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Global Chip Bonding Adhesive Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

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1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Chip Bonding Adhesive Consumption Value by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 Thermal Conductivity
    • 1.3.3 Conductive
    • 1.3.4 Insulation
    • 1.3.5 Others
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Chip Bonding Adhesive Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 Consumer Electronics
    • 1.4.3 Automotive
    • 1.4.4 Communication Equipment
    • 1.4.5 Aerospace
    • 1.4.6 Others
  • 1.5 Global Chip Bonding Adhesive Market Size & Forecast
    • 1.5.1 Global Chip Bonding Adhesive Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global Chip Bonding Adhesive Sales Quantity (2020-2031)
    • 1.5.3 Global Chip Bonding Adhesive Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 Nordson Corporation
    • 2.1.1 Nordson Corporation Details
    • 2.1.2 Nordson Corporation Major Business
    • 2.1.3 Nordson Corporation Chip Bonding Adhesive Product and Services
    • 2.1.4 Nordson Corporation Chip Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 Nordson Corporation Recent Developments/Updates
  • 2.2 Henkel
    • 2.2.1 Henkel Details
    • 2.2.2 Henkel Major Business
    • 2.2.3 Henkel Chip Bonding Adhesive Product and Services
    • 2.2.4 Henkel Chip Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 Henkel Recent Developments/Updates
  • 2.3 3M
    • 2.3.1 3M Details
    • 2.3.2 3M Major Business
    • 2.3.3 3M Chip Bonding Adhesive Product and Services
    • 2.3.4 3M Chip Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 3M Recent Developments/Updates
  • 2.4 Namics
    • 2.4.1 Namics Details
    • 2.4.2 Namics Major Business
    • 2.4.3 Namics Chip Bonding Adhesive Product and Services
    • 2.4.4 Namics Chip Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 Namics Recent Developments/Updates
  • 2.5 ITW
    • 2.5.1 ITW Details
    • 2.5.2 ITW Major Business
    • 2.5.3 ITW Chip Bonding Adhesive Product and Services
    • 2.5.4 ITW Chip Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 ITW Recent Developments/Updates
  • 2.6 Dow
    • 2.6.1 Dow Details
    • 2.6.2 Dow Major Business
    • 2.6.3 Dow Chip Bonding Adhesive Product and Services
    • 2.6.4 Dow Chip Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 Dow Recent Developments/Updates
  • 2.7 Huntsman
    • 2.7.1 Huntsman Details
    • 2.7.2 Huntsman Major Business
    • 2.7.3 Huntsman Chip Bonding Adhesive Product and Services
    • 2.7.4 Huntsman Chip Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 Huntsman Recent Developments/Updates
  • 2.8 Delo
    • 2.8.1 Delo Details
    • 2.8.2 Delo Major Business
    • 2.8.3 Delo Chip Bonding Adhesive Product and Services
    • 2.8.4 Delo Chip Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 Delo Recent Developments/Updates
  • 2.9 Parker
    • 2.9.1 Parker Details
    • 2.9.2 Parker Major Business
    • 2.9.3 Parker Chip Bonding Adhesive Product and Services
    • 2.9.4 Parker Chip Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 Parker Recent Developments/Updates
  • 2.10 H.B. Fuller
    • 2.10.1 H.B. Fuller Details
    • 2.10.2 H.B. Fuller Major Business
    • 2.10.3 H.B. Fuller Chip Bonding Adhesive Product and Services
    • 2.10.4 H.B. Fuller Chip Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 H.B. Fuller Recent Developments/Updates
  • 2.11 Hexion
    • 2.11.1 Hexion Details
    • 2.11.2 Hexion Major Business
    • 2.11.3 Hexion Chip Bonding Adhesive Product and Services
    • 2.11.4 Hexion Chip Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.11.5 Hexion Recent Developments/Updates
  • 2.12 Nagase
    • 2.12.1 Nagase Details
    • 2.12.2 Nagase Major Business
    • 2.12.3 Nagase Chip Bonding Adhesive Product and Services
    • 2.12.4 Nagase Chip Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.12.5 Nagase Recent Developments/Updates
  • 2.13 Dymax
    • 2.13.1 Dymax Details
    • 2.13.2 Dymax Major Business
    • 2.13.3 Dymax Chip Bonding Adhesive Product and Services
    • 2.13.4 Dymax Chip Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.13.5 Dymax Recent Developments/Updates

