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Global 3D IC & 2.5D IC Packaging Market Professional Survey Report 2019

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Table of Contents

    Executive Summary

      1 Industry Overview of 3D IC & 2.5D IC Packaging

      • 1.1 Definition of 3D IC & 2.5D IC Packaging
      • 1.2 3D IC & 2.5D IC Packaging Segment by Type
        • 1.2.1 Global 3D IC & 2.5D IC Packaging Production Growth Rate Comparison by Types (2014-2025)
        • 1.2.2 3D TSV
        • 1.2.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
      • 1.3 3D IC & 2.5D IC Packaging Segment by Applications
        • 1.3.1 Global 3D IC & 2.5D IC Packaging Consumption Comparison by Applications (2014-2025)
        • 1.3.2 Automotive
        • 1.3.3 Consumer electronics
        • 1.3.4 Medical devices
        • 1.3.5 Military & aerospace
        • 1.3.6 Telecommunication
        • 1.3.7 Industrial sector and smart technologies
      • 1.4 Global 3D IC & 2.5D IC Packaging Overall Market
        • 1.4.1 Global 3D IC & 2.5D IC Packaging Revenue (2014-2025)
        • 1.4.2 Global 3D IC & 2.5D IC Packaging Production (2014-2025)
        • 1.4.3 North America 3D IC & 2.5D IC Packaging Status and Prospect (2014-2025)
        • 1.4.4 Europe 3D IC & 2.5D IC Packaging Status and Prospect (2014-2025)
        • 1.4.5 China 3D IC & 2.5D IC Packaging Status and Prospect (2014-2025)
        • 1.4.6 Japan 3D IC & 2.5D IC Packaging Status and Prospect (2014-2025)
        • 1.4.7 Southeast Asia 3D IC & 2.5D IC Packaging Status and Prospect (2014-2025)
        • 1.4.8 India 3D IC & 2.5D IC Packaging Status and Prospect (2014-2025)

      2 Manufacturing Cost Structure Analysis

      • 2.1 Raw Material and Suppliers
      • 2.2 Manufacturing Cost Structure Analysis of 3D IC & 2.5D IC Packaging
      • 2.3 Manufacturing Process Analysis of 3D IC & 2.5D IC Packaging
      • 2.4 Industry Chain Structure of 3D IC & 2.5D IC Packaging

      3 Development and Manufacturing Plants Analysis of 3D IC & 2.5D IC Packaging

      • 3.1 Capacity and Commercial Production Date
      • 3.2 Global 3D IC & 2.5D IC Packaging Manufacturing Plants Distribution
      • 3.3 Major Manufacturers Technology Source and Market Position of 3D IC & 2.5D IC Packaging
      • 3.4 Recent Development and Expansion Plans

      4 Key Figures of Major Manufacturers

      • 4.1 3D IC & 2.5D IC Packaging Production and Capacity Analysis
      • 4.2 3D IC & 2.5D IC Packaging Revenue Analysis
      • 4.3 3D IC & 2.5D IC Packaging Price Analysis
      • 4.4 Market Concentration Degree

