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Global Chip On Film Underfill (COF) Market Research Report 2021

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1 Chip On Film Underfill (COF) Market Overview

  • 1.1 Product Overview and Scope of Chip On Film Underfill (COF)
  • 1.2 Chip On Film Underfill (COF) Segment by Type
    • 1.2.1 Global Chip On Film Underfill (COF) Market Size Growth Rate Analysis by Type 2021 VS 2027
    • 1.2.2 Capillary Underfill (CUF)
    • 1.2.3 No Flow Underfill (NUF)
    • 1.2.4 Non-Conductive Paste (NCP) Underfill
    • 1.2.5 Non-Conductive Film (NCF) Underfill
    • 1.2.6 Molded Underfill (MUF) Underfill
  • 1.3 Chip On Film Underfill (COF) Segment by Application
    • 1.3.1 Global Chip On Film Underfill (COF) Consumption Comparison by Application: 2016 VS 2021 VS 2027
    • 1.3.2 Cell Phone
    • 1.3.3 Tablet
    • 1.3.4 LCD Display
    • 1.3.5 Other
  • 1.4 Global Market Growth Prospects
    • 1.4.1 Global Chip On Film Underfill (COF) Revenue Estimates and Forecasts (2016-2027)
    • 1.4.2 Global Chip On Film Underfill (COF) Production Capacity Estimates and Forecasts (2016-2027)
    • 1.4.3 Global Chip On Film Underfill (COF) Production Estimates and Forecasts (2016-2027)
  • 1.5 Global Market Size by Region
    • 1.5.1 Global Chip On Film Underfill (COF) Market Size Estimates and Forecasts by Region: 2016 VS 2021 VS 2027
    • 1.5.2 North America Chip On Film Underfill (COF) Estimates and Forecasts (2016-2027)
    • 1.5.3 Europe Chip On Film Underfill (COF) Estimates and Forecasts (2016-2027)
    • 1.5.4 China Chip On Film Underfill (COF) Estimates and Forecasts (2016-2027)
    • 1.5.5 Japan Chip On Film Underfill (COF) Estimates and Forecasts (2016-2027)

2 Market Competition by Manufacturers

  • 2.1 Global Chip On Film Underfill (COF) Production Capacity Market Share by Manufacturers (2016-2021)
  • 2.2 Global Chip On Film Underfill (COF) Revenue Market Share by Manufacturers (2016-2021)
  • 2.3 Chip On Film Underfill (COF) Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
  • 2.4 Global Chip On Film Underfill (COF) Average Price by Manufacturers (2016-2021)
  • 2.5 Manufacturers Chip On Film Underfill (COF) Production Sites, Area Served, Product Types
  • 2.6 Chip On Film Underfill (COF) Market Competitive Situation and Trends
    • 2.6.1 Chip On Film Underfill (COF) Market Concentration Rate
    • 2.6.2 Global 5 and 10 Largest Chip On Film Underfill (COF) Players Market Share by Revenue
    • 2.6.3 Mergers & Acquisitions, Expansion

3 Production and Capacity by Region

  • 3.1 Global Production Capacity of Chip On Film Underfill (COF) Market Share by Region (2016-2021)
  • 3.2 Global Chip On Film Underfill (COF) Revenue Market Share by Region (2016-2021)
  • 3.3 Global Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
  • 3.4 North America Chip On Film Underfill (COF) Production
    • 3.4.1 North America Chip On Film Underfill (COF) Production Growth Rate (2016-2021)
    • 3.4.2 North America Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
  • 3.5 Europe Chip On Film Underfill (COF) Production
    • 3.5.1 Europe Chip On Film Underfill (COF) Production Growth Rate (2016-2021)
    • 3.5.2 Europe Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
  • 3.6 China Chip On Film Underfill (COF) Production
    • 3.6.1 China Chip On Film Underfill (COF) Production Growth Rate (2016-2021)
    • 3.6.2 China Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
  • 3.7 Japan Chip On Film Underfill (COF) Production
    • 3.7.1 Japan Chip On Film Underfill (COF) Production Growth Rate (2016-2021)
    • 3.7.2 Japan Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)

