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Global (United States, European Union and China) 2.5D IC Flip Chip Product Market Research Report 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global 2.5D IC Flip Chip Product Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 Copper Pillar
      • 1.3.3 Solder Bumping
      • 1.3.4 Tin-lead eutectic solder
      • 1.3.5 Lead-free solder
      • 1.3.6 Gold Bumping
      • 1.3.7 Others
    • 1.4 Market Segment by Application
      • 1.4.1 Global 2.5D IC Flip Chip Product Market Share by Application (2019-2025)
      • 1.4.2 Electronics
      • 1.4.3 Industrial
      • 1.4.4 Automotive & Transport
      • 1.4.5 Healthcare
      • 1.4.6 IT & Telecommunication
      • 1.4.7 Aerospace and Defense
      • 1.4.8 Others
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global 2.5D IC Flip Chip Product Production Value 2014-2025
      • 2.1.2 Global 2.5D IC Flip Chip Product Production 2014-2025
      • 2.1.3 Global 2.5D IC Flip Chip Product Capacity 2014-2025
      • 2.1.4 Global 2.5D IC Flip Chip Product Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global 2.5D IC Flip Chip Product Market Size CAGR of Key Regions
      • 2.2.2 Global 2.5D IC Flip Chip Product Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global 2.5D IC Flip Chip Product Capacity by Manufacturers
      • 3.1.2 Global 2.5D IC Flip Chip Product Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 2.5D IC Flip Chip Product Revenue by Manufacturers (2014-2019)
      • 3.2.2 2.5D IC Flip Chip Product Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global 2.5D IC Flip Chip Product Market Concentration Ratio (CR5 and HHI)
    • 3.3 2.5D IC Flip Chip Product Price by Manufacturers
    • 3.4 Key Manufacturers 2.5D IC Flip Chip Product Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into 2.5D IC Flip Chip Product Market
    • 3.6 Key Manufacturers 2.5D IC Flip Chip Product Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 Copper Pillar Production and Production Value (2014-2019)
      • 4.1.2 Solder Bumping Production and Production Value (2014-2019)
      • 4.1.3 Tin-lead eutectic solder Production and Production Value (2014-2019)
      • 4.1.4 Lead-free solder Production and Production Value (2014-2019)
      • 4.1.5 Gold Bumping Production and Production Value (2014-2019)
      • 4.1.6 Others Production and Production Value (2014-2019)
    • 4.2 Global 2.5D IC Flip Chip Product Production Market Share by Type
    • 4.3 Global 2.5D IC Flip Chip Product Production Value Market Share by Type
    • 4.4 2.5D IC Flip Chip Product Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global 2.5D IC Flip Chip Product Consumption by Application

    6 Production by Regions

    • 6.1 Global 2.5D IC Flip Chip Product Production (History Data) by Regions 2014-2019
    • 6.2 Global 2.5D IC Flip Chip Product Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States 2.5D IC Flip Chip Product Production Growth Rate 2014-2019
      • 6.3.2 United States 2.5D IC Flip Chip Product Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States 2.5D IC Flip Chip Product Import & Export
    • 6.4 European Union
      • 6.4.1 European Union 2.5D IC Flip Chip Product Production Growth Rate 2014-2019
      • 6.4.2 European Union 2.5D IC Flip Chip Product Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union 2.5D IC Flip Chip Product Import & Export
    • 6.5 China
      • 6.5.1 China 2.5D IC Flip Chip Product Production Growth Rate 2014-2019
      • 6.5.2 China 2.5D IC Flip Chip Product Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China 2.5D IC Flip Chip Product Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 2.5D IC Flip Chip Product Consumption by Regions

