 Market Top Trends
    • 2.3.2 Market Drivers

3 Competition Landscape by Key Players

  • 3.1 Wafer Level Package Revenue by Players (2019-2020)
  • 3.2 Wafer Level Package Key Players Head office and Area Served
  • 3.3 Key Players Wafer Level Package Product/Solution/Service
  • 3.4 Date of Enter into Wafer Level Package Market
  • 3.5 Key Players Wafer Level Package Funding/Investment Analysis
  • 3.6 Global Key Players Wafer Level Package Valuation & Market Capitalization
  • 3.7 Mergers & Acquisitions, Expansion Plans

4 Global Wafer Level Package Market Size by Type (2019-2026)

    5 Global Wafer Level Package Market Size by Application (2019-2026)

      6 North America

      • 6.1 North America Wafer Level Package Market Forecast (2019-2026)
      • 6.2 Wafer Level Package Key Players in North America (2019-2020)
      • 6.3 North America Wafer Level Package Market Size by Type (2015-2020)
      • 6.4 North America Wafer Level Package Market Size by Application (2015-2020)

      7 Europe

      • 7.1 Europe Wafer Level Package Market Forecast (2019-2026)
      • 7.2 Wafer Level Package Key Players in Europe (2019-2020)
      • 7.3 Europe Wafer Level Package Market Size by Type (2015-2020)
      • 7.4 Europe Wafer Level Package Market Size by Application (2015-2020)

      8 China

      • 8.1 China Wafer Level Package Market Forecast (2019-2026)
      • 8.2 Wafer Level Package Key Players in China (2019-2020)
      • 8.3 China Wafer Level Package Market Size by Type (2015-2020)
      • 8.4 China Wafer Level Package Market Size by Application (2015-2020)

      9 Japan

      • 9.1 Japan Wafer Level Package Market Forecast (2019-2026)
      • 9.2 Wafer Level Package Key Players in Japan (2019-2020)
      • 9.3 Japan Wafer Level Package Market Size by Type (2015-2020)
      • 9.4 Japan Wafer Level Package Market Size by Application (2015-2020)

      10 Southeast Asia

      • 10.1 Southeast Asia Wafer Level Package Market Forecast (2019-2026)
      • 10.2 Wafer Level Package Key Players in Southeast Asia (2019-2020)
      • 10.3 Southeast Asia Wafer Level Package Market Size by Type (2015-2020)
      • 10.4 Southeast Asia Wafer Level Package Market Size by Application (2015-2020)

      11 India

      • 11.1 India Wafer Level Package Market Forecast (2019-2026)
      • 11.2 Wafer Level Package Key Players in India (2019-2020)
      • 11.3 India Wafer Level Package Market Size by Type (2015-2020)
      • 11.4 India Wafer Level Package Market Size by Application (2015-2020)

      12 Central & South America

      • 12.1 Central & South America Wafer Level Package Market Forecast (2019-2026)
      • 12.2 Wafer Level Package Key Players in Central & South America (2019-2020)
      • 12.3 Central & South America Wafer Level Package Market Size by Type (2015-2020)
      • 12.4 Central & South America Wafer Level Package Market Size by Application (2015-2020)