4 Global Chip On Film Underfill (COF) Consumption by Region

  • 4.1 Global Chip On Film Underfill (COF) Consumption by Region
    • 4.1.1 Global Chip On Film Underfill (COF) Consumption by Region
    • 4.1.2 Global Chip On Film Underfill (COF) Consumption Market Share by Region
  • 4.2 North America
    • 4.2.1 North America Chip On Film Underfill (COF) Consumption by Country
    • 4.2.2 U.S.
    • 4.2.3 Canada
  • 4.3 Europe
    • 4.3.1 Europe Chip On Film Underfill (COF) Consumption by Country
    • 4.3.2 Germany
    • 4.3.3 France
    • 4.3.4 U.K.
    • 4.3.5 Italy
    • 4.3.6 Russia
  • 4.4 Asia Pacific
    • 4.4.1 Asia Pacific Chip On Film Underfill (COF) Consumption by Region
    • 4.4.2 China
    • 4.4.3 Japan
    • 4.4.4 South Korea
    • 4.4.5 Taiwan
    • 4.4.6 Southeast Asia
    • 4.4.7 India
    • 4.4.8 Australia
  • 4.5 Latin America
    • 4.5.1 Latin America Chip On Film Underfill (COF) Consumption by Country
    • 4.5.2 Mexico
    • 4.5.3 Brazil

5 Production, Revenue, Price Trend by Type

  • 5.1 Global Chip On Film Underfill (COF) Production Market Share by Type (2016-2021)
  • 5.2 Global Chip On Film Underfill (COF) Revenue Market Share by Type (2016-2021)
  • 5.3 Global Chip On Film Underfill (COF) Price by Type (2016-2021)

6 Consumption Analysis by Application

  • 6.1 Global Chip On Film Underfill (COF) Consumption Market Share by Application (2016-2021)
  • 6.2 Global Chip On Film Underfill (COF) Consumption Growth Rate by Application (2016-2021)

