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Global and United States Chip Packaging & Testing Market Report & Forecast 2022-2028

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Table of Contents

    1 Study Coverage

    • 1.1 Chip Packaging & Testing Revenue in Chip Packaging & Testing Business (2017-2022) & (US$ Million) Introduction
    • 1.2 Global Chip Packaging & Testing Outlook 2017 VS 2022 VS 2028
      • 1.2.1 Global Chip Packaging & Testing Market Size for the Year 2017-2028
      • 1.2.2 Global Chip Packaging & Testing Market Size for the Year 2017-2028
    • 1.3 Chip Packaging & Testing Market Size, United States VS Global, 2017 VS 2022 VS 2028
      • 1.3.1 The Market Share of United States Chip Packaging & Testing in Global, 2017 VS 2022 VS 2028
      • 1.3.2 The Growth Rate of Chip Packaging & Testing Market Size, United States VS Global, 2017 VS 2022 VS 2028
    • 1.4 Chip Packaging & Testing Market Dynamics
      • 1.4.1 Chip Packaging & Testing Industry Trends
      • 1.4.2 Chip Packaging & Testing Market Drivers
      • 1.4.3 Chip Packaging & Testing Market Challenges
      • 1.4.4 Chip Packaging & Testing Market Restraints
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Chip Packaging & Testing by Type

    • 2.1 Chip Packaging & Testing Market Segment by Type
      • 2.1.1 Packaging
      • 2.1.2 Testing
    • 2.2 Global Chip Packaging & Testing Market Size by Type (2017, 2022 & 2028)
    • 2.3 Global Chip Packaging & Testing Market Size by Type (2017-2028)
    • 2.4 United States Chip Packaging & Testing Market Size by Type (2017, 2022 & 2028)
    • 2.5 United States Chip Packaging & Testing Market Size by Type (2017-2028)

    3 Chip Packaging & Testing by Application

    • 3.1 Chip Packaging & Testing Market Segment by Application
      • 3.1.1 Telecommunications
      • 3.1.2 Automotive
      • 3.1.3 Aerospace and Defense
      • 3.1.4 Medical Devices
      • 3.1.5 Consumer Electronics
      • 3.1.6 Other
    • 3.2 Global Chip Packaging & Testing Market Size by Application (2017, 2022 & 2028)
    • 3.3 Global Chip Packaging & Testing Market Size by Application (2017-2028)
    • 3.4 United States Chip Packaging & Testing Market Size by Application (2017, 2022 & 2028)
    • 3.5 United States Chip Packaging & Testing Market Size by Application (2017-2028)

    4 Global Chip Packaging & Testing Competitor Landscape by Company

    • 4.1 Global Chip Packaging & Testing Market Size by Company
      • 4.1.1 Top Global Chip Packaging & Testing Companies Ranked by Revenue (2021)
      • 4.1.2 Global Chip Packaging & Testing Revenue by Player (2017-2022)
    • 4.2 Global Chip Packaging & Testing Concentration Ratio (CR)
      • 4.2.1 Chip Packaging & Testing Market Concentration Ratio (CR) (2017-2022)
      • 4.2.2 Global Top 5 and Top 10 Largest Companies of Chip Packaging & Testing in 2021
      • 4.2.3 Global Chip Packaging & Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
    • 4.3 Global Chip Packaging & Testing Headquarters, Revenue in Chip Packaging & Testing Business (2017-2022) & (US$ Million) Type
      • 4.3.1 Global Chip Packaging & Testing Headquarters and Area Served
      • 4.3.2 Global Chip Packaging & Testing Companies Revenue in Chip Packaging & Testing Business (2017-2022) & (US$ Million) Type
      • 4.3.3 Date of International Companies Enter into Chip Packaging & Testing Market
    • 4.4 Companies Mergers & Acquisitions, Expansion Plans
    • 4.5 United States Chip Packaging & Testing Market Size by Company
      • 4.5.1 Top Chip Packaging & Testing Players in United States, Ranked by Revenue (2021)
      • 4.5.2 United States Chip Packaging & Testing Revenue by Players (2020, 2021 & 2022)

    5 Global Chip Packaging & Testing Market Size by Region

    • 5.1 Global Chip Packaging & Testing Market Size by Region: 2017 VS 2022 VS 2028
    • 5.2 Global Chip Packaging & Testing Market Size by Region (2017-2028)
      • 5.2.1 Global Chip Packaging & Testing Market Size by Region: 2017-2022
      • 5.2.2 Global Chip Packaging & Testing Market Size by Region (2023-2028)

