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Global Automated Wafer Bonder Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

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1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Automated Wafer Bonder Consumption Value by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 Fully Automatic
    • 1.3.3 Semi Automatic
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Automated Wafer Bonder Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 MEMS
    • 1.4.3 Advanced Packaging
    • 1.4.4 CIS
    • 1.4.5 Others
  • 1.5 Global Automated Wafer Bonder Market Size & Forecast
    • 1.5.1 Global Automated Wafer Bonder Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global Automated Wafer Bonder Sales Quantity (2020-2031)
    • 1.5.3 Global Automated Wafer Bonder Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 EV Group
    • 2.1.1 EV Group Details
    • 2.1.2 EV Group Major Business
    • 2.1.3 EV Group Automated Wafer Bonder Product and Services
    • 2.1.4 EV Group Automated Wafer Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 EV Group Recent Developments/Updates
  • 2.2 SUSS MicroTec
    • 2.2.1 SUSS MicroTec Details
    • 2.2.2 SUSS MicroTec Major Business
    • 2.2.3 SUSS MicroTec Automated Wafer Bonder Product and Services
    • 2.2.4 SUSS MicroTec Automated Wafer Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 SUSS MicroTec Recent Developments/Updates
  • 2.3 Tokyo Electron
    • 2.3.1 Tokyo Electron Details
    • 2.3.2 Tokyo Electron Major Business
    • 2.3.3 Tokyo Electron Automated Wafer Bonder Product and Services
    • 2.3.4 Tokyo Electron Automated Wafer Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 Tokyo Electron Recent Developments/Updates
  • 2.4 Applied Microengineering
    • 2.4.1 Applied Microengineering Details
    • 2.4.2 Applied Microengineering Major Business
    • 2.4.3 Applied Microengineering Automated Wafer Bonder Product and Services
    • 2.4.4 Applied Microengineering Automated Wafer Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 Applied Microengineering Recent Developments/Updates
  • 2.5 Nidec Machine Tool
    • 2.5.1 Nidec Machine Tool Details
    • 2.5.2 Nidec Machine Tool Major Business
    • 2.5.3 Nidec Machine Tool Automated Wafer Bonder Product and Services
    • 2.5.4 Nidec Machine Tool Automated Wafer Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 Nidec Machine Tool Recent Developments/Updates
  • 2.6 Ayumi Industry
    • 2.6.1 Ayumi Industry Details
    • 2.6.2 Ayumi Industry Major Business
    • 2.6.3 Ayumi Industry Automated Wafer Bonder Product and Services
    • 2.6.4 Ayumi Industry Automated Wafer Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 Ayumi Industry Recent Developments/Updates
  • 2.7 Bondtech
    • 2.7.1 Bondtech Details
    • 2.7.2 Bondtech Major Business
    • 2.7.3 Bondtech Automated Wafer Bonder Product and Services
    • 2.7.4 Bondtech Automated Wafer Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 Bondtech Recent Developments/Updates
  • 2.8 Aimechatec
    • 2.8.1 Aimechatec Details
    • 2.8.2 Aimechatec Major Business
    • 2.8.3 Aimechatec Automated Wafer Bonder Product and Services
    • 2.8.4 Aimechatec Automated Wafer Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 Aimechatec Recent Developments/Updates
  • 2.9 U-Precision Tech
    • 2.9.1 U-Precision Tech Details
    • 2.9.2 U-Precision Tech Major Business
    • 2.9.3 U-Precision Tech Automated Wafer Bonder Product and Services
    • 2.9.4 U-Precision Tech Automated Wafer Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 U-Precision Tech Recent Developments/Updates
  • 2.10 TAZMO
    • 2.10.1 TAZMO Details
    • 2.10.2 TAZMO Major Business
    • 2.10.3 TAZMO Automated Wafer Bonder Product and Services
    • 2.10.4 TAZMO Automated Wafer Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 TAZMO Recent Developments/Updates
  • 2.11 Hutem
    • 2.11.1 Hutem Details
    • 2.11.2 Hutem Major Business
    • 2.11.3 Hutem Automated Wafer Bonder Product and Services
    • 2.11.4 Hutem Automated Wafer Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.11.5 Hutem Recent Developments/Updates
  • 2.12 Shanghai Micro Electronics
    • 2.12.1 Shanghai Micro Electronics Details
    • 2.12.2 Shanghai Micro Electronics Major Business
    • 2.12.3 Shanghai Micro Electronics Automated Wafer Bonder Product and Services
    • 2.12.4 Shanghai Micro Electronics Automated Wafer Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.12.5 Shanghai Micro Electronics Recent Developments/Updates
  • 2.13 Canon
    • 2.13.1 Canon Details
    • 2.13.2 Canon Major Business
    • 2.13.3 Canon Automated Wafer Bonder Product and Services
    • 2.13.4 Canon Automated Wafer Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.13.5 Canon Recent Developments/Updates

