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Global and China Back Grinding Tapes Market Research by Company, Type & Application 2013-2025

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Table of Content

    1 Market Overview

    • 1.1 Market Segment Overview
      • 1.1.1 Product Definition
      • 1.1.2 Market by Type
        • 1.1.2.1 E series (UV Curable BG Tape)
        • 1.1.2.2 P series (Non-UV type BG Tape)
        • 1.1.2.3 S series (Peeling Tape)
      • 1.1.3 Market by Application
        • 1.1.3.1 Bump Wafers
        • 1.1.3.2 Protective Film
        • 1.1.3.3 Others
    • 1.2 Global and China Market Size
      • 1.2.1 Global Overview
      • 1.2.2 China Overview

    2 Global and China Market by Company

    • 2.1 Global
      • 2.1.1 Global Sales by Company
      • 2.1.2 Global Price by Company
    • 2.2 China
      • 2.2.1 China Sales by Company
      • 2.2.2 China Price by Company

    3 Global and China Market by Type

    • 3.1 Global
      • 3.1.1 Global Sales by Type
      • 3.1.2 Global Price by Type
    • 3.2 China
      • 3.2.1 China Sales by Type
      • 3.2.2 China Price by Type

    4 Global and China Market by Application

    • 4.1 Global
      • 4.1.1 Global Sales by Application
      • 4.1.2 Global Price by Application
    • 4.2 China
      • 4.2.1 China Sales by Application
      • 4.2.2 China Price by Application

    5 China Trade

    • 5.1 Export
    • 5.2 Import

    6 Key Manufacturers

    • 6.1 Nitto
      • 6.1.1 Company Information
      • 6.1.2 Product Specifications
      • 6.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    • 6.2 AI Technology, Inc.
    • 6.3 Denka
    • 6.4 Mitsui Chemicals
    • 6.5 LINTEC Corporation
    • 6.6 Furukawa Electric
    • 6.7 NAMICS Corporation
    • 6.8 Toyo Adtec Asia Pacific

    7 Industry Upstream

    • 7.1 Industry Chain
    • 7.2 Raw Materials

    8 Market Environment

    • 8.1 SWOT
    • 8.2 Porter's Five Forces

    9 Conclusion

    Summary

    Market Segment as follows:
    By Type
    E series (UV Curable BG Tape)
    P series (Non-UV type BG Tape)
    S series (Peeling Tape)
    By Application
    Bump Wafers
    Protective Film
    Others
    By Company
    Nitto
    AI Technology, Inc.
    Denka
    Mitsui Chemicals
    LINTEC Corporation
    Furukawa Electric
    NAMICS Corporation
    Toyo Adtec Asia Pacific
    The main contents of the report including:
    Section 1:
    Product definition, type and application, global and China market overview;
    Section 2:
    Global and China Market competition by company;
    Section 3:
    Global and China sales revenue, volume and price by type;
    Section 4:
    Global and China sales revenue, volume and price by application;
    Section 5:
    China export and import;
    Section 6:
    Company information, business overview, sales data and product specifications;
    Section 7:
    Industry chain and raw materials;
    Section 8:
    SWOT and Porter's Five Forces;
    Section 9:
    Conclusion.

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