      13 Key Players Profiles

      • 13.1 lASE
        • 13.1.1 lASE Company Details
        • 13.1.2 lASE Business Overview and Its Total Revenue
        • 13.1.3 lASE Wafer Level Package Introduction
        • 13.1.4 lASE Revenue in Wafer Level Package Business (2019-2020))
        • 13.1.5 lASE Recent Development
      • 13.2 Amkor
        • 13.2.1 Amkor Company Details
        • 13.2.2 Amkor Business Overview and Its Total Revenue
        • 13.2.3 Amkor Wafer Level Package Introduction
        • 13.2.4 Amkor Revenue in Wafer Level Package Business (2019-2020))
        • 13.2.5 Amkor Recent Development
      • 13.3 Intel
        • 13.3.1 Intel Company Details
        • 13.3.2 Intel Business Overview and Its Total Revenue
        • 13.3.3 Intel Wafer Level Package Introduction
        • 13.3.4 Intel Revenue in Wafer Level Package Business (2019-2020))
        • 13.3.5 Intel Recent Development
      • 13.4 Samsung
        • 13.4.1 Samsung Company Details
        • 13.4.2 Samsung Business Overview and Its Total Revenue
        • 13.4.3 Samsung Wafer Level Package Introduction
        • 13.4.4 Samsung Revenue in Wafer Level Package Business (2019-2020))
        • 13.4.5 Samsung Recent Development
      • 13.5 AT&S
        • 13.5.1 AT&S Company Details
        • 13.5.2 AT&S Business Overview and Its Total Revenue
        • 13.5.3 AT&S Wafer Level Package Introduction
        • 13.5.4 AT&S Revenue in Wafer Level Package Business (2019-2020))
        • 13.5.5 AT&S Recent Development
      • 13.6 Toshiba
        • 13.6.1 Toshiba Company Details
        • 13.6.2 Toshiba Business Overview and Its Total Revenue
        • 13.6.3 Toshiba Wafer Level Package Introduction
        • 13.6.4 Toshiba Revenue in Wafer Level Package Business (2019-2020))
        • 13.6.5 Toshiba Recent Development
      • 13.7 JCET
        • 13.7.1 JCET Company Details
        • 13.7.2 JCET Business Overview and Its Total Revenue
        • 13.7.3 JCET Wafer Level Package Introduction
        • 13.7.4 JCET Revenue in Wafer Level Package Business (2019-2020))
        • 13.7.5 JCET Recent Development
      • 13.8 Qualcomm
        • 13.8.1 Qualcomm Company Details
        • 13.8.2 Qualcomm Business Overview and Its Total Revenue
        • 13.8.3 Qualcomm Wafer Level Package Introduction
        • 13.8.4 Qualcomm Revenue in Wafer Level Package Business (2019-2020))
        • 13.8.5 Qualcomm Recent Development
      • 13.9 IBM
        • 13.9.1 IBM Company Details
        • 13.9.2 IBM Business Overview and Its Total Revenue
        • 13.9.3 IBM Wafer Level Package Introduction
        • 13.9.4 IBM Revenue in Wafer Level Package Business (2019-2020))
        • 13.9.5 IBM Recent Development
      • 13.10 SK Hynix
        • 13.10.1 SK Hynix Company Details
        • 13.10.2 SK Hynix Business Overview and Its Total Revenue
        • 13.10.3 SK Hynix Wafer Level Package Introduction
        • 13.10.4 SK Hynix Revenue in Wafer Level Package Business (2019-2020))
        • 13.10.5 SK Hynix Recent Development
      • 13.11 UTAC
        • 10.11.1 UTAC Company Details
        • 10.11.2 UTAC Business Overview and Its Total Revenue
        • 10.11.3 UTAC Wafer Level Package Introduction
        • 10.11.4 UTAC Revenue in Wafer Level Package Business (2019-2020))
        • 10.11.5 UTAC Recent Development
      • 13.12 TSMC
        • 10.12.1 TSMC Company Details
        • 10.12.2 TSMC Business Overview and Its Total Revenue
        • 10.12.3 TSMC Wafer Level Package Introduction
        • 10.12.4 TSMC Revenue in Wafer Level Package Business (2019-2020))
        • 10.12.5 TSMC Recent Development
      • 13.13 China Wafer Level CSP
        • 10.13.1 China Wafer Level CSP Company Details
        • 10.13.2 China Wafer Level CSP Business Overview and Its Total Revenue
        • 10.13.3 China Wafer Level CSP Wafer Level Package Introduction
        • 10.13.4 China Wafer Level CSP Revenue in Wafer Level Package Business (2019-2020))
        • 10.13.5 China Wafer Level CSP Recent Development
      • 13.14 Interconnect Systems
        • 10.14.1 Interconnect Systems Company Details
        • 10.14.2 Interconnect Systems Business Overview and Its Total Revenue
        • 10.14.3 Interconnect Systems Wafer Level Package Introduction
        • 10.14.4 Interconnect Systems Revenue in Wafer Level Package Business (2019-2020))
        • 10.14.5 Interconnect Systems Recent Development

      14 Market Dynamics

      • 14.1 Drivers
      • 14.2 Challenges
      • 14.3 Porter’s Five Forces Analysis
      • 14.4 Market Ecosystem and Value Chain Analysis

      15 Key Findings in This Report

      • 15.1 Research Methodology
        • 15.1.1 Methodology/Research Approach
        • 15.1.2 Data Source
      • 15.2 Disclaimer

      This report focuses on the global Wafer Level Package status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Wafer Level Package development in North America, Europe, China, Japan, Southeast Asia, India and Central & South America.

      The key players covered in this study
      lASE
      Amkor
      Intel
      Samsung
      AT&S
      Toshiba
      JCET
      Qualcomm
      IBM
      SK Hynix
      UTAC
      TSMC
      China Wafer Level CSP
      Interconnect Systems

      Market segment by Type, the product can be split into
      3D Wire Bonding
      3D TSV
      Others
      Market segment by Application, split into
      Consumer Electronics
      Industrial
      Automotive & Transport
      IT & Telecommunication
      Others

      Market segment by Regions/Countries, this report covers
      North America
      Europe
      China
      Japan
      Southeast Asia
      India
      Central & South America

      The study objectives of this report are:
      To analyze global Wafer Level Package status, future forecast, growth opportunity, key market and key players.
      To present the Wafer Level Package development in North America, Europe, China, Japan, Southeast Asia, India and Central & South America.
      To strategically profile the key players and comprehensively analyze their development plan and strategies.
      To define, describe and forecast the market by type, market and key regions.

      In this study, the years considered to estimate the market size of Wafer Level Package are as follows:
      History Year: 2015-2019
      Base Year: 2019
      Estimated Year: 2020
      Forecast Year 2020 to 2026
      For the data information by region, company, type and application, 2019 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

      Buy now