3 Competitive Environment: Chip Bonding Adhesive by Manufacturer

  • 3.1 Global Chip Bonding Adhesive Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global Chip Bonding Adhesive Revenue by Manufacturer (2020-2025)
  • 3.3 Global Chip Bonding Adhesive Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of Chip Bonding Adhesive by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 Chip Bonding Adhesive Manufacturer Market Share in 2024
    • 3.4.3 Top 6 Chip Bonding Adhesive Manufacturer Market Share in 2024
  • 3.5 Chip Bonding Adhesive Market: Overall Company Footprint Analysis
    • 3.5.1 Chip Bonding Adhesive Market: Region Footprint
    • 3.5.2 Chip Bonding Adhesive Market: Company Product Type Footprint
    • 3.5.3 Chip Bonding Adhesive Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Chip Bonding Adhesive Market Size by Region
    • 4.1.1 Global Chip Bonding Adhesive Sales Quantity by Region (2020-2031)
    • 4.1.2 Global Chip Bonding Adhesive Consumption Value by Region (2020-2031)
    • 4.1.3 Global Chip Bonding Adhesive Average Price by Region (2020-2031)
  • 4.2 North America Chip Bonding Adhesive Consumption Value (2020-2031)
  • 4.3 Europe Chip Bonding Adhesive Consumption Value (2020-2031)
  • 4.4 Asia-Pacific Chip Bonding Adhesive Consumption Value (2020-2031)
  • 4.5 South America Chip Bonding Adhesive Consumption Value (2020-2031)
  • 4.6 Middle East & Africa Chip Bonding Adhesive Consumption Value (2020-2031)

5 Market Segment by Type

  • 5.1 Global Chip Bonding Adhesive Sales Quantity by Type (2020-2031)
  • 5.2 Global Chip Bonding Adhesive Consumption Value by Type (2020-2031)
  • 5.3 Global Chip Bonding Adhesive Average Price by Type (2020-2031)

6 Market Segment by Application

  • 6.1 Global Chip Bonding Adhesive Sales Quantity by Application (2020-2031)
  • 6.2 Global Chip Bonding Adhesive Consumption Value by Application (2020-2031)
  • 6.3 Global Chip Bonding Adhesive Average Price by Application (2020-2031)