      5 3D IC & 2.5D IC Packaging Regional Market Analysis

      • 5.1 3D IC & 2.5D IC Packaging Production by Regions
        • 5.1.1 Global 3D IC & 2.5D IC Packaging Production by Regions
        • 5.1.2 Global 3D IC & 2.5D IC Packaging Revenue by Regions
      • 5.2 3D IC & 2.5D IC Packaging Consumption by Regions
      • 5.3 North America 3D IC & 2.5D IC Packaging Market Analysis
        • 5.3.1 North America 3D IC & 2.5D IC Packaging Production
        • 5.3.2 North America 3D IC & 2.5D IC Packaging Revenue
        • 5.3.3 Key Manufacturers in North America
        • 5.3.4 North America 3D IC & 2.5D IC Packaging Import and Export
      • 5.4 Europe 3D IC & 2.5D IC Packaging Market Analysis
        • 5.4.1 Europe 3D IC & 2.5D IC Packaging Production
        • 5.4.2 Europe 3D IC & 2.5D IC Packaging Revenue
        • 5.4.3 Key Manufacturers in Europe
        • 5.4.4 Europe 3D IC & 2.5D IC Packaging Import and Export
      • 5.5 China 3D IC & 2.5D IC Packaging Market Analysis
        • 5.5.1 China 3D IC & 2.5D IC Packaging Production
        • 5.5.2 China 3D IC & 2.5D IC Packaging Revenue
        • 5.5.3 Key Manufacturers in China
        • 5.5.4 China 3D IC & 2.5D IC Packaging Import and Export
      • 5.6 Japan 3D IC & 2.5D IC Packaging Market Analysis
        • 5.6.1 Japan 3D IC & 2.5D IC Packaging Production
        • 5.6.2 Japan 3D IC & 2.5D IC Packaging Revenue
        • 5.6.3 Key Manufacturers in Japan
        • 5.6.4 Japan 3D IC & 2.5D IC Packaging Import and Export
      • 5.7 Southeast Asia 3D IC & 2.5D IC Packaging Market Analysis
        • 5.7.1 Southeast Asia 3D IC & 2.5D IC Packaging Production
        • 5.7.2 Southeast Asia 3D IC & 2.5D IC Packaging Revenue
        • 5.7.3 Key Manufacturers in Southeast Asia
        • 5.7.4 Southeast Asia 3D IC & 2.5D IC Packaging Import and Export
      • 5.8 India 3D IC & 2.5D IC Packaging Market Analysis
        • 5.8.1 India 3D IC & 2.5D IC Packaging Production
        • 5.8.2 India 3D IC & 2.5D IC Packaging Revenue
        • 5.8.3 Key Manufacturers in India
        • 5.8.4 India 3D IC & 2.5D IC Packaging Import and Export

      6 3D IC & 2.5D IC Packaging Segment Market Analysis (by Type)

      • 6.1 Global 3D IC & 2.5D IC Packaging Production by Type
      • 6.2 Global 3D IC & 2.5D IC Packaging Revenue by Type
      • 6.3 3D IC & 2.5D IC Packaging Price by Type

      7 3D IC & 2.5D IC Packaging Segment Market Analysis (by Application)

      • 7.1 Global 3D IC & 2.5D IC Packaging Consumption by Application
      • 7.2 Global 3D IC & 2.5D IC Packaging Consumption Market Share by Application (2014-2019)

      8 3D IC & 2.5D IC Packaging Major Manufacturers Analysis

      • 8.1 Intel Corporation
        • 8.1.1 Intel Corporation 3D IC & 2.5D IC Packaging Production Sites and Area Served
        • 8.1.2 Intel Corporation Product Introduction, Application and Specification
        • 8.1.3 Intel Corporation 3D IC & 2.5D IC Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.1.4 Main Business and Markets Served
      • 8.2 Toshiba Corp
        • 8.2.1 Toshiba Corp 3D IC & 2.5D IC Packaging Production Sites and Area Served
        • 8.2.2 Toshiba Corp Product Introduction, Application and Specification
        • 8.2.3 Toshiba Corp 3D IC & 2.5D IC Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.2.4 Main Business and Markets Served
      • 8.3 Samsung Electronics
        • 8.3.1 Samsung Electronics 3D IC & 2.5D IC Packaging Production Sites and Area Served
        • 8.3.2 Samsung Electronics Product Introduction, Application and Specification
        • 8.3.3 Samsung Electronics 3D IC & 2.5D IC Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.3.4 Main Business and Markets Served
      • 8.4 Stmicroelectronics
        • 8.4.1 Stmicroelectronics 3D IC & 2.5D IC Packaging Production Sites and Area Served
        • 8.4.2 Stmicroelectronics Product Introduction, Application and Specification
        • 8.4.3 Stmicroelectronics 3D IC & 2.5D IC Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.4.4 Main Business and Markets Served
      • 8.5 Taiwan Semiconductor Manufacturing
        • 8.5.1 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Production Sites and Area Served
        • 8.5.2 Taiwan Semiconductor Manufacturing Product Introduction, Application and Specification
        • 8.5.3 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.5.4 Main Business and Markets Served
      • 8.6 Amkor Technology
        • 8.6.1 Amkor Technology 3D IC & 2.5D IC Packaging Production Sites and Area Served
        • 8.6.2 Amkor Technology Product Introduction, Application and Specification
        • 8.6.3 Amkor Technology 3D IC & 2.5D IC Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.6.4 Main Business and Markets Served
      • 8.7 United Microelectronics
        • 8.7.1 United Microelectronics 3D IC & 2.5D IC Packaging Production Sites and Area Served
        • 8.7.2 United Microelectronics Product Introduction, Application and Specification
        • 8.7.3 United Microelectronics 3D IC & 2.5D IC Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.7.4 Main Business and Markets Served
      • 8.8 Broadcom
        • 8.8.1 Broadcom 3D IC & 2.5D IC Packaging Production Sites and Area Served
        • 8.8.2 Broadcom Product Introduction, Application and Specification
        • 8.8.3 Broadcom 3D IC & 2.5D IC Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.8.4 Main Business and Markets Served
      • 8.9 ASE Group
        • 8.9.1 ASE Group 3D IC & 2.5D IC Packaging Production Sites and Area Served
        • 8.9.2 ASE Group Product Introduction, Application and Specification
        • 8.9.3 ASE Group 3D IC & 2.5D IC Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.9.4 Main Business and Markets Served
      • 8.10 Pure Storage
        • 8.10.1 Pure Storage 3D IC & 2.5D IC Packaging Production Sites and Area Served
        • 8.10.2 Pure Storage Product Introduction, Application and Specification
        • 8.10.3 Pure Storage 3D IC & 2.5D IC Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.10.4 Main Business and Markets Served
      • 8.11 Advanced Semiconductor Engineering