3 Competitive Environment: Automated Wafer Bonder by Manufacturer

  • 3.1 Global Automated Wafer Bonder Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global Automated Wafer Bonder Revenue by Manufacturer (2020-2025)
  • 3.3 Global Automated Wafer Bonder Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of Automated Wafer Bonder by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 Automated Wafer Bonder Manufacturer Market Share in 2024
    • 3.4.3 Top 6 Automated Wafer Bonder Manufacturer Market Share in 2024
  • 3.5 Automated Wafer Bonder Market: Overall Company Footprint Analysis
    • 3.5.1 Automated Wafer Bonder Market: Region Footprint
    • 3.5.2 Automated Wafer Bonder Market: Company Product Type Footprint
    • 3.5.3 Automated Wafer Bonder Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Automated Wafer Bonder Market Size by Region
    • 4.1.1 Global Automated Wafer Bonder Sales Quantity by Region (2020-2031)
    • 4.1.2 Global Automated Wafer Bonder Consumption Value by Region (2020-2031)
    • 4.1.3 Global Automated Wafer Bonder Average Price by Region (2020-2031)
  • 4.2 North America Automated Wafer Bonder Consumption Value (2020-2031)
  • 4.3 Europe Automated Wafer Bonder Consumption Value (2020-2031)
  • 4.4 Asia-Pacific Automated Wafer Bonder Consumption Value (2020-2031)
  • 4.5 South America Automated Wafer Bonder Consumption Value (2020-2031)
  • 4.6 Middle East & Africa Automated Wafer Bonder Consumption Value (2020-2031)

5 Market Segment by Type

  • 5.1 Global Automated Wafer Bonder Sales Quantity by Type (2020-2031)
  • 5.2 Global Automated Wafer Bonder Consumption Value by Type (2020-2031)
  • 5.3 Global Automated Wafer Bonder Average Price by Type (2020-2031)

6 Market Segment by Application

  • 6.1 Global Automated Wafer Bonder Sales Quantity by Application (2020-2031)
  • 6.2 Global Automated Wafer Bonder Consumption Value by Application (2020-2031)
  • 6.3 Global Automated Wafer Bonder Average Price by Application (2020-2031)