7 North America

  • 7.1 North America Chip Bonding Adhesive Sales Quantity by Type (2020-2031)
  • 7.2 North America Chip Bonding Adhesive Sales Quantity by Application (2020-2031)
  • 7.3 North America Chip Bonding Adhesive Market Size by Country
    • 7.3.1 North America Chip Bonding Adhesive Sales Quantity by Country (2020-2031)
    • 7.3.2 North America Chip Bonding Adhesive Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe Chip Bonding Adhesive Sales Quantity by Type (2020-2031)
  • 8.2 Europe Chip Bonding Adhesive Sales Quantity by Application (2020-2031)
  • 8.3 Europe Chip Bonding Adhesive Market Size by Country
    • 8.3.1 Europe Chip Bonding Adhesive Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe Chip Bonding Adhesive Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific Chip Bonding Adhesive Sales Quantity by Type (2020-2031)
  • 9.2 Asia-Pacific Chip Bonding Adhesive Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific Chip Bonding Adhesive Market Size by Region
    • 9.3.1 Asia-Pacific Chip Bonding Adhesive Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific Chip Bonding Adhesive Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America Chip Bonding Adhesive Sales Quantity by Type (2020-2031)
  • 10.2 South America Chip Bonding Adhesive Sales Quantity by Application (2020-2031)
  • 10.3 South America Chip Bonding Adhesive Market Size by Country
    • 10.3.1 South America Chip Bonding Adhesive Sales Quantity by Country (2020-2031)
    • 10.3.2 South America Chip Bonding Adhesive Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa Chip Bonding Adhesive Sales Quantity by Type (2020-2031)
  • 11.2 Middle East & Africa Chip Bonding Adhesive Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa Chip Bonding Adhesive Market Size by Country
    • 11.3.1 Middle East & Africa Chip Bonding Adhesive Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa Chip Bonding Adhesive Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 Chip Bonding Adhesive Market Drivers
  • 12.2 Chip Bonding Adhesive Market Restraints
  • 12.3 Chip Bonding Adhesive Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Chip Bonding Adhesive and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Chip Bonding Adhesive
  • 13.3 Chip Bonding Adhesive Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Chip Bonding Adhesive Typical Distributors
  • 14.3 Chip Bonding Adhesive Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global Chip Bonding Adhesive market size was valued at US$ 385 million in 2024 and is forecast to a readjusted size of USD 546 million by 2031 with a CAGR of 5.2% during review period.
    In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
    Chip bonding adhesive is a high-performance adhesive material used in chip packaging and assembly processes. It mainly plays the role of fixing chips, dissipating heat and protecting electronic components. Its performance directly affects the reliability, life and performance of chips, and is a key material in semiconductor manufacturing and electronic assembly.
    This report is a detailed and comprehensive analysis for global Chip Bonding Adhesive market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
    Key Features:
    Global Chip Bonding Adhesive market size and forecasts, in consumption value ($ Million), sales quantity (Kilotons), and average selling prices (US$/Ton), 2020-2031
    Global Chip Bonding Adhesive market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Kilotons), and average selling prices (US$/Ton), 2020-2031
    Global Chip Bonding Adhesive market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Kilotons), and average selling prices (US$/Ton), 2020-2031
    Global Chip Bonding Adhesive market shares of main players, shipments in revenue ($ Million), sales quantity (Kilotons), and ASP (US$/Ton), 2020-2025
    The Primary Objectives in This Report Are:
    To determine the size of the total market opportunity of global and key countries
    To assess the growth potential for Chip Bonding Adhesive
    To forecast future growth in each product and end-use market
    To assess competitive factors affecting the marketplace
    This report profiles key players in the global Chip Bonding Adhesive market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Nordson Corporation, Henkel, 3M, Namics, ITW, Dow, Huntsman, Delo, Parker, H.B. Fuller, etc.
    This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
    Market Segmentation
    Chip Bonding Adhesive market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
    Market segment by Type
    Thermal Conductivity
    Conductive
    Insulation
    Others
    Market segment by Application
    Consumer Electronics
    Automotive
    Communication Equipment
    Aerospace
    Others
    Major players covered
    Nordson Corporation
    Henkel
    3M
    Namics
    ITW
    Dow
    Huntsman
    Delo
    Parker
    H.B. Fuller
    Hexion
    Nagase
    Dymax
    Market segment by region, regional analysis covers
    North America (United States, Canada, and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 15 chapters:
    Chapter 1, to describe Chip Bonding Adhesive product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top manufacturers of Chip Bonding Adhesive, with price, sales quantity, revenue, and global market share of Chip Bonding Adhesive from 2020 to 2025.
    Chapter 3, the Chip Bonding Adhesive competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
    Chapter 4, the Chip Bonding Adhesive breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
    Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
    Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Chip Bonding Adhesive market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
    Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
    Chapter 13, the key raw materials and key suppliers, and industry chain of Chip Bonding Adhesive.
    Chapter 14 and 15, to describe Chip Bonding Adhesive sales channel, distributors, customers, research findings and conclusion.

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