    6 Segment in Region Level & Country Level

    • 6.1 North America
      • 6.1.1 North America Chip Packaging & Testing Market Size YoY Growth 2017-2028
      • 6.1.2 North America Chip Packaging & Testing Market Facts & Figures by Country (2017, 2022 & 2028)
      • 6.1.3 United States
      • 6.1.4 Canada
    • 6.2 Asia-Pacific
      • 6.2.1 Asia-Pacific Chip Packaging & Testing Market Size YoY Growth 2017-2028
      • 6.2.2 Asia-Pacific Chip Packaging & Testing Market Facts & Figures by Region (2017, 2022 & 2028)
      • 6.2.3 China
      • 6.2.4 Japan
      • 6.2.5 South Korea
      • 6.2.6 India
      • 6.2.7 Australia
      • 6.2.8 China Taiwan
      • 6.2.9 Indonesia
      • 6.2.10 Thailand
      • 6.2.11 Malaysia
    • 6.3 Europe
      • 6.3.1 Europe Chip Packaging & Testing Market Size YoY Growth 2017-2028
      • 6.3.2 Europe Chip Packaging & Testing Market Facts & Figures by Country (2017, 2022 & 2028)
      • 6.3.3 Germany
      • 6.3.4 France
      • 6.3.5 U.K.
      • 6.3.6 Italy
      • 6.3.7 Russia
    • 6.4 Latin America
      • 6.4.1 Latin America Chip Packaging & Testing Market Size YoY Growth 2017-2028
      • 6.4.2 Latin America Chip Packaging & Testing Market Facts & Figures by Country (2017, 2022 & 2028)
      • 6.4.3 Mexico
      • 6.4.4 Brazil
      • 6.4.5 Argentina
    • 6.5 Middle East and Africa
      • 6.5.1 Middle East and Africa Chip Packaging & Testing Market Size YoY Growth 2017-2028
      • 6.5.2 Middle East and Africa Chip Packaging & Testing Market Facts & Figures by Country (2017, 2022 & 2028)
      • 6.5.3 Turkey
      • 6.5.4 Saudi Arabia
      • 6.5.5 UAE

