Table of Content

1 Market Overview

• 1.1 Market Segment Overview
  • 1.1.1 Product Definition
  • 1.1.2 Market by Type
    • 1.1.2.1 Gold Bonding Wire
    • 1.1.2.2 Copper Bonding Wire
    • 1.1.2.3 Silver Bonding Wire
    • 1.1.2.4 Palladium Coated Copper Bonding Wire
    • 1.1.2.5 Others
  • 1.1.3 Market by Application
    • 1.1.3.1 IC
    • 1.1.3.2 Transistor
    • 1.1.3.3 Others
• 1.2 Global and China Market Size
  • 1.2.1 Global Overview
  • 1.2.2 China Overview

2 Global and China Market by Company

• 2.1 Global
  • 2.1.1 Global Sales by Company
  • 2.1.2 Global Price by Company
• 2.2 China
  • 2.2.1 China Sales by Company
  • 2.2.2 China Price by Company

3 Global and China Market by Type

• 3.1 Global
  • 3.1.1 Global Sales by Type
  • 3.1.2 Global Price by Type
• 3.2 China
  • 3.2.1 China Sales by Type
  • 3.2.2 China Price by Type

4 Global and China Market by Application

• 4.1 Global
  • 4.1.1 Global Sales by Application
  • 4.1.2 Global Price by Application
• 4.2 China
  • 4.2.1 China Sales by Application
  • 4.2.2 China Price by Application

5 China Trade

• 5.1 Export
• 5.2 Import

6 Key Manufacturers

• 6.1 Tanaka
  • 6.1.1 Company Information
  • 6.1.2 Product Specifications
  • 6.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
• 6.2 Heraeus
• 6.3 Sumitomo Metal Mining
• 6.4 MK Electron
• 6.5 AMETEK
• 6.6 Doublink Solders
• 6.7 Yantai Zhaojin Kanfort
• 6.8 Tatsuta Electric Wire & Cable
• 6.9 Kangqiang Electronics
• 6.10 The Prince & Izant
• 6.11 Custom Chip Connections
• 6.12 Yantai YesNo Electronic Materials

7 Industry Upstream

• 7.1 Industry Chain
• 7.2 Raw Materials

8 Market Environment

• 8.1 SWOT
• 8.2 Porter's Five Forces

9 Conclusion

Summary
Bonding wire is the material of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication."
Market Segment as follows:
By Type
Gold Bonding Wire
Copper Bonding Wire
Silver Bonding Wire
Palladium Coated Copper Bonding Wire
Others
By Application
IC
Transistor
Others
By Company
Tanaka
Heraeus
Sumitomo Metal Mining
MK Electron
AMETEK
Doublink Solders
Yantai Zhaojin Kanfort
Tatsuta Electric Wire & Cable
Kangqiang Electronics
The Prince & Izant
Custom Chip Connections
Yantai YesNo Electronic Materials
The main contents of the report including:
Section 1:
Product definition, type and application, global and China market overview;
Section 2:
Global and China Market competition by company;
Section 3:
Global and China sales revenue, volume and price by type;
Section 4:
Global and China sales revenue, volume and price by application;
Section 5:
China export and import;
Section 6:
Company information, business overview, sales data and product specifications;
Section 7:
Industry chain and raw materials;
Section 8:
SWOT and Porter's Five Forces;
Section 9:
Conclusion.