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Global (United States, European Union and China) 3D ICs Market Research Report 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global 3D ICs Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 3D SiCs
      • 1.3.3 Monolithic 3D ICs
    • 1.4 Market Segment by Application
      • 1.4.1 Global 3D ICs Market Share by Application (2019-2025)
      • 1.4.2 Automotive
      • 1.4.3 Smart Technologies
      • 1.4.4 Robotics
      • 1.4.5 Electronics
      • 1.4.6 Medical
      • 1.4.7 Industrial
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global 3D ICs Production Value 2014-2025
      • 2.1.2 Global 3D ICs Production 2014-2025
      • 2.1.3 Global 3D ICs Capacity 2014-2025
      • 2.1.4 Global 3D ICs Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global 3D ICs Market Size CAGR of Key Regions
      • 2.2.2 Global 3D ICs Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global 3D ICs Capacity by Manufacturers
      • 3.1.2 Global 3D ICs Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 3D ICs Revenue by Manufacturers (2014-2019)
      • 3.2.2 3D ICs Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global 3D ICs Market Concentration Ratio (CR5 and HHI)
    • 3.3 3D ICs Price by Manufacturers
    • 3.4 Key Manufacturers 3D ICs Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into 3D ICs Market
    • 3.6 Key Manufacturers 3D ICs Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 3D SiCs Production and Production Value (2014-2019)
      • 4.1.2 Monolithic 3D ICs Production and Production Value (2014-2019)
    • 4.2 Global 3D ICs Production Market Share by Type
    • 4.3 Global 3D ICs Production Value Market Share by Type
    • 4.4 3D ICs Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global 3D ICs Consumption by Application

    6 Production by Regions

    • 6.1 Global 3D ICs Production (History Data) by Regions 2014-2019
    • 6.2 Global 3D ICs Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States 3D ICs Production Growth Rate 2014-2019
      • 6.3.2 United States 3D ICs Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States 3D ICs Import & Export
    • 6.4 European Union
      • 6.4.1 European Union 3D ICs Production Growth Rate 2014-2019
      • 6.4.2 European Union 3D ICs Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union 3D ICs Import & Export
    • 6.5 China
      • 6.5.1 China 3D ICs Production Growth Rate 2014-2019
      • 6.5.2 China 3D ICs Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China 3D ICs Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 3D ICs Consumption by Regions

    • 7.1 Global 3D ICs Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States 3D ICs Consumption by Type
      • 7.2.2 United States 3D ICs Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union 3D ICs Consumption by Type
      • 7.3.2 European Union 3D ICs Consumption by Application
    • 7.4 China
      • 7.4.1 China 3D ICs Consumption by Type
      • 7.4.2 China 3D ICs Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World 3D ICs Consumption by Type
      • 7.5.2 Rest of World 3D ICs Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 Xilinx
      • 8.1.1 Xilinx Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of 3D ICs
      • 8.1.4 3D ICs Product Introduction
      • 8.1.5 Xilinx Recent Development
    • 8.2 Advanced Semiconductor Engineering (ASE)
      • 8.2.1 Advanced Semiconductor Engineering (ASE) Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of 3D ICs
      • 8.2.4 3D ICs Product Introduction
      • 8.2.5 Advanced Semiconductor Engineering (ASE) Recent Development
    • 8.3 Samsung
      • 8.3.1 Samsung Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of 3D ICs
      • 8.3.4 3D ICs Product Introduction
      • 8.3.5 Samsung Recent Development
    • 8.4 STMicroelectronics
      • 8.4.1 STMicroelectronics Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of 3D ICs
      • 8.4.4 3D ICs Product Introduction
      • 8.4.5 STMicroelectronics Recent Development
    • 8.5 Taiwan Semiconductors Manufacturing (TSMC)
      • 8.5.1 Taiwan Semiconductors Manufacturing (TSMC) Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of 3D ICs
      • 8.5.4 3D ICs Product Introduction
      • 8.5.5 Taiwan Semiconductors Manufacturing (TSMC) Recent Development
    • 8.6 Toshiba
      • 8.6.1 Toshiba Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of 3D ICs
      • 8.6.4 3D ICs Product Introduction
      • 8.6.5 Toshiba Recent Development
    • 8.7 EV Group
      • 8.7.1 EV Group Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of 3D ICs
      • 8.7.4 3D ICs Product Introduction
      • 8.7.5 EV Group Recent Development
    • 8.8 Tessera
      • 8.8.1 Tessera Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of 3D ICs
      • 8.8.4 3D ICs Product Introduction
      • 8.8.5 Tessera Recent Development

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global 3D ICs Capacity, Production Forecast 2019-2025
      • 9.1.2 Global 3D ICs Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global 3D ICs Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global 3D ICs Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global 3D ICs Production Forecast by Type
      • 9.7.2 Global 3D ICs Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 3D ICs Sales Channels
      • 10.2.2 3D ICs Distributors
    • 10.3 3D ICs Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      3D IC is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits.
      3D IC technology finds its applications in various end-use sectors such as consumer electronics, military, information and communication technology, automotive and aerospace among others. IC manufacturers use different fabrication process for 3D ICs, depending upon requirements of the circuit system such as beam re-crystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization.
      In 2019, the market size of 3D ICs is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D ICs.

      This report studies the global market size of 3D ICs, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the 3D ICs production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      Xilinx
      Advanced Semiconductor Engineering (ASE)
      Samsung
      STMicroelectronics
      Taiwan Semiconductors Manufacturing (TSMC)
      Toshiba
      EV Group
      Tessera

      Market Segment by Product Type
      3D SiCs
      Monolithic 3D ICs

      Market Segment by Application
      Automotive
      Smart Technologies
      Robotics
      Electronics
      Medical
      Industrial

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the 3D ICs status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key 3D ICs manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of 3D ICs are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

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