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Global 3D IC and 2.5D IC Packaging Market Insights, Forecast to 2025

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Table of Contents

    1 Study Coverage

    • 1.1 3D IC and 2.5D IC Packaging Product
    • 1.2 Key Market Segments in This Study
    • 1.3 Key Manufacturers Covered
    • 1.4 Market by Type
      • 1.4.1 Global 3D IC and 2.5D IC Packaging Market Size Growth Rate by Type
      • 1.4.2 3D wafer-level chip-scale packaging
      • 1.4.3 3D TSV
      • 1.4.4 2.5D
    • 1.5 Market by Application
      • 1.5.1 Global 3D IC and 2.5D IC Packaging Market Size Growth Rate by Application
      • 1.5.2 Logic
      • 1.5.3 Imaging & optoelectronics
      • 1.5.4 Memory
      • 1.5.5 MEMS/sensors
      • 1.5.6 LED
      • 1.5.7 Power
    • 1.6 Study Objectives
    • 1.7 Years Considered

    2 Executive Summary

    • 2.1 Global 3D IC and 2.5D IC Packaging Market Size
      • 2.1.1 Global 3D IC and 2.5D IC Packaging Revenue 2014-2025
      • 2.1.2 Global 3D IC and 2.5D IC Packaging Production 2014-2025
    • 2.2 3D IC and 2.5D IC Packaging Growth Rate (CAGR) 2019-2025
    • 2.3 Analysis of Competitive Landscape
      • 2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
      • 2.3.2 Key 3D IC and 2.5D IC Packaging Manufacturers
        • 2.3.2.1 3D IC and 2.5D IC Packaging Manufacturing Base Distribution, Headquarters
        • 2.3.2.2 Manufacturers 3D IC and 2.5D IC Packaging Product Offered
        • 2.3.2.3 Date of Manufacturers Enter into 3D IC and 2.5D IC Packaging Market
    • 2.4 Key Trends for 3D IC and 2.5D IC Packaging Markets & Products

    3 Market Size by Manufacturers

    • 3.1 3D IC and 2.5D IC Packaging Production by Manufacturers
      • 3.1.1 3D IC and 2.5D IC Packaging Production by Manufacturers
      • 3.1.2 3D IC and 2.5D IC Packaging Production Market Share by Manufacturers
    • 3.2 3D IC and 2.5D IC Packaging Revenue by Manufacturers
      • 3.2.1 3D IC and 2.5D IC Packaging Revenue by Manufacturers (2014-2019)
      • 3.2.2 3D IC and 2.5D IC Packaging Revenue Share by Manufacturers (2014-2019)
    • 3.3 3D IC and 2.5D IC Packaging Price by Manufacturers
    • 3.4 Mergers & Acquisitions, Expansion Plans

    4 3D IC and 2.5D IC Packaging Production by Regions

    • 4.1 Global 3D IC and 2.5D IC Packaging Production by Regions
      • 4.1.1 Global 3D IC and 2.5D IC Packaging Production Market Share by Regions
      • 4.1.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Regions
    • 4.2 United States
      • 4.2.1 United States 3D IC and 2.5D IC Packaging Production
      • 4.2.2 United States 3D IC and 2.5D IC Packaging Revenue
      • 4.2.3 Key Players in United States
      • 4.2.4 United States 3D IC and 2.5D IC Packaging Import & Export
    • 4.3 Europe
      • 4.3.1 Europe 3D IC and 2.5D IC Packaging Production
      • 4.3.2 Europe 3D IC and 2.5D IC Packaging Revenue
      • 4.3.3 Key Players in Europe
      • 4.3.4 Europe 3D IC and 2.5D IC Packaging Import & Export
    • 4.4 China
      • 4.4.1 China 3D IC and 2.5D IC Packaging Production
      • 4.4.2 China 3D IC and 2.5D IC Packaging Revenue
      • 4.4.3 Key Players in China
      • 4.4.4 China 3D IC and 2.5D IC Packaging Import & Export
    • 4.5 Japan
      • 4.5.1 Japan 3D IC and 2.5D IC Packaging Production
      • 4.5.2 Japan 3D IC and 2.5D IC Packaging Revenue
      • 4.5.3 Key Players in Japan
      • 4.5.4 Japan 3D IC and 2.5D IC Packaging Import & Export
    • 4.6 South Korea
      • 4.6.1 South Korea 3D IC and 2.5D IC Packaging Production
      • 4.6.2 South Korea 3D IC and 2.5D IC Packaging Revenue
      • 4.6.3 Key Players in South Korea
      • 4.6.4 South Korea 3D IC and 2.5D IC Packaging Import & Export
    • 4.7 Other Regions
      • 4.7.1 Taiwan
      • 4.7.2 India
      • 4.7.3 Southeast Asia