    • 7.1 Global 2.5D IC Flip Chip Product Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States 2.5D IC Flip Chip Product Consumption by Type
      • 7.2.2 United States 2.5D IC Flip Chip Product Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union 2.5D IC Flip Chip Product Consumption by Type
      • 7.3.2 European Union 2.5D IC Flip Chip Product Consumption by Application
    • 7.4 China
      • 7.4.1 China 2.5D IC Flip Chip Product Consumption by Type
      • 7.4.2 China 2.5D IC Flip Chip Product Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World 2.5D IC Flip Chip Product Consumption by Type
      • 7.5.2 Rest of World 2.5D IC Flip Chip Product Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 TSMC (Taiwan)
      • 8.1.1 TSMC (Taiwan) Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of 2.5D IC Flip Chip Product
      • 8.1.4 2.5D IC Flip Chip Product Product Introduction
      • 8.1.5 TSMC (Taiwan) Recent Development
    • 8.2 Samsung (South Korea)
      • 8.2.1 Samsung (South Korea) Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of 2.5D IC Flip Chip Product
      • 8.2.4 2.5D IC Flip Chip Product Product Introduction
      • 8.2.5 Samsung (South Korea) Recent Development
    • 8.3 ASE Group (Taiwan)
      • 8.3.1 ASE Group (Taiwan) Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of 2.5D IC Flip Chip Product
      • 8.3.4 2.5D IC Flip Chip Product Product Introduction
      • 8.3.5 ASE Group (Taiwan) Recent Development
    • 8.4 Amkor Technology (US)
      • 8.4.1 Amkor Technology (US) Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of 2.5D IC Flip Chip Product
      • 8.4.4 2.5D IC Flip Chip Product Product Introduction
      • 8.4.5 Amkor Technology (US) Recent Development
    • 8.5 UMC (Taiwan)
      • 8.5.1 UMC (Taiwan) Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of 2.5D IC Flip Chip Product
      • 8.5.4 2.5D IC Flip Chip Product Product Introduction
      • 8.5.5 UMC (Taiwan) Recent Development
    • 8.6 STATS ChipPAC (Singapore)
      • 8.6.1 STATS ChipPAC (Singapore) Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of 2.5D IC Flip Chip Product
      • 8.6.4 2.5D IC Flip Chip Product Product Introduction
      • 8.6.5 STATS ChipPAC (Singapore) Recent Development
    • 8.7 Powertech Technology (Taiwan)
      • 8.7.1 Powertech Technology (Taiwan) Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of 2.5D IC Flip Chip Product
      • 8.7.4 2.5D IC Flip Chip Product Product Introduction
      • 8.7.5 Powertech Technology (Taiwan) Recent Development
    • 8.8 STMicroelectronics (Switzerland)
      • 8.8.1 STMicroelectronics (Switzerland) Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of 2.5D IC Flip Chip Product
      • 8.8.4 2.5D IC Flip Chip Product Product Introduction
      • 8.8.5 STMicroelectronics (Switzerland) Recent Development

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global 2.5D IC Flip Chip Product Capacity, Production Forecast 2019-2025
      • 9.1.2 Global 2.5D IC Flip Chip Product Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global 2.5D IC Flip Chip Product Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global 2.5D IC Flip Chip Product Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global 2.5D IC Flip Chip Product Production Forecast by Type
      • 9.7.2 Global 2.5D IC Flip Chip Product Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 2.5D IC Flip Chip Product Sales Channels
      • 10.2.2 2.5D IC Flip Chip Product Distributors
    • 10.3 2.5D IC Flip Chip Product Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      Flip chip, also known as controlled collapse chip connection or its abbreviation, C4,is a method for interconnecting semiconductor devices
      In 2019, the market size of 2.5D IC Flip Chip Product is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 2.5D IC Flip Chip Product.

      This report studies the global market size of 2.5D IC Flip Chip Product, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the 2.5D IC Flip Chip Product production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      TSMC (Taiwan)
      Samsung (South Korea)
      ASE Group (Taiwan)
      Amkor Technology (US)
      UMC (Taiwan)
      STATS ChipPAC (Singapore)
      Powertech Technology (Taiwan)
      STMicroelectronics (Switzerland)

      Market Segment by Product Type
      Copper Pillar
      Solder Bumping
      Tin-lead eutectic solder
      Lead-free solder
      Gold Bumping
      Others

      Market Segment by Application
      Electronics
      Industrial
      Automotive & Transport
      Healthcare
      IT & Telecommunication
      Aerospace and Defense
      Others

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the 2.5D IC Flip Chip Product status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key 2.5D IC Flip Chip Product manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of 2.5D IC Flip Chip Product are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

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