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Global (United States, European Union and China) 3D IC & 2.5D IC Packaging Market Research Report 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global 3D IC & 2.5D IC Packaging Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 3D TSV
      • 1.3.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
    • 1.4 Market Segment by Application
      • 1.4.1 Global 3D IC & 2.5D IC Packaging Market Share by Application (2019-2025)
      • 1.4.2 Automotive
      • 1.4.3 Consumer electronics
      • 1.4.4 Medical devices
      • 1.4.5 Military & aerospace
      • 1.4.6 Telecommunication
      • 1.4.7 Industrial sector and smart technologies
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global 3D IC & 2.5D IC Packaging Production Value 2014-2025
      • 2.1.2 Global 3D IC & 2.5D IC Packaging Production 2014-2025
      • 2.1.3 Global 3D IC & 2.5D IC Packaging Capacity 2014-2025
      • 2.1.4 Global 3D IC & 2.5D IC Packaging Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global 3D IC & 2.5D IC Packaging Market Size CAGR of Key Regions
      • 2.2.2 Global 3D IC & 2.5D IC Packaging Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global 3D IC & 2.5D IC Packaging Capacity by Manufacturers
      • 3.1.2 Global 3D IC & 2.5D IC Packaging Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 3D IC & 2.5D IC Packaging Revenue by Manufacturers (2014-2019)
      • 3.2.2 3D IC & 2.5D IC Packaging Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global 3D IC & 2.5D IC Packaging Market Concentration Ratio (CR5 and HHI)
    • 3.3 3D IC & 2.5D IC Packaging Price by Manufacturers
    • 3.4 Key Manufacturers 3D IC & 2.5D IC Packaging Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into 3D IC & 2.5D IC Packaging Market
    • 3.6 Key Manufacturers 3D IC & 2.5D IC Packaging Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 3D TSV Production and Production Value (2014-2019)
      • 4.1.2 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) Production and Production Value (2014-2019)
    • 4.2 Global 3D IC & 2.5D IC Packaging Production Market Share by Type
    • 4.3 Global 3D IC & 2.5D IC Packaging Production Value Market Share by Type
    • 4.4 3D IC & 2.5D IC Packaging Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global 3D IC & 2.5D IC Packaging Consumption by Application

    6 Production by Regions

    • 6.1 Global 3D IC & 2.5D IC Packaging Production (History Data) by Regions 2014-2019
    • 6.2 Global 3D IC & 2.5D IC Packaging Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019
      • 6.3.2 United States 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States 3D IC & 2.5D IC Packaging Import & Export
    • 6.4 European Union
      • 6.4.1 European Union 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019
      • 6.4.2 European Union 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union 3D IC & 2.5D IC Packaging Import & Export
    • 6.5 China
      • 6.5.1 China 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019
      • 6.5.2 China 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China 3D IC & 2.5D IC Packaging Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 3D IC & 2.5D IC Packaging Consumption by Regions