    7 Company Profiles

    • 7.1 ASE Technology Holding
      • 7.1.1 ASE Technology Holding Company Details
      • 7.1.2 ASE Technology Holding Business Overview
      • 7.1.3 ASE Technology Holding Chip Packaging & Testing Introduction
      • 7.1.4 ASE Technology Holding Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.1.5 ASE Technology Holding Recent Development
    • 7.2 Amkor Technology
      • 7.2.1 Amkor Technology Company Details
      • 7.2.2 Amkor Technology Business Overview
      • 7.2.3 Amkor Technology Chip Packaging & Testing Introduction
      • 7.2.4 Amkor Technology Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.2.5 Amkor Technology Recent Development
    • 7.3 JCET Group
      • 7.3.1 JCET Group Company Details
      • 7.3.2 JCET Group Business Overview
      • 7.3.3 JCET Group Chip Packaging & Testing Introduction
      • 7.3.4 JCET Group Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.3.5 JCET Group Recent Development
    • 7.4 Siliconware Precision Industries
      • 7.4.1 Siliconware Precision Industries Company Details
      • 7.4.2 Siliconware Precision Industries Business Overview
      • 7.4.3 Siliconware Precision Industries Chip Packaging & Testing Introduction
      • 7.4.4 Siliconware Precision Industries Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.4.5 Siliconware Precision Industries Recent Development
    • 7.5 Powertech Technology
      • 7.5.1 Powertech Technology Company Details
      • 7.5.2 Powertech Technology Business Overview
      • 7.5.3 Powertech Technology Chip Packaging & Testing Introduction
      • 7.5.4 Powertech Technology Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.5.5 Powertech Technology Recent Development
    • 7.6 Tongfu Microelectronics
      • 7.6.1 Tongfu Microelectronics Company Details
      • 7.6.2 Tongfu Microelectronics Business Overview
      • 7.6.3 Tongfu Microelectronics Chip Packaging & Testing Introduction
      • 7.6.4 Tongfu Microelectronics Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.6.5 Tongfu Microelectronics Recent Development
    • 7.7 Tianshui Huatian Technology
      • 7.7.1 Tianshui Huatian Technology Company Details
      • 7.7.2 Tianshui Huatian Technology Business Overview
      • 7.7.3 Tianshui Huatian Technology Chip Packaging & Testing Introduction
      • 7.7.4 Tianshui Huatian Technology Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.7.5 Tianshui Huatian Technology Recent Development
    • 7.8 King Yuan ELECTRONICS
      • 7.8.1 King Yuan ELECTRONICS Company Details
      • 7.8.2 King Yuan ELECTRONICS Business Overview
      • 7.8.3 King Yuan ELECTRONICS Chip Packaging & Testing Introduction
      • 7.8.4 King Yuan ELECTRONICS Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.8.5 King Yuan ELECTRONICS Recent Development
    • 7.9 ChipMOS TECHNOLOGIES
      • 7.9.1 ChipMOS TECHNOLOGIES Company Details
      • 7.9.2 ChipMOS TECHNOLOGIES Business Overview
      • 7.9.3 ChipMOS TECHNOLOGIES Chip Packaging & Testing Introduction
      • 7.9.4 ChipMOS TECHNOLOGIES Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.9.5 ChipMOS TECHNOLOGIES Recent Development
    • 7.10 Chipbond Technology
      • 7.10.1 Chipbond Technology Company Details
      • 7.10.2 Chipbond Technology Business Overview
      • 7.10.3 Chipbond Technology Chip Packaging & Testing Introduction
      • 7.10.4 Chipbond Technology Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.10.5 Chipbond Technology Recent Development
    • 7.11 Sino Ic Technology
      • 7.11.1 Sino Ic Technology Company Details
      • 7.11.2 Sino Ic Technology Business Overview
      • 7.11.3 Sino Ic Technology Chip Packaging & Testing Introduction
      • 7.11.4 Sino Ic Technology Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.11.5 Sino Ic Technology Recent Development
    • 7.12 Leadyo IC Testing
      • 7.12.1 Leadyo IC Testing Company Details
      • 7.12.2 Leadyo IC Testing Business Overview
      • 7.12.3 Leadyo IC Testing Chip Packaging & Testing Introduction
      • 7.12.4 Leadyo IC Testing Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.12.5 Leadyo IC Testing Recent Development
    • 7.13 Applied Materials
      • 7.13.1 Applied Materials Company Details
      • 7.13.2 Applied Materials Business Overview
      • 7.13.3 Applied Materials Chip Packaging & Testing Introduction
      • 7.13.4 Applied Materials Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.13.5 Applied Materials Recent Development
    • 7.14 ASM Pacific Technology
      • 7.14.1 ASM Pacific Technology Company Details
      • 7.14.2 ASM Pacific Technology Business Overview
      • 7.14.3 ASM Pacific Technology Chip Packaging & Testing Introduction
      • 7.14.4 ASM Pacific Technology Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.14.5 ASM Pacific Technology Recent Development
    • 7.15 Kulicke & Soffa Industries
      • 7.15.1 Kulicke & Soffa Industries Company Details
      • 7.15.2 Kulicke & Soffa Industries Business Overview
      • 7.15.3 Kulicke & Soffa Industries Chip Packaging & Testing Introduction
      • 7.15.4 Kulicke & Soffa Industries Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.15.5 Kulicke & Soffa Industries Recent Development
    • 7.16 TEL
      • 7.16.1 TEL Company Details
      • 7.16.2 TEL Business Overview
      • 7.16.3 TEL Chip Packaging & Testing Introduction
      • 7.16.4 TEL Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.16.5 TEL Recent Development
    • 7.17 Tokyo Seimitsu
      • 7.17.1 Tokyo Seimitsu Company Details
      • 7.17.2 Tokyo Seimitsu Business Overview
      • 7.17.3 Tokyo Seimitsu Chip Packaging & Testing Introduction
      • 7.17.4 Tokyo Seimitsu Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.17.5 Tokyo Seimitsu Recent Development
    • 7.18 UTAC
      • 7.18.1 UTAC Company Details
      • 7.18.2 UTAC Business Overview
      • 7.18.3 UTAC Chip Packaging & Testing Introduction
      • 7.18.4 UTAC Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.18.5 UTAC Recent Development
    • 7.19 Hana Micron
      • 7.19.1 Hana Micron Company Details
      • 7.19.2 Hana Micron Business Overview
      • 7.19.3 Hana Micron Chip Packaging & Testing Introduction
      • 7.19.4 Hana Micron Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.19.5 Hana Micron Recent Development
    • 7.20 OSE
      • 7.20.1 OSE Company Details
      • 7.20.2 OSE Business Overview
      • 7.20.3 OSE Chip Packaging & Testing Introduction
      • 7.20.4 OSE Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.20.5 OSE Recent Development
    • 7.21 NEPES
      • 7.21.1 NEPES Company Details
      • 7.21.2 NEPES Business Overview
      • 7.21.3 NEPES Chip Packaging & Testing Introduction
      • 7.21.4 NEPES Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.21.5 NEPES Recent Development
    • 7.22 Unisem
      • 7.22.1 Unisem Company Details
      • 7.22.2 Unisem Business Overview
      • 7.22.3 Unisem Chip Packaging & Testing Introduction
      • 7.22.4 Unisem Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.22.5 Unisem Recent Development
    • 7.23 Signetics
      • 7.23.1 Signetics Company Details
      • 7.23.2 Signetics Business Overview
      • 7.23.3 Signetics Chip Packaging & Testing Introduction
      • 7.23.4 Signetics Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.23.5 Signetics Recent Development
    • 7.24 Carsem
      • 7.24.1 Carsem Company Details
      • 7.24.2 Carsem Business Overview
      • 7.24.3 Carsem Chip Packaging & Testing Introduction
      • 7.24.4 Carsem Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.24.5 Carsem Recent Development
    • 7.25 Teradyne
      • 7.25.1 Teradyne Company Details
      • 7.25.2 Teradyne Business Overview
      • 7.25.3 Teradyne Chip Packaging & Testing Introduction
      • 7.25.4 Teradyne Revenue in Chip Packaging & Testing Business (2017-2022)
      • 7.25.5 Teradyne Recent Development