7 Key Companies Profiled

  • 7.1 Namics Corporation
    • 7.1.1 Namics Corporation Chip On Film Underfill (COF) Corporation Information
    • 7.1.2 Namics Corporation Chip On Film Underfill (COF) Product Portfolio
    • 7.1.3 Namics Corporation Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.1.4 Namics Corporation Main Business and Markets Served
    • 7.1.5 Namics Corporation Recent Developments/Updates
  • 7.2 AI Technology
    • 7.2.1 AI Technology Chip On Film Underfill (COF) Corporation Information
    • 7.2.2 AI Technology Chip On Film Underfill (COF) Product Portfolio
    • 7.2.3 AI Technology Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.2.4 AI Technology Main Business and Markets Served
    • 7.2.5 AI Technology Recent Developments/Updates
  • 7.3 Henkel
    • 7.3.1 Henkel Chip On Film Underfill (COF) Corporation Information
    • 7.3.2 Henkel Chip On Film Underfill (COF) Product Portfolio
    • 7.3.3 Henkel Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.3.4 Henkel Main Business and Markets Served
    • 7.3.5 Henkel Recent Developments/Updates
  • 7.4 Dow
    • 7.4.1 Dow Chip On Film Underfill (COF) Corporation Information
    • 7.4.2 Dow Chip On Film Underfill (COF) Product Portfolio
    • 7.4.3 Dow Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.4.4 Dow Main Business and Markets Served
    • 7.4.5 Dow Recent Developments/Updates
  • 7.5 Asymptotic Technologies
    • 7.5.1 Asymptotic Technologies Chip On Film Underfill (COF) Corporation Information
    • 7.5.2 Asymptotic Technologies Chip On Film Underfill (COF) Product Portfolio
    • 7.5.3 Asymptotic Technologies Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.5.4 Asymptotic Technologies Main Business and Markets Served
    • 7.5.5 Asymptotic Technologies Recent Developments/Updates
  • 7.6 LORD Corporation
    • 7.6.1 LORD Corporation Chip On Film Underfill (COF) Corporation Information
    • 7.6.2 LORD Corporation Chip On Film Underfill (COF) Product Portfolio
    • 7.6.3 LORD Corporation Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.6.4 LORD Corporation Main Business and Markets Served
    • 7.6.5 LORD Corporation Recent Developments/Updates
  • 7.7 Panacol
    • 7.7.1 Panacol Chip On Film Underfill (COF) Corporation Information
    • 7.7.2 Panacol Chip On Film Underfill (COF) Product Portfolio
    • 7.7.3 Panacol Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.7.4 Panacol Main Business and Markets Served
    • 7.7.5 Panacol Recent Developments/Updates
  • 7.8 Won Chemical
    • 7.8.1 Won Chemical Chip On Film Underfill (COF) Corporation Information
    • 7.8.2 Won Chemical Chip On Film Underfill (COF) Product Portfolio
    • 7.8.3 Won Chemical Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.8.4 Won Chemical Main Business and Markets Served
    • 7.7.5 Won Chemical Recent Developments/Updates
  • 7.9 Hitachi Chemical
    • 7.9.1 Hitachi Chemical Chip On Film Underfill (COF) Corporation Information
    • 7.9.2 Hitachi Chemical Chip On Film Underfill (COF) Product Portfolio
    • 7.9.3 Hitachi Chemical Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.9.4 Hitachi Chemical Main Business and Markets Served
    • 7.9.5 Hitachi Chemical Recent Developments/Updates
  • 7.10 Shin-Etsu Chemical
    • 7.10.1 Shin-Etsu Chemical Chip On Film Underfill (COF) Corporation Information
    • 7.10.2 Shin-Etsu Chemical Chip On Film Underfill (COF) Product Portfolio
    • 7.10.3 Shin-Etsu Chemical Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.10.4 Shin-Etsu Chemical Main Business and Markets Served
    • 7.10.5 Shin-Etsu Chemical Recent Developments/Updates
  • 7.11 AIM Solder
    • 7.11.1 AIM Solder Chip On Film Underfill (COF) Corporation Information
    • 7.11.2 AIM Solder Chip On Film Underfill (COF) Product Portfolio
    • 7.11.3 AIM Solder Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.11.4 AIM Solder Main Business and Markets Served
    • 7.11.5 AIM Solder Recent Developments/Updates
  • 7.12 Zymet
    • 7.12.1 Zymet Chip On Film Underfill (COF) Corporation Information
    • 7.12.2 Zymet Chip On Film Underfill (COF) Product Portfolio
    • 7.12.3 Zymet Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.12.4 Zymet Main Business and Markets Served
    • 7.12.5 Zymet Recent Developments/Updates
  • 7.13 Master Bond
    • 7.13.1 Master Bond Chip On Film Underfill (COF) Corporation Information
    • 7.13.2 Master Bond Chip On Film Underfill (COF) Product Portfolio
    • 7.13.3 Master Bond Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.13.4 Master Bond Main Business and Markets Served
    • 7.13.5 Master Bond Recent Developments/Updates
  • 7.14 Bondline
    • 7.14.1 Bondline Chip On Film Underfill (COF) Corporation Information
    • 7.14.2 Bondline Chip On Film Underfill (COF) Product Portfolio
    • 7.14.3 Bondline Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.14.4 Bondline Main Business and Markets Served
    • 7.14.5 Bondline Recent Developments/Updates
  • 7.15 Alpha Advanced Materials
    • 7.15.1 Alpha Advanced Materials Chip On Film Underfill (COF) Corporation Information
    • 7.15.2 Alpha Advanced Materials Chip On Film Underfill (COF) Product Portfolio
    • 7.15.3 Alpha Advanced Materials Chip On Film Underfill (COF) Production Capacity, Revenue, Price and Gross Margin (2016-2021)
    • 7.15.4 Alpha Advanced Materials Main Business and Markets Served
    • 7.15.5 Alpha Advanced Materials Recent Developments/Updates