    • 7.1 Global 3D IC & 2.5D IC Packaging Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States 3D IC & 2.5D IC Packaging Consumption by Type
      • 7.2.2 United States 3D IC & 2.5D IC Packaging Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union 3D IC & 2.5D IC Packaging Consumption by Type
      • 7.3.2 European Union 3D IC & 2.5D IC Packaging Consumption by Application
    • 7.4 China
      • 7.4.1 China 3D IC & 2.5D IC Packaging Consumption by Type
      • 7.4.2 China 3D IC & 2.5D IC Packaging Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World 3D IC & 2.5D IC Packaging Consumption by Type
      • 7.5.2 Rest of World 3D IC & 2.5D IC Packaging Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 Intel Corporation
      • 8.1.1 Intel Corporation Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of 3D IC & 2.5D IC Packaging
      • 8.1.4 3D IC & 2.5D IC Packaging Product Introduction
      • 8.1.5 Intel Corporation Recent Development
    • 8.2 Toshiba Corp
      • 8.2.1 Toshiba Corp Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of 3D IC & 2.5D IC Packaging
      • 8.2.4 3D IC & 2.5D IC Packaging Product Introduction
      • 8.2.5 Toshiba Corp Recent Development
    • 8.3 Samsung Electronics
      • 8.3.1 Samsung Electronics Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of 3D IC & 2.5D IC Packaging
      • 8.3.4 3D IC & 2.5D IC Packaging Product Introduction
      • 8.3.5 Samsung Electronics Recent Development
    • 8.4 Stmicroelectronics
      • 8.4.1 Stmicroelectronics Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of 3D IC & 2.5D IC Packaging
      • 8.4.4 3D IC & 2.5D IC Packaging Product Introduction
      • 8.4.5 Stmicroelectronics Recent Development
    • 8.5 Taiwan Semiconductor Manufacturing
      • 8.5.1 Taiwan Semiconductor Manufacturing Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of 3D IC & 2.5D IC Packaging
      • 8.5.4 3D IC & 2.5D IC Packaging Product Introduction
      • 8.5.5 Taiwan Semiconductor Manufacturing Recent Development
    • 8.6 Amkor Technology
      • 8.6.1 Amkor Technology Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of 3D IC & 2.5D IC Packaging
      • 8.6.4 3D IC & 2.5D IC Packaging Product Introduction
      • 8.6.5 Amkor Technology Recent Development
    • 8.7 United Microelectronics
      • 8.7.1 United Microelectronics Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of 3D IC & 2.5D IC Packaging
      • 8.7.4 3D IC & 2.5D IC Packaging Product Introduction
      • 8.7.5 United Microelectronics Recent Development
    • 8.8 Broadcom
      • 8.8.1 Broadcom Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of 3D IC & 2.5D IC Packaging
      • 8.8.4 3D IC & 2.5D IC Packaging Product Introduction
      • 8.8.5 Broadcom Recent Development
    • 8.9 ASE Group
      • 8.9.1 ASE Group Company Details
      • 8.9.2 Company Description and Business Overview
      • 8.9.3 Production and Revenue of 3D IC & 2.5D IC Packaging
      • 8.9.4 3D IC & 2.5D IC Packaging Product Introduction
      • 8.9.5 ASE Group Recent Development
    • 8.10 Pure Storage
      • 8.10.1 Pure Storage Company Details
      • 8.10.2 Company Description and Business Overview
      • 8.10.3 Production and Revenue of 3D IC & 2.5D IC Packaging
      • 8.10.4 3D IC & 2.5D IC Packaging Product Introduction
      • 8.10.5 Pure Storage Recent Development
    • 8.11 Advanced Semiconductor Engineering

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global 3D IC & 2.5D IC Packaging Capacity, Production Forecast 2019-2025
      • 9.1.2 Global 3D IC & 2.5D IC Packaging Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global 3D IC & 2.5D IC Packaging Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global 3D IC & 2.5D IC Packaging Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global 3D IC & 2.5D IC Packaging Production Forecast by Type
      • 9.7.2 Global 3D IC & 2.5D IC Packaging Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 3D IC & 2.5D IC Packaging Sales Channels
      • 10.2.2 3D IC & 2.5D IC Packaging Distributors
    • 10.3 3D IC & 2.5D IC Packaging Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      2.5D interposer is also a 3D WLP that interconnects die side-side on a silicon, glass or organic interposer using TSVs and RDL. In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board.
      3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers.
      The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.
      In terms of Technology, the market is categorised into 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP).
      Depending on Application, the market is classified into MEMS/Sensors, logic, imaging & optoelectronics, power, analog & mixed signal, RF, photonics, memory and LED.
      In 2019, the market size of 3D IC & 2.5D IC Packaging is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D IC & 2.5D IC Packaging.

      This report studies the global market size of 3D IC & 2.5D IC Packaging, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the 3D IC & 2.5D IC Packaging production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      Intel Corporation
      Toshiba Corp
      Samsung Electronics
      Stmicroelectronics
      Taiwan Semiconductor Manufacturing
      Amkor Technology
      United Microelectronics
      Broadcom
      ASE Group
      Pure Storage
      Advanced Semiconductor Engineering

      Market Segment by Product Type
      3D TSV
      2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

      Market Segment by Application
      Automotive
      Consumer electronics
      Medical devices
      Military & aerospace
      Telecommunication
      Industrial sector and smart technologies

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the 3D IC & 2.5D IC Packaging status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key 3D IC & 2.5D IC Packaging manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of 3D IC & 2.5D IC Packaging are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

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