    5 3D IC and 2.5D IC Packaging Consumption by Regions

    • 5.1 Global 3D IC and 2.5D IC Packaging Consumption by Regions
      • 5.1.1 Global 3D IC and 2.5D IC Packaging Consumption by Regions
      • 5.1.2 Global 3D IC and 2.5D IC Packaging Consumption Market Share by Regions
    • 5.2 North America
      • 5.2.1 North America 3D IC and 2.5D IC Packaging Consumption by Application
      • 5.2.2 North America 3D IC and 2.5D IC Packaging Consumption by Countries
      • 5.2.3 United States
      • 5.2.4 Canada
      • 5.2.5 Mexico
    • 5.3 Europe
      • 5.3.1 Europe 3D IC and 2.5D IC Packaging Consumption by Application
      • 5.3.2 Europe 3D IC and 2.5D IC Packaging Consumption by Countries
      • 5.3.3 Germany
      • 5.3.4 France
      • 5.3.5 UK
      • 5.3.6 Italy
      • 5.3.7 Russia
    • 5.4 Asia Pacific
      • 5.4.1 Asia Pacific 3D IC and 2.5D IC Packaging Consumption by Application
      • 5.4.2 Asia Pacific 3D IC and 2.5D IC Packaging Consumption by Countries
      • 5.4.3 China
      • 5.4.4 Japan
      • 5.4.5 South Korea
      • 5.4.6 India
      • 5.4.7 Australia
      • 5.4.8 Indonesia
      • 5.4.9 Thailand
      • 5.4.10 Malaysia
      • 5.4.11 Philippines
      • 5.4.12 Vietnam
    • 5.5 Central & South America
      • 5.5.1 Central & South America 3D IC and 2.5D IC Packaging Consumption by Application
      • 5.5.2 Central & South America 3D IC and 2.5D IC Packaging Consumption by Country
      • 5.5.3 Brazil
    • 5.6 Middle East and Africa
      • 5.6.1 Middle East and Africa 3D IC and 2.5D IC Packaging Consumption by Application
      • 5.6.2 Middle East and Africa 3D IC and 2.5D IC Packaging Consumption by Countries
      • 5.6.3 GCC Countries
      • 5.6.4 Egypt
      • 5.6.5 South Africa

    6 Market Size by Type

    • 6.1 Global 3D IC and 2.5D IC Packaging Production by Type
    • 6.2 Global 3D IC and 2.5D IC Packaging Revenue by Type
    • 6.3 3D IC and 2.5D IC Packaging Price by Type

    7 Market Size by Application

    • 7.1 Overview
    • 7.2 Global 3D IC and 2.5D IC Packaging Breakdown Dada by Application
      • 7.2.1 Global 3D IC and 2.5D IC Packaging Consumption by Application
      • 7.2.2 Global 3D IC and 2.5D IC Packaging Consumption Market Share by Application (2014-2019)

    8 Manufacturers Profiles

    • 8.1 Taiwan Semiconductor
      • 8.1.1 Taiwan Semiconductor Company Details
      • 8.1.2 Company Overview
      • 8.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.1.4 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product Description
      • 8.1.5 Taiwan Semiconductor Recent Development
    • 8.2 Samsung Electronics
      • 8.2.1 Samsung Electronics Company Details
      • 8.2.2 Company Overview
      • 8.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.2.4 Samsung Electronics 3D IC and 2.5D IC Packaging Product Description
      • 8.2.5 Samsung Electronics Recent Development
    • 8.3 Toshiba Corp
      • 8.3.1 Toshiba Corp Company Details
      • 8.3.2 Company Overview
      • 8.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.3.4 Toshiba Corp 3D IC and 2.5D IC Packaging Product Description
      • 8.3.5 Toshiba Corp Recent Development
    • 8.4 Advanced Semiconductor Engineering
      • 8.4.1 Advanced Semiconductor Engineering Company Details
      • 8.4.2 Company Overview
      • 8.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.4.4 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product Description
      • 8.4.5 Advanced Semiconductor Engineering Recent Development
    • 8.5 Amkor Technology
      • 8.5.1 Amkor Technology Company Details
      • 8.5.2 Company Overview
      • 8.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Production Revenue and Gross Margin (2014-2019)
      • 8.5.4 Amkor Technology 3D IC and 2.5D IC Packaging Product Description
      • 8.5.5 Amkor Technology Recent Development

    9 Production Forecasts

    • 9.1 3D IC and 2.5D IC Packaging Production and Revenue Forecast
      • 9.1.1 Global 3D IC and 2.5D IC Packaging Production Forecast 2019-2025
      • 9.1.2 Global 3D IC and 2.5D IC Packaging Revenue Forecast 2019-2025
    • 9.2 3D IC and 2.5D IC Packaging Production and Revenue Forecast by Regions
      • 9.2.1 Global 3D IC and 2.5D IC Packaging Revenue Forecast by Regions
      • 9.2.2 Global 3D IC and 2.5D IC Packaging Production Forecast by Regions
    • 9.3 3D IC and 2.5D IC Packaging Key Producers Forecast
      • 9.3.1 United States
      • 9.3.2 Europe
      • 9.3.3 China
      • 9.3.4 Japan
      • 9.3.5 South Korea
    • 9.4 Forecast by Type
      • 9.4.1 Global 3D IC and 2.5D IC Packaging Production Forecast by Type
      • 9.4.2 Global 3D IC and 2.5D IC Packaging Revenue Forecast by Type