7 North America

  • 7.1 North America Automated Wafer Bonder Sales Quantity by Type (2020-2031)
  • 7.2 North America Automated Wafer Bonder Sales Quantity by Application (2020-2031)
  • 7.3 North America Automated Wafer Bonder Market Size by Country
    • 7.3.1 North America Automated Wafer Bonder Sales Quantity by Country (2020-2031)
    • 7.3.2 North America Automated Wafer Bonder Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe Automated Wafer Bonder Sales Quantity by Type (2020-2031)
  • 8.2 Europe Automated Wafer Bonder Sales Quantity by Application (2020-2031)
  • 8.3 Europe Automated Wafer Bonder Market Size by Country
    • 8.3.1 Europe Automated Wafer Bonder Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe Automated Wafer Bonder Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific Automated Wafer Bonder Sales Quantity by Type (2020-2031)
  • 9.2 Asia-Pacific Automated Wafer Bonder Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific Automated Wafer Bonder Market Size by Region
    • 9.3.1 Asia-Pacific Automated Wafer Bonder Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific Automated Wafer Bonder Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America Automated Wafer Bonder Sales Quantity by Type (2020-2031)
  • 10.2 South America Automated Wafer Bonder Sales Quantity by Application (2020-2031)
  • 10.3 South America Automated Wafer Bonder Market Size by Country
    • 10.3.1 South America Automated Wafer Bonder Sales Quantity by Country (2020-2031)
    • 10.3.2 South America Automated Wafer Bonder Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa Automated Wafer Bonder Sales Quantity by Type (2020-2031)
  • 11.2 Middle East & Africa Automated Wafer Bonder Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa Automated Wafer Bonder Market Size by Country
    • 11.3.1 Middle East & Africa Automated Wafer Bonder Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa Automated Wafer Bonder Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 Automated Wafer Bonder Market Drivers
  • 12.2 Automated Wafer Bonder Market Restraints
  • 12.3 Automated Wafer Bonder Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Automated Wafer Bonder and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Automated Wafer Bonder
  • 13.3 Automated Wafer Bonder Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Automated Wafer Bonder Typical Distributors
  • 14.3 Automated Wafer Bonder Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global Automated Wafer Bonder market size was valued at US$ 330 million in 2024 and is forecast to a readjusted size of USD 462 million by 2031 with a CAGR of 5.0% during review period.
    An Automated Wafer Bonder is a specialized piece of equipment designed for automated wafer bonding processes in semiconductor and microelectronics manufacturing. It enables precise alignment and bonding of wafers under controlled conditions, significantly enhancing efficiency, accuracy, and scalability in high-volume production environments.
    The automated wafer bonder market is a growing segment within the semiconductor manufacturing equipment industry. It caters to the increasing demand for precision, efficiency, and scalability in wafer bonding processes used for producing advanced electronics such as 3D integrated circuits (3D ICs), MEMS, photonics, and advanced packaging solutions.
    Market Drivers
    Rising Demand for Miniaturized Electronics: The push for smaller, more powerful devices requires precise wafer bonding for 3D stacking and system-in-package (SiP) applications. Advancements in Semiconductor Manufacturing: The shift toward advanced packaging techniques like fan-out wafer-level packaging (FOWLP) drives demand for automated wafer bonders. Growth in MEMS and Sensors: Increasing adoption of MEMS in automotive, IoT, and consumer electronics is boosting the need for accurate and high-throughput bonding processes. Automation Trends: Growing emphasis on factory automation and Industry 4.0 is driving the adoption of automated equipment to enhance efficiency and reduce human error.
    Market Restraints
    High Initial Investment: Automated wafer bonders involve significant capital expenditure, which can be a barrier for smaller manufacturers. Complexity of Operation: Advanced equipment requires skilled operators and robust process integration. Material and Process Challenges: Compatibility issues between different materials and the need for tight process control can limit adoption.
    Market Opportunities
    Emerging Markets: Expanding semiconductor manufacturing in regions like Asia-Pacific presents growth opportunities. Integration with Artificial Intelligence (AI): Use of AI and machine learning in wafer bonding equipment enhances precision and process optimization. Applications in Emerging Technologies: Growing demand for devices in fields like quantum computing, flexible electronics, and bio-MEMS opens new market segments.
    This report is a detailed and comprehensive analysis for global Automated Wafer Bonder market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
    Key Features:
    Global Automated Wafer Bonder market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
    Global Automated Wafer Bonder market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
    Global Automated Wafer Bonder market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
    Global Automated Wafer Bonder market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
    The Primary Objectives in This Report Are:
    To determine the size of the total market opportunity of global and key countries
    To assess the growth potential for Automated Wafer Bonder
    To forecast future growth in each product and end-use market
    To assess competitive factors affecting the marketplace
    This report profiles key players in the global Automated Wafer Bonder market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Bondtech, Aimechatec, U-Precision Tech, TAZMO, etc.
    This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
    Market Segmentation
    Automated Wafer Bonder market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
    Market segment by Type
    Fully Automatic
    Semi Automatic
    Market segment by Application
    MEMS
    Advanced Packaging
    CIS
    Others
    Major players covered
    EV Group
    SUSS MicroTec
    Tokyo Electron
    Applied Microengineering
    Nidec Machine Tool
    Ayumi Industry
    Bondtech
    Aimechatec
    U-Precision Tech
    TAZMO
    Hutem
    Shanghai Micro Electronics
    Canon
    Market segment by region, regional analysis covers
    North America (United States, Canada, and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 15 chapters:
    Chapter 1, to describe Automated Wafer Bonder product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top manufacturers of Automated Wafer Bonder, with price, sales quantity, revenue, and global market share of Automated Wafer Bonder from 2020 to 2025.
    Chapter 3, the Automated Wafer Bonder competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
    Chapter 4, the Automated Wafer Bonder breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
    Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
    Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Automated Wafer Bonder market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
    Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
    Chapter 13, the key raw materials and key suppliers, and industry chain of Automated Wafer Bonder.
    Chapter 14 and 15, to describe Automated Wafer Bonder sales channel, distributors, customers, research findings and conclusion.

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