    8 Research Findings and Conclusion

      9 Appendix

      • 9.1 Research Methodology
        • 9.1.1 Methodology/Research Approach
        • 9.1.2 Data Source
      • 9.2 Author Details

      Summary:
      Market Analysis and Insights: Global and United States Chip Packaging & Testing Market
      This report focuses on global and United States Chip Packaging & Testing market, also covers the segmentation data of other regions in regional level and county level.
      Due to the COVID-19 pandemic, the global Chip Packaging & Testing market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the review period. Fully considering the economic change by this health crisis, by Type, Packaging accounting for % of the Chip Packaging & Testing global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While by Application, Telecommunications was the leading segment, accounting for over percent market share in 2021, and altered to an % CAGR throughout this forecast period.
      In United States the Chip Packaging & Testing market size is expected to grow from US$ million in 2021 to US$ million by 2028, at a CAGR of % during the forecast period.
      Global Chip Packaging & Testing Scope and Market Size
      Chip Packaging & Testing market is segmented by region (country), players, by Type and by Application. Players, stakeholders, and other participants in the global Chip Packaging & Testing market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application for the period 2017-2028.
      For United States market, this report focuses on the Chip Packaging & Testing market size by players, by Type and by Application, for the period 2017-2028. The key players include the global and local players, which play important roles in United States.
      Segment by Type, the Chip Packaging & Testing market is segmented into
      Packaging
      Testing
      Segment by Application, the Chip Packaging & Testing market is segmented into
      Telecommunications
      Automotive
      Aerospace and Defense
      Medical Devices
      Consumer Electronics
      Other
      Regional and Country-level Analysis
      North America
      United States
      Canada
      Europe
      Germany
      France
      U.K.
      Italy
      Russia
      Asia-Pacific
      China
      Japan
      South Korea
      India
      Australia
      China Taiwan
      Indonesia
      Thailand
      Malaysia
      Latin America
      Mexico
      Brazil
      Argentina
      Middle East & Africa
      Turkey
      Saudi Arabia
      UAE
      Competitive Landscape and Chip Packaging & Testing Market Share Analysis
      Chip Packaging & Testing market competitive landscape provides details and data information by players. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2017-2022. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by players for the period 2017-2022. Details included are company description, major business, company total revenue and the sales, revenue generated in Chip Packaging & Testing business, the date to enter into the Chip Packaging & Testing market, Revenue in Chip Packaging & Testing Business (2017-2022) & (US$ Million) introduction, recent developments, etc.
      The major vendors covered:
      ASE Technology Holding
      Amkor Technology
      JCET Group
      Siliconware Precision Industries
      Powertech Technology
      Tongfu Microelectronics
      Tianshui Huatian Technology
      King Yuan ELECTRONICS
      ChipMOS TECHNOLOGIES
      Chipbond Technology
      Sino Ic Technology
      Leadyo IC Testing
      Applied Materials
      ASM Pacific Technology
      Kulicke & Soffa Industries
      TEL
      Tokyo Seimitsu
      UTAC
      Hana Micron
      OSE
      NEPES
      Unisem
      Signetics
      Carsem
      Teradyne

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