    10 Consumption Forecast

    • 10.1 3D IC and 2.5D IC Packaging Consumption Forecast by Application
    • 10.2 3D IC and 2.5D IC Packaging Consumption Forecast by Regions
    • 10.3 North America Market Consumption Forecast
      • 10.3.1 North America 3D IC and 2.5D IC Packaging Consumption Forecast by Regions 2019-2025
      • 10.3.2 United States
      • 10.3.3 Canada
      • 10.3.4 Mexico
    • 10.4 Europe Market Consumption Forecast
      • 10.4.1 Europe 3D IC and 2.5D IC Packaging Consumption Forecast by Regions 2019-2025
      • 10.4.2 Germany
      • 10.4.3 France
      • 10.4.4 UK
      • 10.4.5 Italy
      • 10.4.6 Russia
    • 10.5 Asia Pacific Market Consumption Forecast
      • 10.5.1 Asia Pacific 3D IC and 2.5D IC Packaging Consumption Forecast by Regions 2019-2025
      • 10.5.2 China
      • 10.5.3 Japan
      • 10.5.4 South Korea
      • 10.5.5 India
      • 10.5.6 Australia
      • 10.5.7 Indonesia
      • 10.5.8 Thailand
      • 10.5.9 Malaysia
      • 10.5.10 Philippines
      • 10.5.11 Vietnam
    • 10.6 Central & South America Market Consumption Forecast
      • 10.6.1 Central & South America 3D IC and 2.5D IC Packaging Consumption Forecast by Regions 2019-2025
      • 10.6.2 Brazil
    • 10.7 Middle East and Africa Market Consumption Forecast
      • 10.7.1 Middle East and Africa 3D IC and 2.5D IC Packaging Consumption Forecast by Regions 2019-2025
      • 10.7.2 GCC Countries
      • 10.7.3 Egypt
      • 10.7.4 South Africa

    11 Value Chain and Sales Channels Analysis

    • 11.1 Value Chain Analysis
    • 11.2 Sales Channels Analysis
      • 11.2.1 3D IC and 2.5D IC Packaging Sales Channels
      • 11.2.2 3D IC and 2.5D IC Packaging Distributors
    • 11.3 3D IC and 2.5D IC Packaging Customers

    12 Market Opportunities & Challenges, Risks and Influences Factors Analysis

    • 12.1 Market Opportunities and Drivers
    • 12.2 Market Challenges
    • 12.3 Market Risks/Restraints

    13 Key Findings in the Global 3D IC and 2.5D IC Packaging Study

      14 Appendix

      • 14.1 Research Methodology
        • 14.1.1 Methodology/Research Approach
          • 14.1.1.1 Research Programs/Design
          • 14.1.1.2 Market Size Estimation
          • 14.1.1.3 Market Breakdown and Data Triangulation
        • 14.1.2 Data Source
          • 14.1.2.1 Secondary Sources
          • 14.1.2.2 Primary Sources
      • 14.2 Author Details

      The 3D IC and 2.5D IC Packaging market was valued at Million US$ in 2018 and is projected to reach Million US$ by 2025, at a CAGR of during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D IC and 2.5D IC Packaging.

      This report presents the worldwide 3D IC and 2.5D IC Packaging market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
      This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

      The following manufacturers are covered in this report:
      Taiwan Semiconductor
      Samsung Electronics
      Toshiba Corp
      Advanced Semiconductor Engineering
      Amkor Technology

      3D IC and 2.5D IC Packaging Breakdown Data by Type
      3D wafer-level chip-scale packaging
      3D TSV
      2.5D
      3D IC and 2.5D IC Packaging Breakdown Data by Application
      Logic
      Imaging & optoelectronics
      Memory
      MEMS/sensors
      LED
      Power

      3D IC and 2.5D IC Packaging Production by Region
      United States
      Europe
      China
      Japan
      South Korea
      Other Regions

      3D IC and 2.5D IC Packaging Consumption by Region
      North America
      United States
      Canada
      Mexico
      Asia-Pacific
      China
      India
      Japan
      South Korea
      Australia
      Indonesia
      Malaysia
      Philippines
      Thailand
      Vietnam
      Europe
      Germany
      France
      UK
      Italy
      Russia
      Rest of Europe
      Central & South America
      Brazil
      Rest of South America
      Middle East & Africa
      GCC Countries
      Turkey
      Egypt
      South Africa
      Rest of Middle East & Africa

      The study objectives are:
      To analyze and research the global 3D IC and 2.5D IC Packaging status and future forecast，involving, production, revenue, consumption, historical and forecast.
      To present the key 3D IC and 2.5D IC Packaging manufacturers, production, revenue, market share, and recent development.
      To split the breakdown data by regions, type, manufacturers and applications.
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions.
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

      In this study, the years considered to estimate the market size of 3D IC and 2.5D IC Packaging :
      History Year: 2014 - 2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year: 2019 - 2025

      This report includes the estimation of market size for value (million USD) and volume (Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of 3D IC and 2.5D IC Packaging market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

      For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

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