8 Chip On Film Underfill (COF) Manufacturing Cost Analysis

  • 8.1 Chip On Film Underfill (COF) Key Raw Materials Analysis
    • 8.1.1 Key Raw Materials
    • 8.1.2 Key Raw Materials Price Trend
    • 8.1.3 Key Suppliers of Raw Materials
  • 8.2 Proportion of Manufacturing Cost Structure
  • 8.3 Manufacturing Process Analysis of Chip On Film Underfill (COF)
  • 8.4 Chip On Film Underfill (COF) Industrial Chain Analysis

9 Marketing Channel, Distributors and Customers

  • 9.1 Marketing Channel
  • 9.2 Chip On Film Underfill (COF) Distributors List
  • 9.3 Chip On Film Underfill (COF) Customers

10 Market Dynamics

  • 10.1 Chip On Film Underfill (COF) Industry Trends
  • 10.2 Chip On Film Underfill (COF) Growth Drivers
  • 10.3 Chip On Film Underfill (COF) Market Challenges
  • 10.4 Chip On Film Underfill (COF) Market Restraints

11 Production and Supply Forecast

  • 11.1 Global Forecasted Production of Chip On Film Underfill (COF) by Region (2022-2027)
  • 11.2 North America Chip On Film Underfill (COF) Production, Revenue Forecast (2022-2027)
  • 11.3 Europe Chip On Film Underfill (COF) Production, Revenue Forecast (2022-2027)
  • 11.4 China Chip On Film Underfill (COF) Production, Revenue Forecast (2022-2027)
  • 11.5 Japan Chip On Film Underfill (COF) Production, Revenue Forecast (2022-2027)

12 Consumption and Demand Forecast

  • 12.1 Global Forecasted Demand Analysis of Chip On Film Underfill (COF)
  • 12.2 North America Forecasted Consumption of Chip On Film Underfill (COF) by Country
  • 12.3 Europe Market Forecasted Consumption of Chip On Film Underfill (COF) by Country
  • 12.4 Asia Pacific Market Forecasted Consumption of Chip On Film Underfill (COF) by Region
  • 12.5 Latin America Forecasted Consumption of Chip On Film Underfill (COF) by Country

13 Forecast by Type and by Application (2022-2027)

  • 13.1 Global Production, Revenue and Price Forecast by Type (2022-2027)
    • 13.1.1 Global Forecasted Production of Chip On Film Underfill (COF) by Type (2022-2027)
    • 13.1.2 Global Forecasted Revenue of Chip On Film Underfill (COF) by Type (2022-2027)
    • 13.1.3 Global Forecasted Price of Chip On Film Underfill (COF) by Type (2022-2027)
  • 13.2 Global Forecasted Consumption of Chip On Film Underfill (COF) by Application (2022-2027)

14 Research Finding and Conclusion

    15 Methodology and Data Source

    • 15.1 Methodology/Research Approach
      • 15.1.1 Research Programs/Design
      • 15.1.2 Market Size Estimation
      • 15.1.3 Market Breakdown and Data Triangulation
    • 15.2 Data Source
      • 15.2.1 Secondary Sources
      • 15.2.2 Primary Sources
    • 15.3 Author List

    The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.

    Segment by Type
    Capillary Underfill (CUF)
    No Flow Underfill (NUF)
    Non-Conductive Paste (NCP) Underfill
    Non-Conductive Film (NCF) Underfill
    Molded Underfill (MUF) Underfill

    Segment by Application
    Cell Phone
    Tablet
    LCD Display
    Other

    By Company
    Namics Corporation
    AI Technology
    Henkel
    Dow
    Asymptotic Technologies
    LORD Corporation
    Panacol
    Won Chemical
    Hitachi Chemical
    Shin-Etsu Chemical
    AIM Solder
    Zymet
    Master Bond
    Bondline
    Alpha Advanced Materials

    Production by Region
    North America
    Europe
    China
    Japan

    Consumption by Region
    North America
    U.S.
    Canada
    Europe
    Germany
    France
    U.K.
    Italy
    Russia
    Asia-Pacific
    China
    Japan
    South Korea
    India
    Australia
    Taiwan
    Indonesia
    Thailand
    Malaysia
    Philippines
    Vietnam
    Latin America
    Mexico
    Brazil
    Argentina
    Middle East & Africa
    Turkey
    Saudi Arabia
    UAE

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