      9 Development Trend of Analysis of 3D IC & 2.5D IC Packaging Market

      • 9.1 Global 3D IC & 2.5D IC Packaging Market Trend Analysis
        • 9.1.1 Global 3D IC & 2.5D IC Packaging Market Size (Volume and Value) Forecast 2019-2025
      • 9.2 3D IC & 2.5D IC Packaging Regional Market Trend
        • 9.2.1 North America 3D IC & 2.5D IC Packaging Forecast 2019-2025
        • 9.2.2 Europe 3D IC & 2.5D IC Packaging Forecast 2019-2025
        • 9.2.3 China 3D IC & 2.5D IC Packaging Forecast 2019-2025
        • 9.2.4 Japan 3D IC & 2.5D IC Packaging Forecast 2019-2025
        • 9.2.5 Southeast Asia 3D IC & 2.5D IC Packaging Forecast 2019-2025
        • 9.2.6 India 3D IC & 2.5D IC Packaging Forecast 2019-2025
      • 9.3 3D IC & 2.5D IC Packaging Market Trend (Product Type)
      • 9.4 3D IC & 2.5D IC Packaging Market Trend (Application)
      • 10.1 Marketing Channel
        • 10.1.1 Direct Marketing
        • 10.1.2 Indirect Marketing
      • 10.3 3D IC & 2.5D IC Packaging Customers

      11 Market Dynamics

      • 11.1 Market Trends
      • 11.2 Opportunities
      • 11.3 Market Drivers
      • 11.4 Challenges
      • 11.5 Influence Factors

      12 Conclusion

        13 Appendix

        • 13.1 Methodology/Research Approach
          • 13.1.1 Research Programs/Design
          • 13.1.2 Market Size Estimation
          • 13.1.3 Market Breakdown and Data Triangulation
        • 13.2 Data Source
          • 13.2.1 Secondary Sources
          • 13.2.2 Primary Sources
        • 13.3 Author List

        2.5D interposer is also a 3D WLP that interconnects die side-side on a silicon, glass or organic interposer using TSVs and RDL. In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board.
        3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers.
        The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.
        In terms of Technology, the market is categorised into 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP).
        Depending on Application, the market is classified into MEMS/Sensors, logic, imaging & optoelectronics, power, analog & mixed signal, RF, photonics, memory and LED.

        The global 3D IC & 2.5D IC Packaging market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
        This report focuses on 3D IC & 2.5D IC Packaging volume and value at global level, regional level and company level. From a global perspective, this report represents overall 3D IC & 2.5D IC Packaging market size by analyzing historical data and future prospect.
        Regionally, this report categorizes the production, apparent consumption, export and import of 3D IC & 2.5D IC Packaging in North America, Europe, China, Japan, Southeast Asia and India.
        For each manufacturer covered, this report analyzes their 3D IC & 2.5D IC Packaging manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

        The following manufacturers are covered:
        Intel Corporation
        Toshiba Corp
        Samsung Electronics
        Stmicroelectronics
        Taiwan Semiconductor Manufacturing
        Amkor Technology
        United Microelectronics
        Broadcom
        ASE Group
        Pure Storage
        Advanced Semiconductor Engineering

        Segment by Regions
        North America
        Europe
        China
        Japan
        Southeast Asia
        India

        Segment by Type
        3D TSV
        2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

        Segment by Application
        Automotive
        Consumer electronics
        Medical devices
        Military & aerospace
        Telecommunication
        Industrial sector and smart technologies

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